Adhesive tape for semiconductor manufacturing

Taniguchi , et al. April 23, 2

Patent Grant D680505

U.S. patent number D680,505 [Application Number D/413,509] was granted by the patent office on 2013-04-23 for adhesive tape for semiconductor manufacturing. This patent grant is currently assigned to Hitachi Chemical Company, Ltd.. The grantee listed for this patent is Rie Katou, Shinya Katou, Kouji Komorida, Michio Mashino, Takayuki Matsuzaki, Tatsuya Sakuta, Kouhei Taniguchi. Invention is credited to Rie Katou, Shinya Katou, Kouji Komorida, Michio Mashino, Takayuki Matsuzaki, Tatsuya Sakuta, Kouhei Taniguchi.


United States Patent D680,505
Taniguchi ,   et al. April 23, 2013

Adhesive tape for semiconductor manufacturing

Claims

CLAIM The ornamental design for an adhesive tape for semiconductor manufacturing, as shown and described.
Inventors: Taniguchi; Kouhei (Ichihara, JP), Matsuzaki; Takayuki (Ichihara, JP), Katou; Shinya (Ichihara, JP), Komorida; Kouji (Ichihara, JP), Mashino; Michio (Ichihara, JP), Sakuta; Tatsuya (Ichihara, JP), Katou; Rie (Ichihara, JP)
Applicant:
Name City State Country Type

Taniguchi; Kouhei
Matsuzaki; Takayuki
Katou; Shinya
Komorida; Kouji
Mashino; Michio
Sakuta; Tatsuya
Katou; Rie

Ichihara
Ichihara
Ichihara
Ichihara
Ichihara
Ichihara
Ichihara

N/A
N/A
N/A
N/A
N/A
N/A
N/A

JP
JP
JP
JP
JP
JP
JP
Assignee: Hitachi Chemical Company, Ltd. (Tokyo, JP)
Appl. No.: D/413,509
Filed: February 16, 2012

Related U.S. Patent Documents

Application Number Filing Date Patent Number Issue Date
29389788 Apr 15, 2011 D656909

Foreign Application Priority Data

Oct 15, 2010 [JP] D2010-024758
Oct 15, 2010 [JP] D2010-024759
Oct 15, 2010 [JP] D2010-024761
Current U.S. Class: D13/182; D19/69
Current International Class: 1303
Field of Search: ;D10/71 ;D19/69 ;D24/189 ;D5/99 ;33/494,758,562,759 ;101/288 ;206/390 ;40/638,641 ;428/43 ;D7/585 ;D20/22,42 ;D13/182

References Cited [Referenced By]

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Foreign Patent Documents
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Other References

Taniguchi et al., U.S. Appl. No. 29/389,790, filed Apr. 15, 2011. cited by applicant .
Taniguchi et al., U.S. Appl. No. 29/389,794, filed Apr. 15, 2011. cited by applicant .
Taniguchi et al., U.S. Appl. No. 29/389,797, filed Apr. 15, 2011. cited by applicant .
Taniguchi et al., U.S. Appl. No. 29/413,518, filed Feb. 16, 2012. cited by applicant .
Taniguchi et al., U.S. Appl. No. 29/413,548, filed Feb. 16, 2012. cited by applicant .
Taniguchi et al., U.S. Appl. No. 29/413,539, filed Feb. 16, 2012. cited by applicant .
Office Action dated Jan. 18, 2013, in Design U.S. Appl. No. 29/413,539. cited by applicant .
Office Action dated Jan. 29, 2013, in Design U.S. Appl. No. 29/413,548. cited by applicant .
Office Action dated Feb. 25, 2013, in Design U.S. Appl. No. 29/413,518. cited by applicant.

Primary Examiner: Murphy; Austin
Attorney, Agent or Firm: Miles & Stockbridge P.C.

Description



FIG. 1 is a top plan view of an adhesive tape for semiconductor manufacturing incorporating a first embodiment of our new design;

FIG. 2 is a bottom plan view of the adhesive tape of FIG. 1;

FIG. 3 is a rear side view of the adhesive tape of FIG. 1;

FIG. 4 is a front side view of the adhesive tape of FIG. 1;

FIG. 5 is a right side view of the adhesive tape of FIG. 1;

FIG. 6 is a left side view of the adhesive tape of FIG. 1;

FIG. 7 is a cross-sectional view taken at line VII-VII in FIG. 1;

FIG. 8 is a cross-sectional view taken at line VIII-VIII in FIG. 1;

FIG. 9 is an enlarged view of portion IX-IX in FIG. 7; and,

FIG. 10 is an enlarged view of portions X-X, XI-XI in FIG. 1.

The dashed line showing of the adhesive tape is for purposes of illustrating portions of the adhesive tape and forms no part of the claimed design.

The broken lines having alternating long and short segments define bounds of the claimed design and form no part thereof.

* * * * *


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