Electrostatic chuck for semiconductor manufacturing equipment

Description

FIG. 1 is a front view of an electrostatic chuck for semiconductor manufacturing equipment, showing our new design;

FIG. 2 is a rear view thereof;

FIG. 3 is a top plan view thereof;

FIG. 4 is a bottom plan view thereof;

FIG. 5 is a right side view thereof;

FIG. 6 is a left side view thereof;

FIG. 7 is a cross sectional view taken along the lines of 7-7 of FIG. 1; and,

FIG. 8 is an enlarged view of a portion taken along lines of 8-8 of FIG. 7.

The features shown in broken lines depict environmental subject matter only and form no part of the claimed design.

The alternate long and short dash lines are merely the boundary lines between the claimed parts and the non-claimed parts.

In the FIG. 1, the area surrounded by the alternate long and short dash lines on the electrostatic chuck is not claimed.

Claims

CLAIM The ornamental design for an electrostatic chuck for semiconductor manufacturing equipment, as shown and described.

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Inventors:	Sasaki; Yasuharu (Miyagi, JP), Takahashi; Tomoyuki (Miyagi, JP)
Applicant:	Name City State Country Type TOKYO ELECTRON LIMITED Minato-ku, Tokyo N/A JP
Assignee:	Tokyo Electron Limited (Minato-Ku, Tokyo, JP)
Appl. No.:	D/553,360
Filed:	February 1, 2016

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Foreign Application Priority Data

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Aug 18, 2015 [JP]			2015-018088

Current U.S. Class:	D13/182
Current International Class:	1303
Field of Search:	;D13/182 ;D15/140

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References Cited [Referenced By]

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Foreign Patent Documents

	D1184862		Sep 2003		JP

Primary Examiner: Oswecki; Elizabeth J
Attorney, Agent or Firm: Leydig Voit & Mayer