Dummy wafer

Motoyama , et al. May 16, 2

Patent Grant D786810

U.S. patent number D786,810 [Application Number D/524,912] was granted by the patent office on 2017-05-16 for dummy wafer. This patent grant is currently assigned to Tokyo Electron Limited. The grantee listed for this patent is Tokyo Electron Limited. Invention is credited to Kohei Fukushima, Yutaka Motoyama.


United States Patent D786,810
Motoyama ,   et al. May 16, 2017

Dummy wafer

Claims

CLAIM The ornamental design for a dummy wafer, as shown and described.
Inventors: Motoyama; Yutaka (Iwate, JP), Fukushima; Kohei (Iwate, JP)
Applicant:
Name City State Country Type

Tokyo Electron Limited

Tokyo

N/A

JP
Assignee: Tokyo Electron Limited (Tokyo, JP)
Appl. No.: D/524,912
Filed: April 24, 2015

Foreign Application Priority Data

Nov 13, 2014 [JP] 2014-025307
Current U.S. Class: D13/182
Current International Class: 1303
Field of Search: ;D13/182 ;428/408,212,688,689,698

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Other References

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Primary Examiner: Oswecki; Elizabeth J
Attorney, Agent or Firm: IPUSA, PLLC

Description



FIG. 1 is a top plan view of a dummy wafer showing our new design;

FIG. 2 is a front view thereof;

FIG. 3 is an enlarged portion view taken along lines 3-3 in FIG. 1;

FIG. 4 is a cross-sectional view taken along line 4-4 in FIG. 3; and,

FIG. 5 is a cross-sectional view taken along line 5-5 in FIG. 3.

The broken lines shown in the drawings represent portions of the dummy wafer that form no part of the claimed design. Right, left and back views of the dummy wafer shown in FIG. 1 have been omitted because they are the same as the front view. The bottom view of the dummy wafer shown in FIG. 1 has been omitted because it forms no part of the claimed design.

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