Seal member for use in semiconductor production apparatus

Description

1.1 is a perspective view of a seal member for use in semiconductor production apparatus, showing our new design in accordance with a first embodiment of the present invention;

1.2 is a front elevation view thereof;

1.3 is a rear elevation view thereof;

1.4 is a left side elevation view thereof;

1.5 is a right side elevation view thereof;

1.6 is a top view thereof;

1.7 is a bottom view thereof;

1.8 is a cross-sectional view thereof;

1.9 is an enlarged cross-sectional view of a portion thereof;

1.10 is an enlarged cross-sectional view thereof in a condition of use.

2.1 is a perspective view of a seal member for use in semiconductor production apparatus, showing our new design in accordance with a second embodiment of the present invention;

2.2 is a front elevation view thereof;

2.3 is a rear elevation view thereof;

2.4 is a left side elevation view thereof;

2.5 is a right side elevation view thereof;

2.6 is a top view thereof;

2.7 is a bottom view thereof;

2.8 is a cross-sectional view thereof;

2.9 is an enlarged cross-sectional view of a portion thereof; and

2.10 is an enlarged cross-sectional view thereof in a condition of use.

In the Reproductions 1.10 and 2.10, the broken lines are for the purpose of illustrating portions of the seal member for use in semiconductor production apparatus that forms no part of the claimed design.

Claims

CLAIM The ornamental design for a seal member for use in semiconductor production apparatus, as shown and described.

---

Inventors:	Yoshida; Nobuhiro (Gojo, JP), Nakagawa; Ippei (Gojo, JP)
Applicant:	Name City State Country Type VALQUA, LTD. Tokyo N/A JP
Assignee:	Valqua, Ltd. (Tokyo, JP)
Appl. No.:	35/507,485
Filed:	April 1, 2019

---

International Registration

---

Int'l Reg. No.	Int'l Reg. Date	Int'l Reg. Publication Date	Hague Int'l Filing Date
DM/202455	Apr 1, 2019	Oct 4, 2019	Apr 1, 2019

---

Foreign Application Priority Data

---

Oct 12, 2018 [JP]			2018-022470
Oct 12, 2018 [JP]			2018-022471
Oct 12, 2018 [JP]			2018-022472
Oct 12, 2018 [JP]			2018-022473

Current U.S. Class:	D13/199; D23/269
Current International Class:	1399
Field of Search:	;D13/182,121,154 ;D8/436 ;D23/269,209 ;D9/779,419,454,520,416 ;D3/302 ;D34/29 ;D29/122 ;D14/436

---

References Cited [Referenced By]

---

U.S. Patent Documents

3815802	June 1974	Stevens
5057648	October 1991	Blough
5184107	February 1993	Maurer
5289932	March 1994	Dimeo
5464355	November 1995	Rothenberger
5621189	April 1997	Dodds
D499025	November 2004	Houk
7306237	December 2007	Tsuji
D562684	February 2008	Brashear
D633043	February 2011	Wada
D633991	March 2011	Nakagawa
D638522	May 2011	Yoshida
D689653	September 2013	Lowther
D733263	June 2015	Fujii
D738111	September 2015	Otto
D751380	March 2016	Torrison
D751381	March 2016	Torrison
D751382	March 2016	Torrison
D751383	March 2016	Torrison
D754308	April 2016	Nakagawa
D767234	September 2016	Kirkland
D774887	December 2016	Torrison
D783922	April 2017	Kirkland
9611940	April 2017	Khan
D800549	October 2017	Delle Cese
D802723	November 2017	Miyamoto
9892945	February 2018	Nakagawa
D813181	March 2018	Okajima
D819187	May 2018	Yamamoto
D821552	June 2018	Nakagawa
D822181	July 2018	Nakagawa
D836186	December 2018	Takahashi
D839091	January 2019	Torrison
D848585	May 2019	Yamamoto
D849211	May 2019	Yamamoto
D849559	May 2019	Swenson
D862404	October 2019	Murata
D864361	October 2019	Kim
D865920	November 2019	Takahashi
D871561	December 2019	Kang
D873981	January 2020	Yoshida
D875899	February 2020	Yoshida
D875900	February 2020	Yoshida
D877739	March 2020	Maus
D877865	March 2020	Nakagawa
D881822	April 2020	Wladyka
D885444	May 2020	Tsuji
D888888	June 2020	Widom
2015/0279706	October 2015	Nakagawa

Foreign Patent Documents

	D127505		Feb 2009		TW
	D149670		Oct 2012		TW
	D163769		Oct 2014		TW
	D164826		Dec 2014		TW
	D164827		Dec 2014		TW
	D166713		Mar 2015		TW
	D180129		Dec 2016		TW
	D183422		Jun 2017		TW

Primary Examiner: Shields; Rhea
Attorney, Agent or Firm: The Webb Law Firm

Images