| Patent | Date |
|---|
Adhesive sheet for manufacturing semiconductor device, manufacturing method of semiconductor device using the sheet, and semiconductor device obtained by the method
Grant 9,153,556 - Matsumura , et al. October 6, 2 | 2015-10-06 |
Adhesive film, method of manufacturing semiconductor device, and semiconductor device
Grant 9,105,754 - Shishido , et al. August 11, 2 | 2015-08-11 |
Manufacturing method of semiconductor device, adhesive sheet used therein, and semiconductor device obtained thereby
Grant 8,975,759 - Misumi , et al. March 10, 2 | 2015-03-10 |
Light-emitting diode element in which an optical semiconductor element is encapsulated by an encapsulating resin layer containing a light reflection component
Grant 8,890,190 - Ito , et al. November 18, 2 | 2014-11-18 |
Dicing tape-integrated film for semiconductor back surface
Grant 8,703,584 - Misumi , et al. April 22, 2 | 2014-04-22 |
Method for producing light-emitting diode device
Grant 8,642,362 - Ito , et al. February 4, 2 | 2014-02-04 |
Adhesive Film, Method Of Manufacturing Semiconductor Device, And Semiconductor Device
App 20140001654 - Shishido; Yuichiro ; et al. | 2014-01-02 |
Process for producing a semiconductor device
Grant 8,592,260 - Oikawa , et al. November 26, 2 | 2013-11-26 |
Thermosetting die-bonding film
Grant 8,580,617 - Sugo , et al. November 12, 2 | 2013-11-12 |
Manufacturing Method Of Semiconductor Device, Adhesive Sheet Used Therein, And Semiconductor Device Obtained Thereby
App 20130020724 - Misumi; Sadahito ; et al. | 2013-01-24 |
Dicing die-bonding film
Grant 8,304,341 - Matsumura , et al. November 6, 2 | 2012-11-06 |
Manufacturing method of semiconductor device, adhesive sheet used therein, and semiconductor device obtained thereby
Grant 8,278,153 - Misumi , et al. October 2, 2 | 2012-10-02 |
Method For Producing Light-emitting Diode Device
App 20120220059 - ITO; Hisataka ; et al. | 2012-08-30 |
Light-emitting Diode Element And Light-emitting Diode Device
App 20120217527 - ITO; Hisataka ; et al. | 2012-08-30 |
Semiconductor device manufacturing method
Grant 8,236,614 - Misumi , et al. August 7, 2 | 2012-08-07 |
Semiconductor Device Manufacturing Method
App 20120189845 - MISUMI; Sadahito ; et al. | 2012-07-26 |
Thermosetting Die-bonding Film
App 20120135242 - SUGO; Yuki ; et al. | 2012-05-31 |
Thermosetting die-bonding film
Grant 8,143,106 - Sugo , et al. March 27, 2 | 2012-03-27 |
Dicing/die bonding film
Grant 7,998,552 - Amano , et al. August 16, 2 | 2011-08-16 |
Dicing Die-bonding Film
App 20110147952 - Matsumura; Takeshi ; et al. | 2011-06-23 |
Dicing die-bonding film
Grant 7,863,182 - Matsumura , et al. January 4, 2 | 2011-01-04 |
Process For Producing A Semiconductor Device
App 20100330745 - Oikawa; Masami ; et al. | 2010-12-30 |
Dicing Tape-integrated Film For Semiconductor Back Surface
App 20100301497 - MISUMI; Sadahito ; et al. | 2010-12-02 |
Manufacturing Method Of Semiconductor Device, Adhesive Sheet Used Therein, And Semiconductor Device Obtained Thereby
App 20100264531 - Misumi; Sadahito ; et al. | 2010-10-21 |
Adhesive Sheet For Manufacturing Semiconductor Device, And Semiconductor Device Manufacturing Method Using The Sheet
App 20100236689 - Amano; Yasuhiro ; et al. | 2010-09-23 |
Process For Producing Semiconductor Device
App 20100219507 - Misumi; Sadahito ; et al. | 2010-09-02 |
Dicing die-bonding film, method of fixing chipped work and semiconductor device
Grant 7,780,811 - Matsumura , et al. August 24, 2 | 2010-08-24 |
Manufacturing method of semiconductor device, adhesive sheet used therein, and semiconductor device obtained thereby
