Composite seal member for semiconductor production apparatus
Yoshida , et al. October 6, 2
U.S. patent number D898,170 [Application Number 35/506,052] was granted by the patent office on 2020-10-06 for composite seal member for semiconductor production apparatus. This patent grant is currently assigned to Valqua, Ltd.. The grantee listed for this patent is Valqua, Ltd.. Invention is credited to Sangho Kim, Ippei Nakagawa, Nobuhiro Yoshida.
| United States Patent | D898,170 |
| Yoshida , et al. | October 6, 2020 |
Composite seal member for semiconductor production apparatus
Claims
CLAIM The ornamental design for composite seal member for semiconductor production apparatus, as shown and described.
| Inventors: | Yoshida; Nobuhiro (Gojo, JP), Nakagawa; Ippei (Gojo, JP), Kim; Sangho (Gojo, JP) | ||||||||||
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| Applicant: |
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| Assignee: | Valqua, Ltd. (Tokyo,
JP) |
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| Family ID: | 72645470 | ||||||||||
| Appl. No.: | 35/506,052 | ||||||||||
| Filed: | May 14, 2018 |
International Registration
| Int'l Reg. No. | Int'l Reg. Date | Int'l Reg. Publication Date |
Hague Int'l Filing Date |
|---|---|---|---|
| DM/102918 | May 14, 2018 | Nov 16, 2018 | May 14, 2018 |
Foreign Application Priority Data
| Dec 1, 2017 [JP] | 2017-026882 | |||
| Dec 1, 2017 [JP] | 2017-026887 | |||
| Feb 8, 2018 [JP] | 2018-002528 | |||
| Current U.S. Class: | D23/269 |
| Current CPC Class: | F16J15/025 20130101 |
| Current International Class: | 2301 |
| Field of Search: | ;D23/269,262 ;D25/48.2,122,164 ;277/351-359,504,562,563,572,361-364,381,606,616,314,382,394,395 ;D15/48.2,122,164 |
References Cited [Referenced By]
U.S. Patent Documents
| 1805442 | May 1931 | Wallfisch |
| 4226431 | October 1980 | Jelinek |
| 4560174 | December 1985 | Bisi |
| 4834398 | May 1989 | Guzowski |
| 4946410 | August 1990 | Haman |
| D323024 | January 1992 | Petersson |
| D442609 | May 2001 | Quantz |
| D572348 | July 2008 | Arosio |
| D582436 | December 2008 | Shimomura |
| D582437 | December 2008 | Shimomura |
| D582438 | December 2008 | Shimomura |
| D582439 | December 2008 | Shimomura |
| D582440 | December 2008 | Shimomura |
| D582441 | December 2008 | Shimomura |
| D614271 | April 2010 | Weston |
| D616966 | June 2010 | Angell |
| D631066 | January 2011 | Itadani |
| D633991 | March 2011 | Nakagawa |
| D655401 | March 2012 | Muramatsu |
| D655797 | March 2012 | Muramatsu |
| D690336 | September 2013 | Gjertsen |
| 8608173 | December 2013 | Ryan |
| D722621 | February 2015 | Gray |
| D802723 | November 2017 | Miyamoto |
| D822181 | July 2018 | Nakagawa |
| D837685 | January 2019 | Miki |
| D848585 | May 2019 | Yamamoto |
| D848586 | May 2019 | Yamamoto |
| D849211 | May 2019 | Yamamoto |
| D864361 | October 2019 | Kim |
| D871561 | December 2019 | Kang |
| 2005/0001195 | January 2005 | Blease |
| 2009/0026717 | January 2009 | Tsuji |
| 2011/0018211 | January 2011 | Tsuji |
| 2011/0169229 | July 2011 | Hamade |
| 2015/0279706 | October 2015 | Nakagawa |
| 303747329 | Jul 2016 | CN | |||
| 303767365 | Aug 2016 | CN | |||
| 303910789 | Nov 2016 | CN | |||
| 303935774 | Nov 2016 | CN | |||
| 304006885 | Jan 2017 | CN | |||
| 304070470 | Mar 2017 | CN | |||
| D1581995 | Jul 2017 | JP | |||
| M252663 | Dec 2004 | TW | |||
| M379164 | Apr 2010 | TW | |||
| D143035 | Oct 2011 | TW | |||
| M428159 | May 2012 | TW | |||
| M499369 | Apr 2015 | TW | |||
| D168722 | Jul 2015 | TW | |||
| D181453 | Feb 2017 | TW | |||
| D181454 | Feb 2017 | TW | |||
| D183422 | Jun 2017 | TW | |||
Attorney, Agent or Firm: The Webb Law Firm
Description
1.1 is a perspective view of a composite seal member for semiconductor production apparatus, showing our new design;
1.2 is a front elevation view thereof;
1.3 is a rear elevation view thereof;
1.4 is a left side elevation view thereof;
1.5 is a right side elevation view thereof;
1.6 is a top view thereof;
1.7 is a bottom view thereof;
1.8 is a cross-sectional view thereof;
1.9 is an enlarged cross-sectional view of a portion thereof; and
1.10 is an enlarged cross-sectional view of a portion thereof in a condition of use.
The broken lines shown in Reproduction 1.10 are for the purposes of illustrating environmental structure and form no part of the claimed design.
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