Takamoto; Naohide

Patent Applications and Registrations

Patent applications and USPTO patent grants for Takamoto; Naohide.The latest application filed is for "film for flip chip type semiconductor back surface, process for producing strip film for semiconductor back surface, and flip chip type semiconductor device".

Company Profile

3.72.92

Takamoto; Naohide - Osaka JP
Takamoto; Naohide - Ibaraki JP
Takamoto; Naohide - Ibaraki-shi JP
Takamoto; Naohide - Ibarkai-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Film for flip chip type semiconductor back surface and its use Grant 10,211,083 - Takamoto , et al. Feb	2019-02-19
Film For Flip Chip Type Semiconductor Back Surface, Process For Producing Strip Film For Semiconductor Back Surface, And Flip Chip Type Semiconductor Device App 20180346640 - SHIGA; Goji ; et al.	2018-12-06
Dicing-tape integrated film for backside of semiconductor and method of manufacturing semiconductor device Grant 10,141,217 - Takamoto , et al. Nov	2018-11-27
Underfill material, laminated sheet and method for producing semiconductor device Grant 10,014,235 - Takamoto , et al. July 3, 2	2018-07-03
Film for back surface of flip-chip semiconductor Grant 9,911,683 - Takamoto , et al. March 6, 2	2018-03-06
Sheet, Tape, And Method For Manufacturing Semiconductor Device App 20170330785 - KIMURA; Ryuichi ; et al.	2017-11-16
Film for semiconductor back surface and its use Grant 9,768,050 - Takamoto , et al. September 19, 2	2017-09-19
Film for semiconductor device production, method for producing film for semiconductor device production, and method for semiconductor device production Grant 9,761,475 - Takamoto , et al. September 12, 2	2017-09-12
Dicing-tape integrated film for backside of semiconductor and method of manufacturing semiconductor device Grant 9,679,797 - Takamoto , et al. June 13, 2	2017-06-13
Semiconductor Package Manufacturing Method App 20170140948 - Kimura; Ryuichi ; et al.	2017-05-18
Laminated Body And Semiconductor Device Manufacturing Method App 20170140972 - KIMURA; Ryuichi ; et al.	2017-05-18
Laminated Body And Composite Body; Assembly Retrieval Method; And Semiconductor Device Manufacturing Method App 20170140974 - KIMURA; Ryuichi ; et al.	2017-05-18
Laminate Body And Composite Body; Semiconductor Device Manufacturing Method App 20170140973 - KIMURA; Ryuichi ; et al.	2017-05-18
Adhesive sheet used in manufacture of semiconductor device, adhesive sheet integrated with dicing tape, semiconductor device, and method of manufacturing semiconductor device Grant 9,620,403 - Shiga , et al. April 11, 2	2017-04-11
Underfill Material, Laminated Sheet and Method for Producing Semiconductor Device App 20170018472 - Takamoto; Naohide ; et al.	2017-01-19
Film For Semiconductor Back Surface And Its Use App 20160351432 - TAKAMOTO; Naohide ; et al.	2016-12-01
Rear Surface-protective Film For Protecting Rear Surface Of Semiconductor Element, Integrated Film, Film, Method For Producing Semiconductor Device, And Method For Producing Chip App 20160322252 - TAKAMOTO; Naohide ; et al.	2016-11-03
Integrated Film, Film, Method For Producing Semiconductor Device, And Method For Producing Chip App 20160322272 - TAKAMOTO; Naohide ; et al.	2016-11-03
Film For Semiconductor Device, Method For Manufacturing Semiconductor Device, And Semiconductor Device App 20160322251 - TAKAMOTO; Naohide ; et al.	2016-11-03
Rear Surface-protective Film, Film, Method For Producing Semiconductor Device, And Method For Producing Chip App 20160322308 - TAKAMOTO; Naohide ; et al.	2016-11-03
Dicing tape-integrated film for semiconductor back surface Grant 9,478,454 - Takamoto , et al. October 25, 2	2016-10-25
Reinforcing sheet and method for producing secondary mounted semiconductor device Grant 9,472,439 - Takamoto , et al. October 18, 2	2016-10-18
Method for Manufacturing Semiconductor Device, Sheet-Shaped Resin Composition, and Dicing Tape-Integrated Sheet-Shaped Resin Composition App 20160240523 - Takamoto; Naohide ; et al.	2016-08-18
