Semiconductor module

Chikamatsu , et al. October 30, 2

Patent Grant D832228

U.S. patent number D832,228 [Application Number D/602,897] was granted by the patent office on 2018-10-30 for semiconductor module. This patent grant is currently assigned to ROHM CO., LTD.. The grantee listed for this patent is ROHM CO., LTD.. Invention is credited to Kentaro Chikamatsu, Koshun Saito, Kenichi Yoshimochi.


United States Patent D832,228
Chikamatsu ,   et al. October 30, 2018

Semiconductor module

Claims

CLAIM The ornamental design for a semiconductor module, as shown and described.
Inventors: Chikamatsu; Kentaro (Kyoto, JP), Saito; Koshun (Kyoto, JP), Yoshimochi; Kenichi (Kyoto, JP)
Applicant:
Name City State Country Type

ROHM CO., LTD.

Kyoto-shi, Kyoto

N/A

JP
Assignee: ROHM CO., LTD. (Kyoto, JP)
Appl. No.: D/602,897
Filed: May 4, 2017

Foreign Application Priority Data

Nov 15, 2016 [JP] 2016-024832
Current U.S. Class: D13/182
Current International Class: 1303
Field of Search: ;D13/110,182 ;257/678,684,690,691 ;361/679.01,713,728,736,760,761,772,775,783,820 ;174/250,253 ;438/15,25,26,51,55,63,64,106

References Cited [Referenced By]

U.S. Patent Documents
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D259560 June 1981 Mochizuki
D259782 July 1981 Mochizuki
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D796459 September 2017 Iwai
2001/0038143 November 2001 Sonobe
Primary Examiner: Oswecki; Elizabeth J
Attorney, Agent or Firm: Hamre, Schumann, Mueller & Larson, P.C.

Description



FIG. 1 is a front, top, and right side perspective view of a semiconductor module showing our new design;

FIG. 2 is a rear, bottom, and left side perspective view thereof;

FIG. 3 is a front view thereof, the rear view being an identical image of FIG. 3;

FIG. 4 is a top plan view thereof;

FIG. 5 is a bottom plan view thereof; and,

FIG. 6 is a right side view thereof, the left side view being a mirror image of FIG. 6.

* * * * *


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