Semiconductor device package Patent Grant Celaya , et al. October 18, 2 [Semiconductor Components Industries LLC]

Semiconductor device package

Celaya , et al. October 18, 2

Patent Grant D510728

U.S. patent number D510,728 [Application Number D/211,047] was granted by the patent office on 2005-10-18 for semiconductor device package. This patent grant is currently assigned to Semiconductor Components Industries LLC. Invention is credited to Phillip Celaya, Michael J. Seddon, Darrell D. Truhitte.

United States Patent	D510,728
Celaya , et al.	October 18, 2005

Semiconductor device package

Claims

We claim the ornamental design for a semiconductor device package, as shown and described.

Inventors:	Celaya; Phillip (Gilbert, AZ), Truhitte; Darrell D. (Phoenix, AZ), Seddon; Michael J. (Gilbert, AZ)
Assignee:	Semiconductor Components Industries LLC (Phoenix, AZ)
Appl. No.:	D/211,047
Filed:	August 11, 2004

Current U.S. Class:	D13/182
Current International Class:	1303
Field of Search:	;D13/182 ;174/52.1,52.2,52.4,666,669,675,676,678,690,692,696,697,730,787 ;361/773,820 ;438/64,65

References Cited [Referenced By]

U.S. Patent Documents


D396847	August 1998	Nakayama et al.
D416236	November 1999	Kobayashi et al.
6232655	May 2001	Sugimura
D444132	June 2001	Iwanishi et al.
D466873	December 2002	Kasem et al.
D472528	April 2003	Kasem et al.
D476962	July 2003	Yoshihira et al.
D489338	May 2004	Seddon et al.

Primary Examiner: Reid; Stella
Assistant Examiner: Sikder; Selina

Description

FIG. 1 is a perspective view from the front left side and below the semiconductor device package showing our new design.

FIG. 2 is a top plan view thereof;

FIG. 3 is a bottom plan view thereof; and,

FIG. 4 is an elevational view from the front side thereof.

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