Adhesive tape for semiconductor manufacturing

Taniguchi , et al. April 3, 2

Patent Grant D656910

U.S. patent number D656,910 [Application Number D/389,797] was granted by the patent office on 2012-04-03 for adhesive tape for semiconductor manufacturing. This patent grant is currently assigned to Hitachi Chemical Company, Ltd.. Invention is credited to Rie Katou, Shinya Katou, Kouji Komorida, Michio Mashino, Takayuki Matsuzaki, Tatsuya Sakuta, Kouhei Taniguchi.


United States Patent D656,910
Taniguchi ,   et al. April 3, 2012

Adhesive tape for semiconductor manufacturing

Claims

CLAIM The ornamental design for an adhesive tape for semiconductor manufacturing, as shown and described.
Inventors: Taniguchi; Kouhei (Ichihara, JP), Matsuzaki; Takayuki (Ichihara, JP), Katou; Shinya (Ichihara, JP), Komorida; Kouji (Ichihara, JP), Mashino; Michio (Ichihara, JP), Sakuta; Tatsuya (Ichihara, JP), Katou; Rie (Ichihara, JP)
Assignee: Hitachi Chemical Company, Ltd. (Tokyo, JP)
Appl. No.: D/389,797
Filed: April 15, 2011

Foreign Application Priority Data

Oct 15, 2010 [JP] D2010-024764
Current U.S. Class: D13/182; D19/69
Current International Class: 1303
Field of Search: ;D10/71 ;D19/69 ;D24/189 ;D5/99 ;33/494,758,562,759 ;101/288 ;206/390 ;40/638,641 ;428/43 ;D7/585 ;D20/22,42

References Cited [Referenced By]

U.S. Patent Documents
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D490470 May 2004 Fujii
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D490855 June 2004 Fujii
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D621051 August 2010 Kase et al.
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D628170 November 2010 Maruyama et al.
Foreign Patent Documents
D1315621 Nov 2007 JP

Other References

US. Appl. No. 29/389,788, filed Apr. 15, 2011, Taniguchi et al. cited by other .
U.S. Appl. No. 29/389,790, filed Apr. 15, 2011, Taniguchi et al. cited by other .
U.S. Appl. No. 29/389,794, filed Apr. 15, 2011, Taniguchi et al. cited by other.

Primary Examiner: Murphy; Austin
Attorney, Agent or Firm: Miles & Stockbridge P.C.

Description



FIG. 1 is a top plan view of our new design;

FIG. 2 is a bottom plan view;

FIG. 3 is a left side view;

FIG. 4 is a right side view;

FIG. 5 is a rear side view;

FIG. 6 is a front side view;

FIG. 7 is a cross sectional view taken at line 7-7 of FIG. 1;

FIG. 8 is an exploded view; and,

FIG. 9 is an enlarged view of the middle and left portion of the claimed design shown in FIG. 1 for completeness of illustration.

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