Semiconductor Device Manufacturing Method App 20160240394 - Fukui; Akihiro ; et al.	2016-08-18
Semiconductor Device Manufacturing Method App 20160233184 - Hanazono; Hiroyuki ; et al.	2016-08-11
Dicing Tape-integrated Film For Semiconductor Back Surface And Method For Producing The Film, And Method For Producing Semiconductor Device App 20160172230 - TAKAMOTO; Naohide ; et al.	2016-06-16
Under-fill material and method for producing semiconductor device Grant 9,368,421 - Morita , et al. June 14, 2	2016-06-14
Dicing tape-integrated film for semiconductor back surface Grant 9,362,156 - Takamoto , et al. June 7, 2	2016-06-07
Method of manufacturing flip-chip type semiconductor device Grant 9,324,616 - Shiga , et al. April 26, 2	2016-04-26
Film for flip chip type semiconductor back surface, dicing tape-integrated film for semiconductor back surface, process for producing semiconductor device, and flip chip type semiconductor device Grant 9,293,387 - Komoto , et al. March 22, 2	2016-03-22
Thermosetting Resin Composition And Method For Producing A Semiconductor Device App 20160075871 - Morita; Kosuke ; et al.	2016-03-17
Manufacturing semiconductor device with film for forming protective layer Grant 9,279,064 - Oda , et al. March 8, 2	2016-03-08
Under-fill Material, Sealing Sheet, And Method For Producing Semiconductor Device App 20160064297 - Morita; Kosuke ; et al.	2016-03-03
Adhesive Sheet Used In Manufacture Of Semiconductor Device, Adhesive Sheet Integrated With Dicing Tape, Semiconductor Device, And Method Of Manufacturing Semiconductor Device App 20160056066 - SHIGA; Goji ; et al.	2016-02-25
Sealing Sheet, Method For Producing Semiconductor Device, And Substrate With Sealing Sheet App 20160056123 - Morita; Kosuke ; et al.	2016-02-25
Reinforcing Sheet And Method For Producing Secondary Mounted Semiconductor Device App 20160042986 - Takamoto; Naohide ; et al.	2016-02-11
Adhesive Film For Underfill, Adhesive Film For Underfill Integrated With Tape For Grinding Rear Surface, Adhesive Film For Underfill Integrated With Dicing Tape, And Semiconductor Device App 20160040045 - Morita; Kosuke ; et al.	2016-02-11
Underfill Film, Sealing Sheet, Method Of Manufacturing Semiconductor Device, And Semiconductor Device App 20160035640 - MORITA; Kosuke ; et al.	2016-02-04
Semiconductor Device Production Method, Sheet-shaped Resin Composition, Dicing Tape-integrated Sheet-shaped Resin Composition App 20160013089 - Takamoto; Naohide ; et al.	2016-01-14
Underfill Sheet, Underfill Sheet Integrated With Tape For Grinding Rear Surface, Underfill Sheet Integrated With Dicing Tape, And Method For Manufacturing Semiconductor Device App 20150380277 - Morita; Kosuke ; et al.	2015-12-31
Dicing-tape Integrated Film For Backside Of Semiconductor And Method Of Manufacturing Semiconductor Device App 20150364357 - TAKAMOTO; Naohide ; et al.	2015-12-17
Dicing-tape Integrated Film For Backside Of Semiconductor And Method Of Manufacturing Semiconductor Device App 20150357223 - TAKAMOTO; Naohide ; et al.	2015-12-10
Laminated film and use thereof Grant 9,202,795 - Oda , et al. December 1, 2	2015-12-01
Film for back surface of flip-chip semiconductor, dicing-tape-integrated film for back surface of semiconductor, process for producing semiconductor device, and flip-chip semiconductor device Grant 9,196,533 - Takamoto , et al. November 24, 2	2015-11-24
Under-Fill Material and Method for Producing Semiconductor Device App 20150270188 - Morita; Kosuke ; et al.	2015-09-24
Under-fill material and method for producing semiconductor device Grant 9,085,685 - Morita , et al. July 21, 2	2015-07-21
Film for flip chip type semiconductor back surface, dicing tape-integrated film for semiconductor back surface, process for producing semiconductor device, and flip chip type semiconductor device Grant 9,074,113 - Takamoto , et al. July 7, 2	2015-07-07
Film For Semiconductor Device Production, Method For Producing Film For Semiconductor Device Production, And Method For Semiconductor Device Production App 20150162236 - TAKAMOTO; Naohide ; et al.	2015-06-11
