Patent | Date |
---|
Ceramic Plate, Producing Method Thereof, And Optical Semiconductor Device App 20190044037 - FUJII; Hironaka ;   et al. | 2019-02-07 |
Dicing die bond film Grant 9,123,794 - Amano , et al. September 1, 2 | 2015-09-01 |
Dicing Die Bond Film App 20140057100 - Amano; Yasuhiro ;   et al. | 2014-02-27 |
Cleaning sheet, transfer member provided with cleaning function, and method for cleaning substrate processing apparatus Grant 8,524,007 - Uenda , et al. September 3, 2 | 2013-09-03 |
Cleaning sheet, transfer member provided with cleaning function, and method for cleaning substrate processing apparatus Grant 8,475,600 - Uenda , et al. July 2, 2 | 2013-07-02 |
Dicing Die Bond Film App 20120061805 - AMANO; Yasuhiro ;   et al. | 2012-03-15 |
Film For Semiconductor Device, And Semiconductor Device App 20120058625 - AMANO; Yasuhiro ;   et al. | 2012-03-08 |
Dicing/die bonding film Grant 7,998,552 - Amano , et al. August 16, 2 | 2011-08-16 |
Cleaning Sheet, Transfer Member Provided With Cleaning Function, And Method For Cleaning Substrate Processing Apparatus App 20110088721 - Uenda; Daisuke ;   et al. | 2011-04-21 |
Film For Semiconductor Device App 20110074050 - Amano; Yasuhiro ;   et al. | 2011-03-31 |
Adhesive Film With Dicing Sheet And Method Of Manufacturing The Same App 20110052853 - SUGO; Yuki ;   et al. | 2011-03-03 |
Cleaning Sheet, Conveying Member Using The Same, And Substrate Processing Equipment Cleaning Method Using Them App 20100319151 - Namikawa; Makoto ;   et al. | 2010-12-23 |
Method Of Manufacturing Dicing Die-bonding Film App 20100304092 - Amano; Yasuhiro ;   et al. | 2010-12-02 |
Adhesive Sheet For Manufacturing Semiconductor Device, And Semiconductor Device Manufacturing Method Using The Sheet App 20100236689 - Amano; Yasuhiro ;   et al. | 2010-09-23 |
Cleaning sheet, conveying member using the same, and substrate processing equipment cleaning method using them Grant 7,793,668 - Namikawa , et al. September 14, 2 | 2010-09-14 |
Film For Manufacturing Semiconductor Device And Method Of Manufacturing The Same App 20100136275 - Amano; Yasuhiro | 2010-06-03 |
Adhesive Film For Producing Semiconductor Device App 20100119759 - Kondo; Hiroyuki ;   et al. | 2010-05-13 |
Dicing/die Bonding Film App 20100093154 - Amano; Yasuhiro ;   et al. | 2010-04-15 |
Adhesive Sheet For Producing A Semiconductor Device, And A Method For Producing A Semiconductor Device Using The Same App 20100047968 - Amano; Yasuhiro ;   et al. | 2010-02-25 |
Thermosetting die bonding film Grant 7,611,926 - Takamoto , et al. November 3, 2 | 2009-11-03 |
Cleaning Sheet, Transfer Member Provided With Cleaning Function, And Method For Cleaning Substrate Processing Apparatus App 20090263153 - Uenda; Daisuke ;   et al. | 2009-10-22 |
Cleaning Substrate Of Substrate Processing Equipment And Heat Resistant Resin Preferable Thereof App 20090253891 - TERADA; Yoshio ;   et al. | 2009-10-08 |
Cleaning substrate of substrate processing equipment and heat resistant resin preferable therefor Grant 7,575,812 - Terada , et al. August 18, 2 | 2009-08-18 |
Adhesive film material for use in manufacturing semiconductors Grant D589,473 - Takamoto , et al. March 31, 2 | 2009-03-31 |
Thermosetting Die Bonding Film App 20080213943 - Takamoto; Naohide ;   et al. | 2008-09-04 |
Cleaning substrate of substrate processing equipment and heat resistant resin preferable therefor App 20060141258 - Terada; Yoshio ;   et al. | 2006-06-29 |
Cleaning sheet, conveying member using the same, and substrate processing equipment cleaning method using them App 20060105164 - Namikawa; Makoto ;   et al. | 2006-05-18 |
Cleaning sheet, conveying member using the same, and substrate processing equipment cleaning method using them App 20050244632 - Namikawa, Makoto ;   et al. | 2005-11-03 |
Analog multiplying circuit and variable gain amplifying circuit App 20010048336 - Amano, Yasuhiro | 2001-12-06 |