U.S. patent number D634,719 [Application Number D/356,450] was granted by the patent office on 2011-03-22 for elastic membrane for semiconductor wafer polishing apparatus.
This patent grant is currently assigned to Ebara Corporation. Invention is credited to Makoto Fukushima, Tomoshi Inoue, Osamu Nabeya, Keisuke Namiki, Koji Saito, Shingo Togashi, Tetsuji Togawa, Satoru Yamaki, Hozumi Yasuda.
United States Patent |
D634,719 |
Yasuda , et al. |
March 22, 2011 |
Elastic membrane for semiconductor wafer polishing apparatus
Claims
CLAIM The ornamental design for an elastic membrane for
semiconductor wafer polishing apparatus, as shown and described.
Inventors: |
Yasuda; Hozumi (Ohta-ku,
JP), Namiki; Keisuke (Ohta-ku, JP),
Fukushima; Makoto (Ohta-ku, JP), Nabeya; Osamu
(Ohta-ku, JP), Saito; Koji (Ohta-ku, JP),
Yamaki; Satoru (Ohta-ku, JP), Inoue; Tomoshi
(Ohta-ku, JP), Togashi; Shingo (Ohta-ku,
JP), Togawa; Tetsuji (Ohta-ku, JP) |
Assignee: |
Ebara Corporation (Tokyo,
JP)
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Appl.
No.: |
D/356,450 |
Filed: |
February 25, 2010 |
Foreign Application Priority Data
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Aug 27, 2009 [JP] |
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2009-19719 |
Aug 27, 2009 [JP] |
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2009-19720 |
Aug 27, 2009 [JP] |
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2009-19721 |
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Current U.S.
Class: |
D13/182 |
Current International
Class: |
1303 |
Field of
Search: |
;D13/182 ;257/E21.304
;451/66,288,289 |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
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2005-0814728 |
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Sep 2007 |
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EP |
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2000-167762 |
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Jun 2000 |
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JP |
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2000-301452 |
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Oct 2000 |
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JP |
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2002-075936 |
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Mar 2002 |
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JP |
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2002-527894 |
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Aug 2002 |
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JP |
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2004-297029 |
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Oct 2004 |
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JP |
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2004-363505 |
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Dec 2004 |
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JP |
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2006-159392 |
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Jun 2006 |
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JP |
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2006-255851 |
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Sep 2006 |
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JP |
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3937368 |
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Apr 2007 |
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JP |
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30-0526799 |
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Apr 2009 |
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KR |
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30-0526801 |
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Apr 2009 |
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KR |
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Primary Examiner: Sikder; Selina
Attorney, Agent or Firm: Sughrue Mion, PLLC
Description
FIG. 1 is a bottom view of an elastic membrane for semiconductor
wafer polishing apparatus showing our new design;
FIG. 2 is a top view thereof;
FIG. 3 is a front view thereof;
FIG. 4 is a right side view thereof;
FIG. 5 is a rear view thereof;
FIG. 6 is a left side view thereof;
FIG. 7 is a perspective view, observed from above thereof enlarged
for ease of illustrations;
FIG. 8 is a cross-section view taken along the line 8--8 of FIG. 2
thereof;
FIG. 9 is a enlarged view of part 9 of FIG. 8 thereof;
FIG. 10 is a bottom view thereof;
FIG. 11 is a top view thereof;
FIG. 12 is a front view thereof;
FIG. 13 is a right side view thereof;
FIG. 14 is a rear view thereof;
FIG. 15 is a left side view thereof;
FIG. 16 is a perspective view, observed from above thereof enlarged
for ease of illustrations;
FIG. 17 is a cross-section view taken along the line 17--17 of FIG.
11 thereof;
FIG. 18 is a enlarged view of part 18 of FIG. 17 thereof;
FIG. 19 is a bottom view thereof;
FIG. 20 is a top view thereof;
FIG. 21 is a front view thereof; (rear view is omit since it is
identical with the front)
FIG. 22 is a right side view thereof; (left side view is omitted
since it is identical with the right side view)
FIG. 23 is a perspective view, observed from above thereof enlarged
for ease of illustrations;
FIG. 24 is a cross-section view taken along the line 24--24 of FIG.
20 thereof; and,
FIG. 25 is a enlarged view of part 25 of FIG. 24 thereof.
The broken lines depict environmental subject matter only and form
no part of the claimed design.
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