Celaya; Phillip
Patent Applications and Registrations
Patent applications and USPTO patent grants for Celaya; Phillip.The latest application filed is for "semiconductor devices and methods of making the same".
Company Profile
2.24.26
- Celaya; Phillip - Gilbert AZ
Patent Activity
| Patent | Date |
|---|---|
| Semiconductor packages Grant 11,049,843 - Celaya , et al. June 29, 2 | 2021-06-29 |
| Semiconductor Devices And Methods Of Making The Same App 20200312749 - KHOR; Swee Har ; et al. | 2020-10-01 |
| Semiconductor devices and methods of making the same Grant 10,727,170 - Khor , et al. | 2020-07-28 |
| Semiconductor Packages And Related Methods App 20190244928 - CELAYA; Phillip ; et al. | 2019-08-08 |
| Semiconductor packages with leadframes and related methods Grant 10,304,798 - Celaya , et al. | 2019-05-28 |
| Semiconductor Packages And Related Methods App 20180138144 - CELAYA; Phillip ; et al. | 2018-05-17 |
| Long-lasting Wettable Flanks App 20180090421 - THEN; Nam Khong ; et al. | 2018-03-29 |
| Semiconductor packages and related methods Grant 9,899,349 - Celaya , et al. February 20, 2 | 2018-02-20 |
| Semiconductor component and method of manufacture Grant 9,620,443 - Padmanabhan , et al. April 11, 2 | 2017-04-11 |
| Semiconductor Devices And Methods Of Making The Same App 20170062310 - KHOR; Swee Har ; et al. | 2017-03-02 |
| Semiconductor Component And Method Of Manufacture App 20170025340 - Padmanabhan; Balaji ; et al. | 2017-01-26 |
| Semiconductor Packages And Related Methods App 20160190095 - CELAYA; Phillip ; et al. | 2016-06-30 |
| Dual-flag stacked die package Grant 9,379,048 - Jones , et al. June 28, 2 | 2016-06-28 |
| Method For Manufacturing A Semiconductor Component And Structure App 20150035166 - Letterman, JR.; James P. ; et al. | 2015-02-05 |
| Dual-flag Stacked Die Package App 20140239472 - Jones; Frank Tim ; et al. | 2014-08-28 |
| Method For Manufacturing A Semiconductor Component And Structure Therefor App 20140151883 - Celaya; Phillip ; et al. | 2014-06-05 |
| Method of forming a semiconductor device and leadframe therefor Grant 8,581,416 - Massie , et al. November 12, 2 | 2013-11-12 |
| Method Of Forming A Semiconductor Device And Leadframe Therefor App 20130154073 - Massie; Harold L. ; et al. | 2013-06-20 |
| Semiconductor component and method of manufacture Grant 8,461,670 - Celaya , et al. June 11, 2 | 2013-06-11 |
| Method for manufacturing a semiconductor component Grant 8,324,026 - Celaya , et al. December 4, 2 | 2012-12-04 |
| Multi-chip semiconductor connector Grant 8,253,239 - Carney , et al. August 28, 2 | 2012-08-28 |
| Semiconductor Component And Method Of Manufacture App 20110298115 - Celaya; Phillip ; et al. | 2011-12-08 |
| Method for manufacturing a semiconductor component and structure therefor Grant 8,071,427 - Celaya , et al. December 6, 2 | 2011-12-06 |
| Method For Manufacturing A Semiconductor Component And Structure Therefor App 20110281397 - Celaya; Phillip ; et al. | 2011-11-17 |
| Multi-chip Semiconductor Connector App 20110068451 - Carney; Francis J. ; et al. | 2011-03-24 |
| Multi-chip semiconductor connector and method Grant 7,875,964 - Carney , et al. January 25, 2 | 2011-01-25 |
| Semiconductor package and method therefor Grant 7,825,505 - Celaya , et al. November 2, 2 | 2010-11-02 |
| Method For Manufacturing A Semiconductor Component And Structure Therefor App 20100187663 - Celaya; Phillip ; et al. | 2010-07-29 |
| Semiconductor Package And Method Therefor App 20100052145 - Celaya; Phillip ; et al. | 2010-03-04 |
| Semiconductor package and method therefor Grant 7,638,863 - Celaya , et al. December 29, 2 | 2009-12-29 |
| Multi-chip semiconductor connector assemblies Grant 7,508,060 - Carney , et al. March 24, 2 | 2009-03-24 |
| Multi-chip semiconductor connector assembly method Grant 7,498,195 - Carney , et al. March 3, 2 | 2009-03-03 |
| Semiconductor package structure having multiple heat dissipation paths and method of manufacture Grant 7,495,323 - St. Germain , et al. February 24, 2 | 2009-02-24 |
| Semiconductor Package And Method Therefor App 20080054424 - Celaya; Phillip ; et al. | 2008-03-06 |
| Semiconductor Package Structure Having Multiple Heat Dissipation Paths And Method Of Manufacture App 20080054438 - Germain; Stephen St. ; et al. | 2008-03-06 |
| Multi-chip Semiconductor Connector Assemblies App 20080006920 - Carney; Francis J. ; et al. | 2008-01-10 |
| Multi-chip semiconductor connector assemblies Grant 7,298,034 - Carney , et al. November 20, 2 | 2007-11-20 |
| Multi-chip Semiconductor Connector And Method App 20070126106 - Carney; Francis J. ; et al. | 2007-06-07 |
| Multi-chip Semiconductor Connector Assembly Method App 20070126107 - Carney; Francis J. ; et al. | 2007-06-07 |
| Multi-chip semiconductor connector assembly method Grant 7,202,105 - Carney , et al. April 10, 2 | 2007-04-10 |
| Multi-chip semiconductor connector and method Grant 7,202,106 - Carney , et al. April 10, 2 | 2007-04-10 |
| Multi-chip semiconductor connector assemblies App 20050285249 - Carney, Francis J. ; et al. | 2005-12-29 |
| Multi-chip semiconductor connector assembly method App 20050287703 - Carney, Francis J. ; et al. | 2005-12-29 |
| Multi-chip semiconductor connector and method App 20050285235 - Carney, Francis J. ; et al. | 2005-12-29 |
| Semiconductor device package Grant D510,728 - Celaya , et al. October 18, 2 | 2005-10-18 |
| Semiconductor device package Grant D504,874 - Celaya , et al. May 10, 2 | 2005-05-10 |
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