Dicing die-bonding film
Misumi , et al. August 21, 2
U.S. patent number D549,189 [Application Number D/225,423] was granted by the patent office on 2007-08-21 for dicing die-bonding film. This patent grant is currently assigned to Nitto Denko Corporation. Invention is credited to Takeshi Matsumura, Sadahito Misumi.
| United States Patent | D549,189 |
| Misumi , et al. | August 21, 2007 |
Dicing die-bonding film
Claims
CLAIM The ornamental design for a dicing die-bonding film, as shown and described.
| Inventors: | Misumi; Sadahito (Ibaraki, JP), Matsumura; Takeshi (Ibaraki, JP) |
|---|---|
| Assignee: | Nitto Denko Corporation (Osaka,
JP) |
| Appl. No.: | D/225,423 |
| Filed: | March 16, 2005 |
Foreign Application Priority Data
| Sep 21, 2004 [JP] | 2004-028520 | |||
| Current U.S. Class: | D13/182 |
| Current International Class: | 1303 |
| Field of Search: | ;D13/182 ;29/25.35 ;156/235 ;257/678,E21.505 ;310/340,366 ;438/113,460 |
References Cited [Referenced By]
U.S. Patent Documents
| 4961804 | October 1990 | Aurichio |
| 5844348 | December 1998 | Gamo |
| 6457220 | October 2002 | Hamano |
| 6977024 | December 2005 | Yamazaki et al. |
| 7054161 | May 2006 | James |
| 2003/0207479 | November 2003 | Border et al. |
| 2003/0226640 | December 2003 | Yamazaki et al. |
| 2005/0139973 | June 2005 | Matsumura et al. |
| 2005/0208736 | September 2005 | Matsumura et al. |
Attorney, Agent or Firm: Knobbe Martens Olson & Bear LLP
Description
FIG. 1 is a front view of a dicing die-bonding film showing our new design, it being understood that the cut away portion indicates that the film has an indeterminate length wherein the pattern is repeated uniformly throughout the length thereof.
FIG. 2 is a rear view thereof.
FIG. 3 is a top plan view thereof.
FIG. 4 is a bottom plan view thereof.
FIG. 5 is a left side view thereof; and,
FIG. 6 is a right side view thereof.
The article to which the design is applied is affixed to the rear side of a semiconductor wafer with a circuit pattern formed, is diced (cut) into specified sizes together with the semiconductor wafer, and is bonded (affixed) on to the circuit substrate as it is.
The present article is formed by exfoliatively interleaving light-transmitting resin with circular patterns at the widthwise center section as well as colored patterns on the periphery and transparent resin, and measures as a whole about 230 to 400 mm wide and about 10 to 100 .mu.m thick, with the circular patterns at the center about 160 to 310 mm in diameter, and is continuous horizontally only in "front view" and "rear view."
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