Semiconductor module

Higashibata April 10, 2

Patent Grant D540272

U.S. patent number D540,272 [Application Number D/238,804] was granted by the patent office on 2007-04-10 for semiconductor module. This patent grant is currently assigned to Murata Manufacturing Co., Ltd.. Invention is credited to Kazuaki Higashibata.


United States Patent D540,272
Higashibata April 10, 2007

Semiconductor module

Claims

CLAIM The ornamental design for a semiconductor module, as shown and described.
Inventors: Higashibata; Kazuaki (Yasu, JP)
Assignee: Murata Manufacturing Co., Ltd. (JP)
Appl. No.: D/238,804
Filed: September 22, 2005

Foreign Application Priority Data

Apr 18, 2005 [JP] 2005-011529(D)
Current U.S. Class: D13/182
Current International Class: 1303
Field of Search: ;D13/182 ;257/177,197,666,684,686,689,775 ;361/820

References Cited [Referenced By]

U.S. Patent Documents
D318461 July 1991 Hasegawa et al.
5994772 November 1999 Shin
6127729 October 2000 Fukuda
6373447 April 2002 Rostoker et al.
6781239 August 2004 Yegnashankaran et al.
6836002 December 2004 Chikawa et al.
6992395 January 2006 Fukasawa
2006/0043544 March 2006 Tsukamoto et al.
2006/0097374 May 2006 Egawa
2006/0131715 June 2006 Satou et al.
Primary Examiner: Sikder; Selina
Attorney, Agent or Firm: Dickstein, Shapiro, LLP.

Description



FIG. 1 is a front view of a semiconductor module showing our new design;

FIG. 2 is a rear view thereof;

FIG. 3 is a top plan view thereof;

FIG. 4 is a bottom plan view thereof;

FIG. 5 is a left side view thereof; and,

FIG. 6 is a right side view thereof.

The broken lines shown in the drawings are for illustrative purposes only and form no part of the claimed design.

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