Seal member for semiconductor production apparatus

Yoshida , et al. October 12, 2

Patent Grant D933032

U.S. patent number D933,032 [Application Number D/750,937] was granted by the patent office on 2021-10-12 for seal member for semiconductor production apparatus. This patent grant is currently assigned to Valqua, Ltd.. The grantee listed for this patent is Valqua, Ltd.. Invention is credited to Ippei Nakagawa, Nobuhiro Yoshida.


United States Patent D933,032
Yoshida ,   et al. October 12, 2021

Seal member for semiconductor production apparatus

Claims

CLAIM The ornamental design for a seal member for semiconductor production apparatus, as shown and described.
Inventors: Yoshida; Nobuhiro (Gojo, JP), Nakagawa; Ippei (Gojo, JP)
Applicant:
Name City State Country Type

Valqua, Ltd.

Tokyo

N/A

JP
Assignee: Valqua, Ltd. (Tokyo, JP)
Appl. No.: D/750,937
Filed: September 17, 2020

Related U.S. Patent Documents

Application Number Filing Date Patent Number Issue Date
35507483 Apr 1, 2019 D909322

Foreign Application Priority Data

Oct 12, 2018 [JP] 2018-022466
Oct 12, 2018 [JP] 2018-022467
Oct 12, 2018 [JP] 2018-022468
Oct 12, 2018 [JP] 2018-022469
Current U.S. Class: D13/182
Current International Class: 1303
Field of Search: ;D13/199 ;D4/137 ;D9/416 ;D23/269 ;D15/7

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Other References

"High Performance FKM" found by RMS on the internet at: https://valqua-america.com/products/semiconductor_b.html reference dated Mar. 24, 2021. cited by examiner.

Primary Examiner: Shields; Rhea
Attorney, Agent or Firm: The Webb Law Firm

Description



FIG. 1 is a perspective view of a seal member for semiconductor production apparatus, showing our new design;

FIG. 2 is a front elevation view thereof;

FIG. 3 is a rear elevation view thereof;

FIG. 4 is a left side elevation view thereof;

FIG. 5 is a right side elevation view thereof;

FIG. 6 is a top view thereof;

FIG. 7 is a bottom view thereof;

FIG. 8 is a cross-sectional view thereof taken along line 8-8 shown in FIG. 6; and,

FIG. 9 is an enlarged cross-sectional view of a portion thereof taken from area 9-9 shown in FIG. 8.

* * * * *

References


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