Adhesive tape for semiconductor manufacturing

Description

FIG. 1 is a top plan view of a first embodiment of our new design;

FIG. 2 is a bottom plan view of the first embodiment;

FIG. 3 is a left side view of the first embodiment;

FIG. 4 is a right side view of the first embodiment;

FIG. 5 is a rear side view of the first embodiment;

FIG. 6 is a front side view of the first embodiment;

FIG. 7 is a cross-sectional view of the first embodiment taken at line 7-7 of FIG. 1;

FIG. 8 is an exploded view of the first embodiment;

FIG. 9 is an enlarged view of the lower and left portion of the claimed design shown in FIG. 1 for completeness of illustration.

FIG. 10 is a top plan view of a second embodiment of our new design;

FIG. 11 is a bottom plan view of the second embodiment;

FIG. 12 is a left side view of the second embodiment;

FIG. 13 is a right side view of the second embodiment;

FIG. 14 is a rear side view of the second embodiment;

FIG. 15 is a front side view of the second embodiment;

FIG. 16 is a cross-sectional view of the second embodiment taken at line 16-16 of FIG. 10;

FIG. 17 is an exploded view of the second embodiment;

FIG. 18 is an enlarged view of the lower and left portion of the claimed design shown in FIG. 10 for completeness of illustration.

FIG. 19 is a top plan view of a third embodiment of our new design;

FIG. 20 is a bottom plan view of the third embodiment;

FIG. 21 is a left side view of the third embodiment;

FIG. 22 is a right side view of the third embodiment;

FIG. 23 is a rear side view of the third embodiment;

FIG. 24 is a front side view of the third embodiment;

FIG. 25 is a cross-sectional view of the third embodiment taken at line 25-25 of FIG. 19;

FIG. 26 is an exploded view of the third embodiment; and,

FIG. 27 is an enlarged view of the lower and left portion of the claimed design shown in FIG. 19 for completeness of illustration.

Claims

CLAIM The ornamental design for an adhesive tape for semiconductor manufacturing, as shown and described.

---

Inventors:	Taniguchi; Kouhei (Ichihara, JP), Matsuzaki; Takayuki (Ichihara, JP), Katou; Shinya (Ichihara, JP), Komorida; Kouji (Ichihara, JP), Mashino; Michio (Ichihara, JP), Sakuta; Tatsuya (Ichihara, JP), Katou; Rie (Ichihara, JP)
Assignee:	Hitachi Chemical Company, Ltd. (Tokyo, JP)
Appl. No.:	D/389,788
Filed:	April 15, 2011

---

Foreign Application Priority Data

---

Oct 15, 2010 [JP]			D2010-024758
Oct 15, 2010 [JP]			D2010-024759
Oct 15, 2010 [JP]			D2010-024761

Current U.S. Class:	D13/182; D19/69
Current International Class:	1303
Field of Search:	;D10/71 ;D19/69 ;D24/189 ;D5/99 ;33/494,758,562,759 ;101/288 ;206/390 ;40/638,641 ;428/43 ;D7/585 ;D20/22,42 ;D13/182

---

References Cited [Referenced By]

---

U.S. Patent Documents

D194932	April 1963	Masuda
D228439	September 1973	Mercadante
D287683	January 1987	Unger
D392330	March 1998	Sucese
D395641	June 1998	Gaete
D480811	October 2003	Horhota et al.
D490470	May 2004	Fujii
D490854	June 2004	Fujii
D490855	June 2004	Fujii
D491226	June 2004	Fujii
D491227	June 2004	Fujii
D491228	June 2004	Fujii
D491229	June 2004	Fujii
D492354	June 2004	Fujii
D493838	August 2004	Fujii
D529096	September 2006	Jordan
D544607	June 2007	Henry et al.
D621051	August 2010	Kase et al.
D621803	August 2010	Maruyama et al.
D628170	November 2010	Maruyama et al.

Foreign Patent Documents

	D1315621		Nov 2007		JP

Other References

US. Appl. No. 29/389,790, filed Apr. 15, 2011, Taniguchi et al. cited by other . U.S. Appl. No. 29/389,794, filed Apr. 15, 2011, Taniguchi et al. cited by other . U.S. Appl. No. 29/389,797, filed Apr. 15, 2011, Taniguchi et al. cited by other.

Primary Examiner: Murphy; Austin
Attorney, Agent or Firm: Miles and Stockbridge P.C.