Elastic membrane for semiconductor wafer polishing apparatus

Description

FIG. 1 is a bottom view of an elastic membrane for semiconductor wafer polishing apparatus showing our new design;

FIG. 2 is a top view thereof;

FIG. 3 is a front view thereof;

FIG. 4 is a rear view thereof;

FIG. 5 is a right side view thereof;

FIG. 6 is a left side view thereof;

FIG. 7 is a perspective view, observed from below thereof,

FIG. 8 is a perspective view, observed from above thereof;

FIG. 9 is a cross-section view taken along the line 9--9 of FIG. 1 thereof; and,

FIG. 10 is a enlarged view of part 10 of FIG. 9 thereof.

Claims

CLAIM The ornamental design for an elastic membrane for semiconductor wafer polishing apparatus, as shown and described.

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Inventors:	Namiki; Keisuke (Ohta-ku, JP), Yasuda; Hozumi (Ohta-ku, JP), Nabeya; Osamu (Ohta-ku, JP), Fukushima; Makoto (Ohta-ku, JP), Togashi; Shingo (Ohta-ku, JP), Yamaki; Satoru (Ohta-ku, JP), Watanabe; Katsuhide (Ohta-ku, JP)
Assignee:	Ebara Corporation (Tokyo, JP)
Appl. No.:	D/356,456
Filed:	February 25, 2010

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Foreign Application Priority Data

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Aug 27, 2009 [JP]			2009-19715

Current U.S. Class:	D13/182
Current International Class:	1303
Field of Search:	;D13/182 ;257/E21.304 ;451/66,288,289

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References Cited [Referenced By]

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Primary Examiner: Sikder; Selina
Attorney, Agent or Firm: Sughrue Mion, PLLC