Dicing tape-integrated film for semiconductor back surface, and process for producing semiconductor device Grant 9,050,773 - Asai , et al. June 9, 2	2015-06-09
Dicing tape-integrated film for semiconductor back surface Grant 9,035,466 - Takamoto , et al. May 19, 2	2015-05-19
Film for semiconductor device production, method for producing film for semiconductor device production, and method for semiconductor device production Grant 8,986,486 - Takamoto , et al. March 24, 2	2015-03-24
Dicing tape-integrated film for semiconductor back surface Grant 8,912,665 - Hayashi , et al. December 16, 2	2014-12-16
Method Of Manufacturing Flip-chip Type Semiconductor Device App 20140361443 - Shiga; Goji ; et al.	2014-12-11
Dicing tape-integrated wafer back surface protective film Grant 8,841,780 - Takamoto , et al. September 23, 2	2014-09-23
Dicing Tape-integrated Film For Semiconductor Back Surface App 20140203458 - TAKAMOTO; Naohide ; et al.	2014-07-24
Dicing tape-integrated wafer back surface protective film Grant 8,766,462 - Takamoto , et al. July 1, 2	2014-07-01
Dicing Tape-integrated Film For Semiconductor Back Surface App 20140175677 - TAKAMOTO; Naohide ; et al.	2014-06-26
Film For Flip Chip Type Semiconductor Back Surface And Its Use App 20140178680 - TAKAMOTO; Naohide ; et al.	2014-06-26
Dicing Tape-integrated Film For Semiconductor Back Surface App 20140159254 - TAKAMOTO; Naohide ; et al.	2014-06-12
Dicing Tape Integrated Adhesive Sheet, Method Of Manufacturing Semiconductor Device Using Dicing Tape Integrated Adhesive Sheet, And Semiconductor Device App 20140162434 - SHIGA; Goji ; et al.	2014-06-12
Dicing tape-integrated film for semiconductor back surface Grant 8,722,517 - Takamoto , et al. May 13, 2	2014-05-13
Film for flip chip type semiconductor back surface Grant 8,704,382 - Takamoto , et al. April 22, 2	2014-04-22
Dicing tape-integrated film for semiconductor back surface Grant 8,703,584 - Misumi , et al. April 22, 2	2014-04-22
Dicing tape-integrated film for semiconductor back surface Grant 8,692,389 - Takamoto , et al. April 8, 2	2014-04-08
Dicing Tape-integrated Wafer Back Surface Protective Film App 20140091480 - TAKAMOTO; Naohide ; et al.	2014-04-03
Dicing Tape-integrated Wafer Back Surface Protective Film App 20140084490 - TAKAMOTO; Naohide ; et al.	2014-03-27
Dicing tape-integrated film for semiconductor back surface, and process for producing semiconductor device Grant 8,679,931 - Asai , et al. March 25, 2	2014-03-25
Thermally releasable sheet-integrated film for semiconductor back surface, method of collecting semiconductor element, and method of producing semiconductor device Grant 8,652,938 - Takamoto , et al. February 18, 2	2014-02-18
Dicing tape-integrated wafer back surface protective film Grant 8,648,476 - Takamoto , et al. February 11, 2	2014-02-11
Dicing Tape-integrated Film For Semiconductor Back Surface, And Process For Producing Semiconductor Device App 20140037923 - ASAI; Fumiteru ; et al.	2014-02-06
Dicing tape-integrated film for semiconductor back surface Grant 8,643,194 - Takamoto , et al. February 4, 2	2014-02-04
Method Of Marking Semiconductor Element, Method Of Manufacturing Semiconductor Device, And Semiconductor Device App 20130328217 - TAKAMOTO; Naohide ; et al.	2013-12-12
Dicing Tape-integrated Wafer Back Surface Protective Film App 20130285262 - TAKAMOTO; Naohide ; et al.	2013-10-31
Dicing tape-integrated wafer back surface protective film Grant 8,558,397 - Takamoto , et al. October 15, 2	2013-10-15
Method of manufacturing semiconductor device having a bumped wafer and protective layer Grant 8,518,745 - Oda , et al. August 27, 2	2013-08-27
Film For Forming Protective Layer App 20130217187 - Oda; Takashi ; et al.	2013-08-22
Film for flip chip type semiconductor back surface containing thermoconductive filler Grant 8,513,816 - Takamoto , et al. August 20, 2	2013-08-20
