U.S. patent number D855,027 [Application Number D/649,486] was granted by the patent office on 2019-07-30 for cover of seal cap for reaction chamber of semiconductor.
This patent grant is currently assigned to KOKUSAI ELECTRIC CORPORATION. The grantee listed for this patent is Hitachi Kokusai Electric Inc.. Invention is credited to Yusaku Okajima, Shuhei Saido, Hidenari Yoshida.
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United States Patent |
D855,027 |
Okajima , et al. |
July 30, 2019 |
Cover of seal cap for reaction chamber of semiconductor
Claims
CLAIM The ornamental design for a cover of seal cap for reaction
chamber of semiconductor, as shown and described.
Inventors: |
Okajima; Yusaku (Tokyo,
JP), Saido; Shuhei (Tokyo, JP), Yoshida;
Hidenari (Tokyo, JP) |
Applicant: |
Name |
City |
State |
Country |
Type |
Hitachi Kokusai Electric Inc. |
Tokyo |
N/A |
JP |
|
|
Assignee: |
KOKUSAI ELECTRIC CORPORATION
(Tokyo, JP)
|
Appl.
No.: |
D/649,486 |
Filed: |
May 30, 2018 |
Foreign Application Priority Data
|
|
|
|
|
Jan 22, 2018 [JP] |
|
|
2018-001070 |
|
Current U.S.
Class: |
D13/182 |
Current International
Class: |
1303 |
Field of
Search: |
;D13/182,184,162
;D10/49,50 |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
Primary Examiner: Oswecki; Elizabeth J
Attorney, Agent or Firm: Fitch, Even, Tabin & Flannery,
LLP
Description
FIG. 1 is a front, top, left side perspective view of a cover of
seal cap for reaction chamber of semiconductor showing our new
design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a right side elevational view thereof;
FIG. 5 is a left side elevational view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof; and,
FIG. 8 is a cross sectional view taken along line 8-8 in FIG.
6.
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