Electrostatic chuck with improved spacing and charge migration reduction mask

Description

FIG. 1 is a top view of the electrostatic chuck having the improved spacing and charge migration reduction mask;

FIG. 2 is an elevation view when looking to the right along the x-axis in FIG. 1 , the view when looking to the left along the x-axis in FIG. 1 being identical to that of FIG. 2 thereof;

FIG. 3 is a detailed view of part of the surface seen in FIG. 2 thereof;

FIG. 4 is a bottom view thereof;

FIG. 5 is an elevation view when looking down along the y-axis in FIG. 1 thereof; and,

FIG.6 is an elevation view when looking up along the y-axis in FIG. 1 thereof.

Claims

The ornamental design for an electrostatic chuck with improved spacing and charge migration reduction mask, as shown and described.

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Inventors:	Burkhart; Vincent E. (San Jose, CA), Flanigan; Allen (San Jose, CA), Sansoni; Steven (San Jose, CA)
Assignee:	Applied Materials, Inc. (Santa Clara, CA)
Appl. No.:	D/081,238
Filed:	December 24, 1997

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Related U.S. Patent Documents

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	Application Number	Filing Date	Patent Number	Issue Date
	639841	May 8, 1996	5764471

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Current U.S. Class:	D15/140
Current International Class:	1509
Field of Search:	;D15/140 ;361/234,235 ;279/128 ;269/8,903

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References Cited [Referenced By]

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U.S. Patent Documents

5528451	June 1996	Su

Primary Examiner: Davis; Antoine Duval
Attorney, Agent or Firm: Thomason & Moser