Mashino; Michio

Patent Applications and Registrations

Patent applications and USPTO patent grants for Mashino; Michio.The latest application filed is for "tape for processing wafer, method for manufacturing tape for processing".

Company Profile

2.28.22

Mashino; Michio - Ichihara JP
Mashino; Michio - Ichihara-shi JP
- Ichihara JP
Mashino; Michio - Chiba-shi JP
Mashino; Michio - Chiba JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Adhesive sheet for semiconductor, and dicing tape integrated adhesive sheet for semiconductor Grant 9,969,909 - Yamada , et al. May 15, 2	2018-05-15
Flap in an adhesive tape for semiconductor manufacturing Grant D804,435 - Taniguchi , et al. December 5, 2	2017-12-05
Tape for processing wafer, method for manufacturing tape for processing Grant 9,190,309 - Taniguchi , et al. November 17, 2	2015-11-17
Tape For Processing Wafer, Method For Manufacturing Tape For Processing App 20150279717 - Taniguchi; Kouhei ; et al.	2015-10-01
Tape for processing wafer, method for manufacturing tape for processing wafer, and method for manufacturing semiconductor device Grant 9,076,833 - Taniguchi , et al. July 7, 2	2015-07-07
Wafer processing tape, method of manufacturing wafer processing tape, and method of manufacturing semiconductor device Grant 9,076,832 - Taniguchi , et al. July 7, 2	2015-07-07
Adhesive sheet, dicing tape integrated type adhesive sheet, and method of producing semiconductor device Grant 8,617,930 - Inada , et al. December 31, 2	2013-12-31
Adhesive sheet, dicing tape integrated type adhesive sheet, and method of producing semiconductor device Grant 08617930 -	2013-12-31
Adhesive Sheet And Method For Manufacturing The Same, Semiconductor Device Manufacturing Method And Semiconductor Device App 20130302570 - TANAKA; Maiko ; et al.	2013-11-14
Adhesive Sheet And Method For Manufacturing The Same, Semiconductor Device Manufacturing Method And Semiconductor Device App 20130295314 - TANAKA; Maiko ; et al.	2013-11-07
Tape For Processing Wafer, Method For Manufacturing Tape For Processing Wafer, And Method For Manufacturing Semiconductor Device App 20130273718 - Taniguchi; Kouhei ; et al.	2013-10-17
Adhesive tape for semiconductor manufacturing Grant D690,278 - Taniguchi , et al. September 24, 2	2013-09-24
Adhesive tape for semiconductor manufacturing Grant D689,831 - Taniguchi , et al. September 17, 2	2013-09-17
Adhesive Sheet, Dicing Tape Integrated Type Adhesive Sheet, And Method Of Producing Semiconductor Device App 20130224932 - INADA; Teiichi ; et al.	2013-08-29
Adhesive sheet and method for manufacturing the same, semiconductor device manufacturing method and semiconductor device Grant 8,470,115 - Tanaka , et al. June 25, 2	2013-06-25
Adhesive sheet and method for manufacturing the same, semiconductor device manufacturing method and semiconductor device Grant 8,465,615 - Tanaka , et al. June 18, 2	2013-06-18
Adhesive tape for semiconductor manufacturing Grant D680,505 - Taniguchi , et al. April 23, 2	2013-04-23
Adhesive Sheet, Dicing Tape Integrated Type Adhesive Sheet, And Method Of Producing Semiconductor Device App 20130045585 - INADA; Teiichi ; et al.	2013-02-21
Adhesive tape for semiconductor manufacturing Grant D664,512 - Taniguchi , et al. July 31, 2	2012-07-31
Adhesive tape for semiconductor manufacturing Grant D664,511 - Taniguchi , et al. July 31, 2	2012-07-31
Adhesive Sheet And Method For Manufacturing The Same, Semiconductor Device Manufacturing Method And Semiconductor Device App 20120135176 - TANAKA; Maiko ; et al.	2012-05-31
Wafer Processing Tape, Method Of Manufacturing Wafer Processing Tape, And Method Of Manufacturing Semiconductor Device App 20120094471 - TANIGUCHI; Kouhei ; et al.	2012-04-19
Adhesive tape for semiconductor manufacturing Grant D656,910 - Taniguchi , et al. April 3, 2	2012-04-03
Adhesive tape for semiconductor manufacturing Grant D656,909 - Taniguchi , et al. April 3, 2	2012-04-03
Adhesive Sheet And Method For Manufacturing The Same, Semiconductor Device Manufacturing Method And Semiconductor Device App 20120073743 - TANAKA; Maiko ; et al.	2012-03-29
Adhesive Sheet And Method For Manufacturing The Same, Semiconductor Device Manufacturing Method And Semiconductor Device App 20120068312 - TANAKA; Maikoi ; et al.	2012-03-22
Adhesive Sheet, Semiconductor Device, And Process For Producing Semiconductor Device App 20110287250 - Inada; Teiichi ; et al.	2011-11-24
Adhesive sheet, semiconductor device, and process for producing semiconductor device Grant 8,017,444 - Inada , et al. September 13, 2	2011-09-13
Dicing tape laminated with adhesive sheet of polymer, epoxy resin and filler Grant 7,968,195 - Inada , et al. June 28, 2	2011-06-28
Dicing tape laminated with adhesive sheet of polymer, thermosetting resin and filler Grant 7,968,194 - Inada , et al. June 28, 2	2011-06-28
Bonding semiconductor wafer stuck on dicing tape laminated adhesive sheet onto mounting support Grant 7,875,500 - Inada , et al. January 25, 2	2011-01-25
Adhesive Sheet For Semiconductor, And Dicing Tape Integrated Adhesive Sheet For Semiconductor App 20100266842 - Yamada; Masaki ; et al.	2010-10-21
Adhesive sheet, dicing tape integrated type adhesive sheet, and method of producing semiconductor device App 20090186216 - Inada; Teiichi ; et al.	2009-07-23
Adhesive sheet, dicing tape integrated type adhesive sheet, and method of producing semiconductor device App 20080305583 - Inada; Teichi ; et al.	2008-12-11
Adhesive sheet, dicing tape integrated type adhesive sheet, and method of producing semiconductor device App 20080286594 - Inada; Teiichi ; et al.	2008-11-20
Adhesive Sheet and Method for Manufacturing the Same, Semiconductor Device Manufacturing Method and Semiconductor Device App 20080261039 - Tanaka; Maiko ; et al.	2008-10-23
Adhesive Sheet, Dicing Tape Integrated Type Adhesive Sheet, And Method Of Producing Semiconductor Device App 20080171187 - INADA; Teiichi ; et al.	2008-07-17
Adhesive Sheet, Semiconductor Device, and Process for Producing Semiconductor Device App 20070241434 - Inada; Teiichi ; et al.	2007-10-18
Adhesive sheet, dicing tape intergrated type adhesive sheet, and semiconductor device producing method App 20060128065 - Inada; Teiichi ; et al.	2006-06-15

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