Flap in an adhesive tape for semiconductor manufacturing

Description

FIG. 1 is a top plan view of a flap in an adhesive tape for semiconductor manufacturing incorporating our new design;

FIG. 2 is a bottom plan view of the flap of FIG. 1;

FIG. 3 is a cross-sectional view taken at line 3-3 in FIG. 1;

FIG. 4 is an enlarged view of portion 4-4, 4-4 in FIG. 1; and,

FIG. 5 is a perspective view of the flap in use.

The broken lines are included for the purpose of illustrating environmental structure and form no part of the claimed design.

Claims

CLAIM The ornamental design for a flap in an adhesive tape for semiconductor manufacturing, as shown and described.

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Inventors:	Taniguchi; Kouhei (Ichihara, JP), Matsuzaki; Takayuki (Ichihara, JP), Katou; Shinya (Ichihara, JP), Komorida; Kouji (Ichihara, JP), Mashino; Michio (Ichihara, JP), Sakuta; Tatsuya (Ichihara, JP), Katou; Rie (Ichihara, JP)
Applicant:	Name City State Country Type HITACHI CHEMICAL COMPANY, LTD. Tokyo N/A JP
Assignee:	Hitachi Chemical Company, Ltd. (Tokyo, JP)
Appl. No.:	D/491,391
Filed:	May 20, 2014

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Related U.S. Patent Documents

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	Application Number	Filing Date	Patent Number	Issue Date
	29413518	Feb 16, 2012
	29389787	Apr 3, 2012	D656910

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Foreign Application Priority Data

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Oct 15, 2010 [JP]			D2010-024764

Current U.S. Class:	D13/180
Current International Class:	1303
Field of Search:	;D10/71,75 ;D19/69 ;D24/189 ;D13/182 ;33/494,758,562,759 ;101/288 ;206/390 ;40/638,641 ;428/43,343,345,353,114,455 ;D7/585 ;D20/22,42

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References Cited [Referenced By]

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Foreign Patent Documents

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Other References

Office Action dated Jan. 18, 2013, in Design U.S. Appl. No. 29/413,539. cited by applicant.

Primary Examiner: Murphy; Austin
Attorney, Agent or Firm: Fitch, Even, Tabin & Flannery, LLP