Katou; Shinya

Patent Applications and Registrations

Patent applications and USPTO patent grants for Katou; Shinya.The latest application filed is for "epoxy resin composition, and film, prepreg, and fiber-reinforced plastic using same".

Company Profile

1.22.10

Katou; Shinya - Toyohashi JP
KATOU; Shinya - Tokyo JP
Katou; Shinya - Ichihara JP
Katou; Shinya - Ichihara-shi JP
Katou; Shinya - Toyohashi-shi JP
Katou; Shinya - Kariya JP
Katou, Shinya - Kariya-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Epoxy resin composition Grant 10,233,324 - Harada , et al.	2019-03-19
Epoxy Resin Composition, And Film, Prepreg, And Fiber-reinforced Plastic Using Same App 20170369700 - MITOBE; Hirokazu ; et al.	2017-12-28
Flap in an adhesive tape for semiconductor manufacturing Grant D804,435 - Taniguchi , et al. December 5, 2	2017-12-05
Tape for processing wafer, method for manufacturing tape for processing Grant 9,190,309 - Taniguchi , et al. November 17, 2	2015-11-17
Tape For Processing Wafer, Method For Manufacturing Tape For Processing App 20150279717 - Taniguchi; Kouhei ; et al.	2015-10-01
Tape for processing wafer, method for manufacturing tape for processing wafer, and method for manufacturing semiconductor device Grant 9,076,833 - Taniguchi , et al. July 7, 2	2015-07-07
Wafer processing tape, method of manufacturing wafer processing tape, and method of manufacturing semiconductor device Grant 9,076,832 - Taniguchi , et al. July 7, 2	2015-07-07
Epoxy Resin Composition App 20150148451 - Harada; Yukihiro ; et al.	2015-05-28
Adhesive sheet and method for manufacturing adhesive sheets Grant 9,011,624 - Furutani , et al. April 21, 2	2015-04-21
Dicing/die bonding integral film, dicing/die bonding integral film manufacturing method, and semiconductor chip manufacturing method Grant 8,975,161 - Katou , et al. March 10, 2	2015-03-10
Tape For Processing Wafer, Method For Manufacturing Tape For Processing Wafer, And Method For Manufacturing Semiconductor Device App 20130273718 - Taniguchi; Kouhei ; et al.	2013-10-17
Adhesive tape for semiconductor manufacturing Grant D690,278 - Taniguchi , et al. September 24, 2	2013-09-24
Adhesive tape for semiconductor manufacturing Grant D689,831 - Taniguchi , et al. September 17, 2	2013-09-17
Dicing/die Bonding Integral Film, Dicing/die Bonding Integral Film Manufacturing Method, And Semiconductor Chip Manufacturing Method App 20130143390 - Katou; Rie ; et al.	2013-06-06
Adhesive tape for semiconductor manufacturing Grant D680,505 - Taniguchi , et al. April 23, 2	2013-04-23
Adhesive tape for semiconductor manufacturing Grant D664,511 - Taniguchi , et al. July 31, 2	2012-07-31
Adhesive tape for semiconductor manufacturing Grant D664,512 - Taniguchi , et al. July 31, 2	2012-07-31
Adhesive Sheet And Method For Manufacturing Adhesive Sheets App 20120171475 - Furutani; Ryoji ; et al.	2012-07-05
Wafer Processing Tape, Method Of Manufacturing Wafer Processing Tape, And Method Of Manufacturing Semiconductor Device App 20120094471 - TANIGUCHI; Kouhei ; et al.	2012-04-19
Adhesive tape for semiconductor manufacturing Grant D656,909 - Taniguchi , et al. April 3, 2	2012-04-03
Adhesive tape for semiconductor manufacturing Grant D656,910 - Taniguchi , et al. April 3, 2	2012-04-03
Series spot welding method, device for carrying out the method, and electrodes employed in the method or the device Grant 6,806,436 - Katou , et al. October 19, 2	2004-10-19
Series spot welding method, device for carrying out the method, and electrodes employed in the method or the device App 20030222054 - Katou, Shinya ; et al.	2003-12-04

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