U.S. patent number D786,810 [Application Number D/524,912] was granted by the patent office on 2017-05-16 for dummy wafer. This patent grant is currently assigned to Tokyo Electron Limited. The grantee listed for this patent is Tokyo Electron Limited. Invention is credited to Kohei Fukushima, Yutaka Motoyama.
United States Patent | D786,810 |
Motoyama , et al. | May 16, 2017 |
Inventors: | Motoyama; Yutaka (Iwate, JP), Fukushima; Kohei (Iwate, JP) | ||||||||||
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Applicant: |
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Assignee: | Tokyo Electron Limited (Tokyo,
JP) |
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Appl. No.: | D/524,912 | ||||||||||
Filed: | April 24, 2015 |
Nov 13, 2014 [JP] | 2014-025307 | |||
Current U.S. Class: | D13/182 |
Current International Class: | 1303 |
Field of Search: | ;D13/182 ;428/408,212,688,689,698 |
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US. Appl. No. 29/524,897, filed Apr. 24, 2015, Tokyo Electron Limited. cited by applicant . U.S. Appl. No. 29/524,898, filed Apr. 24, 2015, Tokyo Electron Limited. cited by applicant. |
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