loadpatents
name:-0.010042905807495
name:-0.024632215499878
name:-0.007659912109375
Nakagawa; Ippei Patent Filings

Nakagawa; Ippei

Patent Applications and Registrations

Patent applications and USPTO patent grants for Nakagawa; Ippei.The latest application filed is for "v-shape seal band for a semiconductor processing chamber".

Company Profile
4.23.4
  • Nakagawa; Ippei - Gojo JP
  • NAKAGAWA; Ippei - Gojo-Shi JP
  • Nakagawa; Ippei - Nara JP
  • Nakagawa; Ippei - Machida JP
  • Nakagawa; Ippei - Aichi JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Seal member
Grant 11,384,838 - Nakagawa , et al. July 12, 2
2022-07-12
Seal material
Grant D942,596 - Nakagawa February 1, 2
2022-02-01
Composite seal member
Grant 11,231,108 - Kim , et al. January 25, 2
2022-01-25
Seal member for semiconductor production apparatus
Grant D933,619 - Yoshida , et al. October 19, 2
2021-10-19
Seal member for semiconductor production apparatus
Grant D933,032 - Yoshida , et al. October 12, 2
2021-10-12
Seal member for semiconductor production apparatus
Grant D933,033 - Yoshida , et al. October 12, 2
2021-10-12
Seal member for semiconductor production apparatus
Grant D933,031 - Yoshida , et al. October 12, 2
2021-10-12
V-shape seal band for a semiconductor processing chamber
App 20210183680 - NOORBAKHSH; Hamid ;   et al.
2021-06-17
Composite seal member for semiconductor production apparatus
Grant D922,027 - Yoshida , et al. June 15, 2
2021-06-15
Composite seal member for semiconductor production apparatus
Grant D922,546 - Yoshida , et al. June 15, 2
2021-06-15
Seal
Grant D917,028 - Yoshida , et al. April 20, 2
2021-04-20
Ceramic electrostatic chuck having a V-shape seal band
Grant 10,943,808 - Noorbakhsh , et al. March 9, 2
2021-03-09
Seal member for use in semiconductor production apparatus
Grant D909,322 - Yoshida , et al. February 2, 2
2021-02-02
Seal member for use in semiconductor production apparatus
Grant D909,323 - Yoshida , et al. February 2, 2
2021-02-02
Seal
Grant D901,648 - Yoshida , et al. November 10, 2
2020-11-10
Composite seal member for semiconductor production apparatus
Grant D898,170 - Yoshida , et al. October 6, 2
2020-10-06
Composite seal
Grant D896,353 - Nakagawa Sept
2020-09-15
Seal
Grant D877,865 - Nakagawa
2020-03-10
Composite Seal Member
App 20190353250 - Kim; Sangho ;   et al.
2019-11-21
Seal Member
App 20190242480 - NAKAGAWA; Ippei ;   et al.
2019-08-08
Composite seal
Grant D822,181 - Nakagawa July 3, 2
2018-07-03
Composite seal
Grant D821,552 - Nakagawa , et al. June 26, 2
2018-06-26
Composite seal
Grant 9,892,945 - Nakagawa February 13, 2
2018-02-13
Composite sealing material
Grant D754,308 - Nakagawa April 19, 2
2016-04-19
Composite Seal
App 20150279706 - Nakagawa; Ippei
2015-10-01
Gate valve seal
Grant D633,991 - Nakagawa March 8, 2
2011-03-08
Method for production of bismuth (III) oxide
Grant 4,873,073 - Matsui , et al. October 10, 1
1989-10-10

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