Film for flip chip type semiconductor back surface, dicing tape-integrated film for semiconductor back surface, process for producing semiconductor device, and flip chip type semiconductor device Grant 8,492,907 - Takamoto , et al. July 23, 2	2013-07-23
Method For Producing Semiconductor Device App 20130157415 - Morita; Kosuke ; et al.	2013-06-20
Dicing tape-integrated film for semiconductor back surface, and process for producing semiconductor device Grant 8,455,302 - Shiga , et al. June 4, 2	2013-06-04
Under-fill Material And Method For Producing Semiconductor Device App 20130137218 - Morita; Kosuke ; et al.	2013-05-30
Method For Producing Semiconductor Device App 20130137219 - Senzai; Hiroyuki ; et al.	2013-05-30
Film for flip chip type semiconductor back surface Grant 8,450,189 - Shiga , et al. May 28, 2	2013-05-28
Dicing Tape-integrated Film For Semiconductor Back Surface App 20130108847 - Hayashi; Miki ; et al.	2013-05-02
Film For Back Surface Of Flip-chip Semiconductor App 20130099394 - Takamoto; Naohide ; et al.	2013-04-25
Film For Back Surface Of Flip-chip Semiconductor, Dicing-tape-integrated Film For Back Surface Of Semiconductor, Process For Producing Semiconductor Device, And Flip-chip Semiconductor Device App 20130095639 - Takamoto; Naohide ; et al.	2013-04-18
Film for flip chip type semiconductor back surface Grant 8,420,509 - Takamoto , et al. April 16, 2	2013-04-16
Method of manufacturing semiconductor device Grant 8,420,510 - Oda , et al. April 16, 2	2013-04-16
Dicing tape-integrated film for semiconductor back surface Grant 8,415,201 - Hayashi , et al. April 9, 2	2013-04-09
Dicing tape-integrated film for semiconductor back surface, and process for producing semiconductor device Grant 8,404,522 - Shiga , et al. March 26, 2	2013-03-26
Adhesive Film For Semiconductor Device, Film For Backside Of Flip-chip Semiconductor, And Dicing Tape-integrated Film For Backside Of Semiconductor App 20130017396 - SHIGA; Goji ; et al.	2013-01-17
Method Of Manufacturing Semiconductor Device App 20120329250 - Oda; Takashi ; et al.	2012-12-27
Laminated Film And Use Thereof App 20120326280 - Oda; Takashi ; et al.	2012-12-27
Dicing Tape-integrated Film For Semiconductor Back Surface, And Process For Producing Semiconductor Device App 20120289000 - SHIGA; Goji ; et al.	2012-11-15
Dicing Tape-integrated Wafer Back Surface Protective Film App 20120261839 - TAKAMOTO; Naohide ; et al.	2012-10-18
Epoxy resin composition for semiconductor encapsulation and semiconductor device produced by using the same Grant 8,269,213 - Noro , et al. September 18, 2	2012-09-18
Film For Forming Protective Layer App 20120208009 - Oda; Takashi ; et al.	2012-08-16
Method Of Manufacturing Semiconductor Device App 20120208350 - Oda; Takashi ; et al.	2012-08-16
Dicing tape-integrated wafer back surface protective film Grant 8,237,294 - Takamoto , et al. August 7, 2	2012-08-07
Thermosetting Die-bonding Film App 20120153508 - Hayashi; Miki ; et al.	2012-06-21
Film For Flip Chip Type Semiconductor Back Surface, Dicing Tape-integrated Film For Semiconductor Back Surface, Process For Producing Semiconductor Device, And Flip Chip Type Semiconductor Device App 20120025400 - KOMOTO; Yusuke ; et al.	2012-02-02
Dicing Tape-integrated Film For Semiconductor Back Surface, And Process For Producing Semiconductor Device App 20120028418 - ASAI; Fumiteru ; et al.	2012-02-02
Film For Flip Chip Type Semiconductor Back Surface, And Its Use App 20120025399 - TAKAMOTO; Naohide ; et al.	2012-02-02
Film For Flip Chip Type Semiconductor Back Surface App 20120025404 - SHIGA; Goji ; et al.	2012-02-02
Film For Semiconductor Device Production, Method For Producing Film For Semiconductor Device Production, And Method For Semiconductor Device Production App 20120024469 - TAKAMOTO; Naohide ; et al.	2012-02-02
Dicing Tape-integrated Film For Semiconductor Back Surface, And Process For Producing Semiconductor Device App 20120028415 - SHIGA; Goji ; et al.	2012-02-02
