Ring for use in a semiconductor wafer heat processing apparatus

Description

FIG. 1 a perspective view of a ring for use in a semiconductor wafer heat processing apparatus;

FIG. 2 a top plan view thereof;

FIG. 3 a front elevational view thereof;

FIG. 4 a bottom plan view thereof;

FIG. 5 a right side view thereof;

FIG. 6 a rear elevational view thereof; and,

FIG. 7 a cross-sectional view taken along line VII--VII in FIG. 3.

Claims

I claim the ornamental design for a ring for use in a semiconductor wafer heat processing apparatus, as shown and described.

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Inventors:	Ishii; Katsutoshi (Shiroyama-machi, JP)
Assignee:	Tokyo Electron Limited (Tokyo-To, JP)
Appl. No.:	D/083,715
Filed:	February 12, 1998

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Foreign Application Priority Data

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Aug 20, 1997 [JP]			9-65106

Current U.S. Class:	D13/182
Current International Class:	1303
Field of Search:	;D13/182 ;D15/144,144.1,199 ;414/935-941,217,147 ;437/247,946

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References Cited [Referenced By]

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U.S. Patent Documents

4857689	August 1989	Lee
5314574	May 1994	Takahashi
5320218	June 1994	Yamashita et al.
5752796	May 1998	Muka

Primary Examiner: Vinson; Brian N.
Attorney, Agent or Firm: Ladas & Parry