Attracting disc for an electrostatic chuck for semiconductor production

Hayashi August 7, 2

Patent Grant D548200

U.S. patent number D548,200 [Application Number D/245,048] was granted by the patent office on 2007-08-07 for attracting disc for an electrostatic chuck for semiconductor production. This patent grant is currently assigned to Tokyo Electron Limited. Invention is credited to Daisuke Hayashi.


United States Patent D548,200
Hayashi August 7, 2007

Attracting disc for an electrostatic chuck for semiconductor production

Claims

CLAIM The ornamental design for an attracting disc for an electrostatic chuck for semiconductor production, as shown and described.
Inventors: Hayashi; Daisuke (Nirasaki, JP)
Assignee: Tokyo Electron Limited (Tokyo, JP)
Appl. No.: D/245,048
Filed: December 19, 2005

Foreign Application Priority Data

Sep 29, 2005 [JP] 2005-028310
Current U.S. Class: D13/182
Current International Class: 1303
Field of Search: ;D13/182 ;156/345.53 ;279/128 ;361/234

References Cited [Referenced By]

U.S. Patent Documents
3078565 February 1963 Sanders
4502094 February 1985 Lewin et al.
5350479 September 1994 Collins et al.
5671116 September 1997 Husain
6033478 March 2000 Kholodenko
6278600 August 2001 Shamouilian et al.
6628503 September 2003 Sogard
6721162 April 2004 Weldon et al.
2002/0027762 March 2002 Yamaguchi
2002/0159217 October 2002 Tsuruta et al.
2004/0179323 September 2004 Litman et al.
2004/0190215 September 2004 Weldon et al.
2004/0212947 October 2004 Nguyen et al.
2004/0218339 November 2004 Nakamura
2005/0111161 May 2005 Tran
2006/0002053 January 2006 Brown et al.
2006/0164785 July 2006 Pellegrin
2006/0221539 October 2006 Morita et al.
Primary Examiner: Sikder; Selina
Attorney, Agent or Firm: Oblon, Spivak, McClelland, Maier & Neustadt, P.C.

Description



FIG. 1 is a front elevational view of an attracting disc for an electrostatic chuck for semiconductor production, showing my new design;

FIG. 2 is a rear elevational view thereof;

FIG. 3 is a left side elevational view thereof;

FIG. 4 is a right side elevational view thereof;

FIG. 5 is a top plan view thereof; and,

FIG. 6 is a bottom plan view thereof.

The broken line showing in the figures is for illustrative purposes only and forms no part of the claimed design.

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