Thermally Releasable Sheet-integrated Film For Semiconductor Back Surface, Method Of Collecting Semiconductor Element, And Method Of Producing Semiconductor Device App 20120028442 - TAKAMOTO; Naohide ; et al.	2012-02-02
Film For Flip Chip Type Semiconductor Back Surface, Process For Producing Strip Film For Semiconductor Back Surface, And Flip Chip Type Semiconductor Device App 20120028050 - SHIGA; Goji ; et al.	2012-02-02
Film For Flip Chip Type Semiconductor Back Surface And Its Use App 20120028416 - TAKAMOTO; Naohide ; et al.	2012-02-02
Dicing Tape-integrated Film For Semiconductor Back Surface And Method For Producing The Film, And Method For Producing Semiconductor Device App 20120028380 - Takamoto; Naohide ; et al.	2012-02-02
Film For Flip Chip Type Semiconductor Back Surface, And Dicing Tape-integrated Film For Semiconductor Back Surface App 20120021174 - TAKAMOTO; Naohide ; et al.	2012-01-26
Film For Flip Chip Type Semiconductor Back Surface, Dicing Tape-integrated Film For Semiconductor Back Surface, Process For Producing Semiconductor Device, And Flip Chip Type Semiconductor Device App 20120018903 - TAKAMOTO; Naohide ; et al.	2012-01-26
Film For Flip Chip Type Semiconductor Back Surface, Dicing Tape-integrated Film For Semiconductor Back Surface, Process For Producing Semiconductor Device, And Flip Chip Type Semiconductor Device App 20120018902 - TAKAMOTO; Naohide ; et al.	2012-01-26
Dicing Tape-integrated Film For Semiconductor Back Surface App 20110256669 - TAKAMOTO; Naohide ; et al.	2011-10-20
Dicing Tape-integrated Film For Semiconductor Back Surface App 20110254176 - TAKAMOTO; Naohide ; et al.	2011-10-20
Dicing Tape-integrated Film For Semiconductor Back Surface App 20110156277 - TAKAMOTO; Naohide ; et al.	2011-06-30
Film For Flip Chip Type Semiconductor Back Surface App 20110156279 - TAKAMOTO; Naohide ; et al.	2011-06-30
Dicing Tape-integrated Film For Semiconductor Back Surface App 20110156280 - TAKAMOTO; Naohide ; et al.	2011-06-30
Film For Flip Chip Type Semiconductor Back Surface App 20110156278 - TAKAMOTO; Naohide ; et al.	2011-06-30
Thermosetting Die-bonding Film App 20110084413 - Shishido; Yuichiro ; et al.	2011-04-14
Thermosetting Die-bonding Film App 20110084408 - Shishido; Yuichiro ; et al.	2011-04-14
Dicing Tape-integrated Film For Semiconductor Back Surface App 20100314781 - HAYASHI; Miki ; et al.	2010-12-16
Dicing Tape-integrated Film For Semiconductor Back Surface App 20100314782 - OONISHI; Kenji ; et al.	2010-12-16
Dicing Tape-integrated Film For Semiconductor Back Surface App 20100301497 - MISUMI; Sadahito ; et al.	2010-12-02
Thermosetting die-bonding film Grant 7,829,441 - Takamoto November 9, 2	2010-11-09
Thermosetting Die Bonding Film App 20100261314 - Takamoto; Naohide ; et al.	2010-10-14
Adhesive Sheet For Manufacturing Semiconductor Device, And Semiconductor Device Manufacturing Method Using The Sheet App 20100236689 - Amano; Yasuhiro ; et al.	2010-09-23
Process For Producing Semiconductor Device App 20100219507 - Misumi; Sadahito ; et al.	2010-09-02
Dicing Tape-integrated Wafer Back Surface Protective Film App 20100193969 - TAKAMOTO; Naohide	2010-08-05
Dicing Tape-integrated Wafer Back Surface Protective Film App 20100193967 - TAKAMOTO; Naohide	2010-08-05
Dicing Tape-integrated Wafer Back Surface Protective Film App 20100193968 - TAKAMOTO; Naohide ; et al.	2010-08-05
Epoxy Resin Composition For Semiconductor Encapsulation And Semiconductor Device Produced By Using The Same App 20100148379 - Noro; Hiroshi ; et al.	2010-06-17
Thermosetting Die-bonding Film App 20100081258 - Takamoto; Naohide	2010-04-01
Adhesive Sheet For Producing A Semiconductor Device, And A Method For Producing A Semiconductor Device Using The Same App 20100047968 - Amano; Yasuhiro ; et al.	2010-02-25
Thermosetting die bonding film Grant 7,611,926 - Takamoto , et al. November 3, 2	2009-11-03
Adhesive film material for use in manufacturing semiconductors Grant D589,473 - Takamoto , et al. March 31, 2	2009-03-31
Thermosetting Die Bonding Film App 20080213943 - Takamoto; Naohide ; et al.	2008-09-04