Semiconductor device
Yokoyama , et al. Sept
U.S. patent number D859,334 [Application Number D/643,229] was granted by the patent office on 2019-09-10 for semiconductor device. This patent grant is currently assigned to Mitsubishi Electric Corporation. The grantee listed for this patent is Mitsubishi Electric Corporation. Invention is credited to Maki Hasegawa, Shigeru Mori, Shuhei Yokoyama.
| United States Patent | D859,334 |
| Yokoyama , et al. | September 10, 2019 |
Semiconductor device
Claims
CLAIM The ornamental design for a semiconductor device, as shown and described.
| Inventors: | Yokoyama; Shuhei (Tokyo, JP), Hasegawa; Maki (Tokyo, JP), Mori; Shigeru (Tokyo, JP) | ||||||||||
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| Applicant: |
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| Assignee: | Mitsubishi Electric Corporation
(Tokyo, JP) |
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| Appl. No.: | D/643,229 | ||||||||||
| Filed: | April 5, 2018 |
Foreign Application Priority Data
| Oct 26, 2017 [JP] | 2017-023790 | |||
| Oct 26, 2017 [JP] | 2017-023791 | |||
| Current U.S. Class: | D13/182 |
| Current International Class: | 1303 |
| Field of Search: | ;D13/182 |
References Cited [Referenced By]
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Attorney, Agent or Firm: Studebaker & Brackett PC
Description
FIG. 1 is a front, bottom and right side perspective view of a semiconductor device showing our new design;
FIG. 2 is a rear, top and left side perspective view thereof;
FIG. 3 is a front view thereof;
FIG. 4 is a rear view thereof;
FIG. 5 is a top view thereof;
FIG. 6 is a bottom view thereof;
FIG. 7 is a left side view thereof; and,
FIG. 8 is a right side view thereof.
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