U.S. patent number D664,511 [Application Number D/389,790] was granted by the patent office on 2012-07-31 for adhesive tape for semiconductor manufacturing. This patent grant is currently assigned to Hitachi Chemical Company, Ltd.. Invention is credited to Rie Katou, Shinya Katou, Kouji Komorida, Michio Mashino, Takayuki Matsuzaki, Tatsuya Sakuta, Kouhei Taniguchi.
United States Patent | D664,511 |
Taniguchi , et al. | July 31, 2012 |
Inventors: | Taniguchi; Kouhei (Ichihara, JP), Matsuzaki; Takayuki (Ichihara, JP), Katou; Shinya (Ichihara, JP), Komorida; Kouji (Ichihara, JP), Mashino; Michio (Ichihara, JP), Sakuta; Tatsuya (Ichihara, JP), Katou; Rie (Ichihara, JP) |
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Assignee: | Hitachi Chemical Company, Ltd.
(Tokyo, JP) |
Appl. No.: | D/389,790 |
Filed: | April 15, 2011 |
Oct 15, 2010 [JP] | D2010-024762 | |||
Current U.S. Class: | D13/182 |
Current International Class: | 1303 |
Field of Search: | ;D13/182 ;156/235,248 ;428/343,345,353,355R ;438/114,455,460,463 |
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