U.S. patent number D832,228 [Application Number D/602,897] was granted by the patent office on 2018-10-30 for semiconductor module.
This patent grant is currently assigned to ROHM CO., LTD.. The grantee listed for this patent is ROHM CO., LTD.. Invention is credited to Kentaro Chikamatsu, Koshun Saito, Kenichi Yoshimochi.
United States Patent |
D832,228 |
Chikamatsu , et al. |
October 30, 2018 |
Semiconductor module
Claims
CLAIM The ornamental design for a semiconductor module, as shown
and described.
Inventors: |
Chikamatsu; Kentaro (Kyoto,
JP), Saito; Koshun (Kyoto, JP), Yoshimochi;
Kenichi (Kyoto, JP) |
Applicant: |
Name |
City |
State |
Country |
Type |
ROHM CO., LTD. |
Kyoto-shi, Kyoto |
N/A |
JP |
|
|
Assignee: |
ROHM CO., LTD. (Kyoto,
JP)
|
Appl.
No.: |
D/602,897 |
Filed: |
May 4, 2017 |
Foreign Application Priority Data
|
|
|
|
|
Nov 15, 2016 [JP] |
|
|
2016-024832 |
|
Current U.S.
Class: |
D13/182 |
Current International
Class: |
1303 |
Field of
Search: |
;D13/110,182
;257/678,684,690,691
;361/679.01,713,728,736,760,761,772,775,783,820 ;174/250,253
;438/15,25,26,51,55,63,64,106 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Oswecki; Elizabeth J
Attorney, Agent or Firm: Hamre, Schumann, Mueller &
Larson, P.C.
Description
FIG. 1 is a front, top, and right side perspective view of a
semiconductor module showing our new design;
FIG. 2 is a rear, bottom, and left side perspective view
thereof;
FIG. 3 is a front view thereof, the rear view being an identical
image of FIG. 3;
FIG. 4 is a top plan view thereof;
FIG. 5 is a bottom plan view thereof; and,
FIG. 6 is a right side view thereof, the left side view being a
mirror image of FIG. 6.
* * * * *