U.S. patent number D540,272 [Application Number D/238,804] was granted by the patent office on 2007-04-10 for semiconductor module.
This patent grant is currently assigned to Murata Manufacturing Co., Ltd.. Invention is credited to Kazuaki Higashibata.
United States Patent |
D540,272 |
Higashibata |
April 10, 2007 |
Semiconductor module
Claims
CLAIM The ornamental design for a semiconductor module, as shown
and described.
Inventors: |
Higashibata; Kazuaki (Yasu,
JP) |
Assignee: |
Murata Manufacturing Co., Ltd.
(JP)
|
Appl.
No.: |
D/238,804 |
Filed: |
September 22, 2005 |
Foreign Application Priority Data
|
|
|
|
|
Apr 18, 2005 [JP] |
|
|
2005-011529(D) |
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Current U.S.
Class: |
D13/182 |
Current International
Class: |
1303 |
Field of
Search: |
;D13/182
;257/177,197,666,684,686,689,775 ;361/820 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Sikder; Selina
Attorney, Agent or Firm: Dickstein, Shapiro, LLP.
Description
FIG. 1 is a front view of a semiconductor module showing our new
design;
FIG. 2 is a rear view thereof;
FIG. 3 is a top plan view thereof;
FIG. 4 is a bottom plan view thereof;
FIG. 5 is a left side view thereof; and,
FIG. 6 is a right side view thereof.
The broken lines shown in the drawings are for illustrative
purposes only and form no part of the claimed design.
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