Elastic membrane for semiconductor wafer polishing apparatus

Description

FIG. 1 is a bottom view of an elastic membrane for semiconductor wafer polishing apparatus showing our new design;

FIG. 2 is a top view thereof;

FIG. 3 is a front view thereof;

FIG. 4 is a right side view thereof;

FIG. 5 is a rear view thereof;

FIG. 6 is a left side view thereof;

FIG. 7 is a perspective view, observed from above thereof enlarged for ease of illustrations;

FIG. 8 is a cross-section view taken along the line 8--8 of FIG. 2 thereof;

FIG. 9 is a enlarged view of part 9 of FIG. 8 thereof;

FIG. 10 is a bottom view thereof;

FIG. 11 is a top view thereof;

FIG. 12 is a front view thereof;

FIG. 13 is a right side view thereof;

FIG. 14 is a rear view thereof;

FIG. 15 is a left side view thereof;

FIG. 16 is a perspective view, observed from above thereof enlarged for ease of illustrations;

FIG. 17 is a cross-section view taken along the line 17--17 of FIG. 11 thereof;

FIG. 18 is a enlarged view of part 18 of FIG. 17 thereof;

FIG. 19 is a bottom view thereof;

FIG. 20 is a top view thereof;

FIG. 21 is a front view thereof; (rear view is omit since it is identical with the front)

FIG. 22 is a right side view thereof; (left side view is omitted since it is identical with the right side view)

FIG. 23 is a perspective view, observed from above thereof enlarged for ease of illustrations;

FIG. 24 is a cross-section view taken along the line 24--24 of FIG. 20 thereof; and,

FIG. 25 is a enlarged view of part 25 of FIG. 24 thereof.

The broken lines depict environmental subject matter only and form no part of the claimed design.

Claims

CLAIM The ornamental design for an elastic membrane for semiconductor wafer polishing apparatus, as shown and described.

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Inventors:	Yasuda; Hozumi (Ohta-ku, JP), Namiki; Keisuke (Ohta-ku, JP), Fukushima; Makoto (Ohta-ku, JP), Nabeya; Osamu (Ohta-ku, JP), Saito; Koji (Ohta-ku, JP), Yamaki; Satoru (Ohta-ku, JP), Inoue; Tomoshi (Ohta-ku, JP), Togashi; Shingo (Ohta-ku, JP), Togawa; Tetsuji (Ohta-ku, JP)
Assignee:	Ebara Corporation (Tokyo, JP)
Appl. No.:	D/356,450
Filed:	February 25, 2010

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Foreign Application Priority Data

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Aug 27, 2009 [JP]			2009-19719
Aug 27, 2009 [JP]			2009-19720
Aug 27, 2009 [JP]			2009-19721

Current U.S. Class:	D13/182
Current International Class:	1303
Field of Search:	;D13/182 ;257/E21.304 ;451/66,288,289

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References Cited [Referenced By]

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Foreign Patent Documents

	2005-0814728		Sep 2007		EP
	2000-167762		Jun 2000		JP
	2000-301452		Oct 2000		JP
	2002-075936		Mar 2002		JP
	2002-527894		Aug 2002		JP
	2004-297029		Oct 2004		JP
	2004-363505		Dec 2004		JP
	2006-159392		Jun 2006		JP
	2006-255851		Sep 2006		JP
	3937368		Apr 2007		JP
	30-0526799		Apr 2009		KR
	30-0526801		Apr 2009		KR

Primary Examiner: Sikder; Selina
Attorney, Agent or Firm: Sughrue Mion, PLLC