Grant 7,772,040 - Misumi , et al. August 10, 2 | 2010-08-10 |
Adhesive Sheet For Manufacturing Semiconductor Device, Manufacturing Method Of Semiconductor Device Using The Sheet, And Semiconductor Device Obtained By The Method
App 20100197080 - Matsumura; Takeshi ; et al. | 2010-08-05 |
Dicing/die Bonding Film
App 20100093154 - Amano; Yasuhiro ; et al. | 2010-04-15 |
Dicing/die Bonding Film
App 20100019365 - Matsumura; Takeshi ; et al. | 2010-01-28 |
Thermosetting die bonding film
Grant 7,611,926 - Takamoto , et al. November 3, 2 | 2009-11-03 |
Dicing Die-bonding Film
App 20090149003 - Matsumura; Takeshi ; et al. | 2009-06-11 |
Adhesive film material for use in manufacturing semiconductors
Grant D589,473 - Takamoto , et al. March 31, 2 | 2009-03-31 |
Dicing die-bonding film
Grant 7,508,081 - Matsumura , et al. March 24, 2 | 2009-03-24 |
Semiconductor Device Manufacturing Method
App 20090032976 - Misumi; Sadahito ; et al. | 2009-02-05 |
Adhesive Sheet For Manufacturing Semiconductor Device, Manufacturing Method Of Semiconductor Device Using The Sheet, And Semiconductor Device Obtained By The Method
App 20090001611 - Matsumura; Takeshi ; et al. | 2009-01-01 |
Dicing die-bonding film, method of fixing chipped work and semiconductor device
Grant 7,449,226 - Matsumura , et al. November 11, 2 | 2008-11-11 |
Thermosetting Die Bonding Film
App 20080213943 - Takamoto; Naohide ; et al. | 2008-09-04 |
Manufacturing Method Of Semiconductor Device, Adhesive Sheet Used Therein, And Semiconductor Device Obtained Thereby
App 20080064141 - Misumi; Sadahito ; et al. | 2008-03-13 |
Dicing die-bonding film
Grant D549,189 - Misumi , et al. August 21, 2 | 2007-08-21 |
Dicing Die-bonding Film, Method Of Fixing Chipped Work And Semiconductor Device
App 20070137782 - Matsumura; Takeshi ; et al. | 2007-06-21 |
Process for producing a semiconductor device
Grant 7,232,709 - Misumi , et al. June 19, 2 | 2007-06-19 |
Dicing die-bonding film
App 20050208736 - Matsumura, Takeshi ; et al. | 2005-09-22 |
Process for producing a semiconductor device
App 20050156321 - Misumi, Sadahito ; et al. | 2005-07-21 |
Battery separator containing carbodiimide polymer
Grant 6,896,994 - Urairi , et al. May 24, 2 | 2005-05-24 |
Dicing die-bonding film, method of fixing chipped work and semiconductor device
App 20040241910 - Matsumura, Takeshi ; et al. | 2004-12-02 |
Adhesives composition, adhesive film, and semiconductor apparatus using the same
App 20040230000 - Misumi, Sadahito ; et al. | 2004-11-18 |
Battery containing a polycarbodiimide polymer
Grant 6,811,927 - Urairi , et al. November 2, 2 | 2004-11-02 |
Anisotropic conductive film
Grant 6,669,869 - Yamaguchi , et al. December 30, 2 | 2003-12-30 |
Process for producing semiconductor wafer with adhesive film
Grant 6,652,688 - Matsumura , et al. November 25, 2 | 2003-11-25 |
Process of producing semiconductor device and resin composition sheet used therefor
App 20030068841 - Matsumura, Akiko ; et al. | 2003-04-10 |
Process for producing semiconductor wafer with adhesive film
App 20030034128 - Matsumura, Akiko ; et al. | 2003-02-20 |
Separator for battery
App 20020172870 - Urairi, Masakatsu ; et al. | 2002-11-21 |
Anisotropic conductive film
App 20020130302 - Yamaguchi, Miho ; et al. | 2002-09-19 |
Polycarbodiimide
App 20020055606 - Misumi, Sadahito ; et al. | 2002-05-09 |
Aromatic polycarbodiimide and sheet thereof
App 20010039326 - Misumi, Sadahito ; et al. | 2001-11-08 |
Aromatic polycarbodiimide and water repellent sheet made therefrom
Grant 6,228,972 - Hikita , et al. May 8, 2 | 2001-05-08 |
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