Replaceable substrate carrier interfacing film

Sakata , et al. April 5, 2

Patent Grant D947802

U.S. patent number D947,802 [Application Number D/735,362] was granted by the patent office on 2022-04-05 for replaceable substrate carrier interfacing film. This patent grant is currently assigned to APPLIED MATERIALS, INC.. The grantee listed for this patent is Applied Materials, Inc.. Invention is credited to Edward Golubovsky, Clinton Sakata.


United States Patent D947,802
Sakata ,   et al. April 5, 2022

Replaceable substrate carrier interfacing film

Claims

CLAIM The ornamental design for a replaceable substrate carrier interfacing film, as shown and described.
Inventors: Sakata; Clinton (San Jose, CA), Golubovsky; Edward (San Jose, CA)
Applicant:
Name City State Country Type

Applied Materials, Inc.

Santa Clara

CA

US
Assignee: APPLIED MATERIALS, INC. (Santa Clara, CA)
Appl. No.: D/735,362
Filed: May 20, 2020

Current U.S. Class: D13/182
Current International Class: 1303
Field of Search: ;D13/123,133,146,147,154,182,184,199

References Cited [Referenced By]

U.S. Patent Documents
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Other References

Office Action for Korean Application No. 30-2020-55334 dated Sep. 13, 2021. cited by applicant.

Primary Examiner: Gingrich; Shawn T
Assistant Examiner: Murray; Anton Dennis
Attorney, Agent or Firm: Patterson + Sheridan LLP Patterson; B. Todd

Description



FIG. 1 is a top perspective view of a replaceable substrate carrier interfacing film;

FIG. 2 is a bottom perspective view of the replaceable substrate carrier interfacing film;

FIG. 3 is a top plan view of the replaceable substrate carrier interfacing film;

FIG. 4 is a bottom plan view of the replaceable substrate carrier interfacing film;

FIG. 5 is a front side view of the replaceable substrate carrier interfacing film;

FIG. 6 is a right side view of the replaceable substrate carrier interfacing film;

FIG. 7 is a left side view of the replaceable substrate carrier interfacing film;

FIG. 8 is a back side view of the replaceable substrate carrier interfacing film; and,

FIG. 9 is close up view of a portion of the replaceable substrate carrier interfacing film of FIG. 1.

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