U.S. patent number D633,452 [Application Number D/356,456] was granted by the patent office on 2011-03-01 for elastic membrane for semiconductor wafer polishing apparatus.
This patent grant is currently assigned to Ebara Corporation. Invention is credited to Makoto Fukushima, Osamu Nabeya, Keisuke Namiki, Shingo Togashi, Katsuhide Watanabe, Satoru Yamaki, Hozumi Yasuda.
United States Patent |
D633,452 |
Namiki , et al. |
March 1, 2011 |
Elastic membrane for semiconductor wafer polishing apparatus
Claims
CLAIM The ornamental design for an elastic membrane for
semiconductor wafer polishing apparatus, as shown and described.
Inventors: |
Namiki; Keisuke (Ohta-ku,
JP), Yasuda; Hozumi (Ohta-ku, JP), Nabeya;
Osamu (Ohta-ku, JP), Fukushima; Makoto (Ohta-ku,
JP), Togashi; Shingo (Ohta-ku, JP), Yamaki;
Satoru (Ohta-ku, JP), Watanabe; Katsuhide
(Ohta-ku, JP) |
Assignee: |
Ebara Corporation (Tokyo,
JP)
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Appl.
No.: |
D/356,456 |
Filed: |
February 25, 2010 |
Foreign Application Priority Data
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Aug 27, 2009 [JP] |
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2009-19715 |
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Current U.S.
Class: |
D13/182 |
Current International
Class: |
1303 |
Field of
Search: |
;D13/182 ;257/E21.304
;451/66,288,289 |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
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20050814728 |
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Dec 2005 |
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EP |
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2000-167762 |
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Jun 2000 |
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JP |
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2000-301452 |
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Oct 2000 |
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JP |
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2002-075936 |
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Mar 2002 |
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JP |
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2002-527894 |
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Aug 2002 |
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JP |
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2004-297029 |
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Oct 2004 |
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JP |
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2004-363505 |
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Dec 2004 |
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JP |
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2006-159392 |
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Jun 2006 |
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JP |
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2006-255851 |
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Sep 2006 |
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JP |
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3937368 |
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Apr 2007 |
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JP |
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30-0526799 |
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Apr 2009 |
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KR |
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30-0526801 |
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Apr 2009 |
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KR |
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2006/062232 |
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Jun 2006 |
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WO |
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Primary Examiner: Sikder; Selina
Attorney, Agent or Firm: Sughrue Mion, PLLC
Description
FIG. 1 is a bottom view of an elastic membrane for semiconductor
wafer polishing apparatus showing our new design;
FIG. 2 is a top view thereof;
FIG. 3 is a front view thereof;
FIG. 4 is a rear view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a left side view thereof;
FIG. 7 is a perspective view, observed from below thereof,
FIG. 8 is a perspective view, observed from above thereof;
FIG. 9 is a cross-section view taken along the line 9--9 of FIG. 1
thereof; and,
FIG. 10 is a enlarged view of part 10 of FIG. 9 thereof.
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