TANIGUCHI; Kouhei

Patent Applications and Registrations

Patent applications and USPTO patent grants for TANIGUCHI; Kouhei.The latest application filed is for "semiconductor device having dolmen structure and method for manufacturing same".

Company Profile

0.16.5

TANIGUCHI; Kouhei - Chiyoda-ku Tokyo
Taniguchi; Kouhei - Ichihara JP
Taniguchi; Kouhei - Ichihara-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor Device Having Dolmen Structure And Method For Manufacturing Same App 20220157802 - HASHIMOTO; Shintaro ; et al.	2022-05-19
Flap in an adhesive tape for semiconductor manufacturing Grant D804,435 - Taniguchi , et al. December 5, 2	2017-12-05
Tape for processing wafer, method for manufacturing tape for processing Grant 9,190,309 - Taniguchi , et al. November 17, 2	2015-11-17
Tape For Processing Wafer, Method For Manufacturing Tape For Processing App 20150279717 - Taniguchi; Kouhei ; et al.	2015-10-01
Wafer processing tape, method of manufacturing wafer processing tape, and method of manufacturing semiconductor device Grant 9,076,832 - Taniguchi , et al. July 7, 2	2015-07-07
Tape for processing wafer, method for manufacturing tape for processing wafer, and method for manufacturing semiconductor device Grant 9,076,833 - Taniguchi , et al. July 7, 2	2015-07-07
Tape For Processing Wafer, Method For Manufacturing Tape For Processing Wafer, And Method For Manufacturing Semiconductor Device App 20130273718 - Taniguchi; Kouhei ; et al.	2013-10-17
Adhesive tape for semiconductor manufacturing Grant D690,278 - Taniguchi , et al. September 24, 2	2013-09-24
Adhesive tape for semiconductor manufacturing Grant D689,831 - Taniguchi , et al. September 17, 2	2013-09-17
Adhesive tape for semiconductor manufacturing Grant D680,505 - Taniguchi , et al. April 23, 2	2013-04-23
Adhesive tape for semiconductor manufacturing Grant D664,512 - Taniguchi , et al. July 31, 2	2012-07-31
Adhesive tape for semiconductor manufacturing Grant D664,511 - Taniguchi , et al. July 31, 2	2012-07-31
Wafer Processing Tape, Method Of Manufacturing Wafer Processing Tape, And Method Of Manufacturing Semiconductor Device App 20120094471 - TANIGUCHI; Kouhei ; et al.	2012-04-19
Adhesive tape for semiconductor manufacturing Grant D656,910 - Taniguchi , et al. April 3, 2	2012-04-03
Adhesive tape for semiconductor manufacturing Grant D656,909 - Taniguchi , et al. April 3, 2	2012-04-03

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