Adhesive film material for use in manufacturing semiconductors

Description

FIG. 1 is a perspective view of a first embodiment of the adhesive film material for use in manufacturing semiconductors showing our new design;

FIG. 2 is a front view thereof;

FIG. 3 is a plan view thereof;

FIG. 4 is a right side view, the left side being a mirror image thereof;

FIG. 5 is an enlarged plan view of the design as identified by A and B in FIG. 2;

FIG. 6 is a sectional view taken along line 6--6 in FIG. 5;

FIG. 7 is a sectional view taken along line 7--7 in FIG. 5;

FIG. 8 is a perspective view of a second embodiment of the adhesive film material for use in manufacturing semiconductors;

FIG. 9 is a front view thereof;

FIG. 10 is a plan view thereof;

FIG. 11 is a right side view, the left side being a mirror image thereof;

FIG. 12 is an enlarged plan view of the design as identified by A and B in FIG. 9;

FIG. 13 is a sectional view taken along line 13--13 in FIG. 12;

FIG. 14 is a sectional view taken along line 14--14 in FIG. 12;

FIG. 15 is a perspective view of a third embodiment of the adhesive film material for use in manufacturing semiconductors;

FIG. 16 is a front view thereof;

FIG. 17 is a plan view thereof;

FIG. 18 is a right side view, the left side being a mirror image thereof;

FIG. 19 is an enlarged plan view of the design as identified by A and B in FIG. 16;

FIG. 20 is a sectional view taken along line 20--20 in FIG. 19; and,

FIG. 21 is a sectional view taken along line 21--21 in FIG. 19.

Claims

CLAIM The ornamental design for adhesive film material for use in manufacturing semiconductors, as shown and described.

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Inventors:	Takamoto; Naohide (Ibaraki, JP), Misumi; Sadahito (Ibaraki, JP), Matsumura; Takeshi (Ibaraki, JP), Amano; Yasuhiro (Ibaraki, JP)
Assignee:	Nitto Denko Corporation (Osaka, JP)
Appl. No.:	D/293,537
Filed:	November 30, 2007

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Foreign Application Priority Data

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May 30, 2007 [JP]			2007-014404
May 30, 2007 [JP]			2007-014405
May 30, 2007 [JP]			2007-014407

Current U.S. Class:	D13/182
Current International Class:	1303
Field of Search:	;D13/182 ;29/25.35 ;156/235,248,678 ;257/678,E21.505 ;310/340,366 ;438/133,199,450,462

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References Cited [Referenced By]

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U.S. Patent Documents

4209481	June 1980	Kashiro et al.
4961804	October 1990	Aurichio
5476565	December 1995	Akada et al.
5918113	June 1999	Higashi et al.
6245593	June 2001	Yoshihara et al.
6457220	October 2002	Hamano
6518097	February 2003	Yim et al.
D549189	August 2007	Misumi et al.
2002/0042189	April 2002	Tanaka
2003/0226640	December 2003	Yamazaki et al.
2005/0139973	June 2005	Matsumura et al.

Primary Examiner: Sikder; Selina
Attorney, Agent or Firm: Osha .cndot. Liang LLP