U.S. patent application number 11/804528 was filed with the patent office on 2008-11-20 for semiconductor device manufacturing methods.
Invention is credited to Chong Kwang Chang, Alois Gutmann, Jingyu Lian, Matthias Lipinski, Len Yuan Tsou, Helen Wang, Haoren Zhuang.
Application Number | 20080286698 11/804528 |
Document ID | / |
Family ID | 40027862 |
Filed Date | 2008-11-20 |
United States Patent
Application |
20080286698 |
Kind Code |
A1 |
Zhuang; Haoren ; et
al. |
November 20, 2008 |
Semiconductor device manufacturing methods
Abstract
Methods for manufacturing semiconductor devices are disclosed.
One preferred embodiment is a method of processing a semiconductor
device. The method includes providing a workpiece having a material
layer to be patterned disposed thereon. A masking material is
formed over the material layer of the workpiece. The masking
material includes a lower portion and an upper portion disposed
over the lower portion. The upper portion of the masking material
is patterned with a first pattern. An additional substance is
introduced and the lower portion of the masking material is
patterned. The masking material and the additional substance are
used to pattern the material layer of the workpiece.
Inventors: |
Zhuang; Haoren; (Hopewell
Junction, NY) ; Chang; Chong Kwang; (Suwon-City,
KR) ; Gutmann; Alois; (Poughkeepsie, NY) ;
Lian; Jingyu; (Hopewell Junction, NY) ; Lipinski;
Matthias; (Poughkeepsie, NY) ; Tsou; Len Yuan;
(New City, NY) ; Wang; Helen; (LaGrangeville,
NY) |
Correspondence
Address: |
SLATER & MATSIL LLP
17950 PRESTON ROAD, SUITE 1000
DALLAS
TX
75252
US
|
Family ID: |
40027862 |
Appl. No.: |
11/804528 |
Filed: |
May 18, 2007 |
Current U.S.
Class: |
430/323 ;
430/324 |
Current CPC
Class: |
H01L 21/32139 20130101;
H01L 21/0337 20130101; H01L 21/84 20130101; H01L 21/0338
20130101 |
Class at
Publication: |
430/323 ;
430/324 |
International
Class: |
H01L 21/02 20060101
H01L021/02; G03C 5/00 20060101 G03C005/00 |
Claims
1. A method of processing a semiconductor device, the method
comprising: providing a workpiece, the workpiece comprising a
material layer to be patterned disposed thereon; forming a masking
material over the material layer of the workpiece, the masking
material comprising a lower portion and an upper portion disposed
over the lower portion; patterning the upper portion of the masking
material with a first pattern; introducing an additional substance
and patterning the lower portion of the masking material; and using
the masking material and the additional substance to pattern the
material layer of the workpiece.
2. The method according to claim 1, wherein using the masking
material and the additional substance to pattern the material layer
of the workpiece comprises forming a second pattern in the material
layer, the second pattern comprising an enlargement of the first
pattern in the upper portion of the masking material.
3. The method according to claim 1, wherein introducing the
additional substance and patterning the lower portion of the
masking material comprises patterning the lower portion of the
masking material with the first pattern and forming the additional
substance on sidewalls of the lower portion of the masking
material.
4. The method according to claim 1, wherein introducing the
additional substance comprises lining the lower portion of the
masking material with a redeposition component of a patterning
process used to pattern the lower portion of the masking
material.
5. The method according to claim 1, wherein introducing the
additional substance comprises forming a polymer material over the
patterned upper portion of the masking material and over a top
surface of the lower portion of the masking material, before
patterning the lower portion of the masking material.
6. The method according to claim 1, wherein forming the masking
material over the material layer of the workpiece comprises forming
a lower portion comprising an anti-reflective coating and forming
an upper portion comprising a photosensitive material.
7. A method of manufacturing a semiconductor device, the method
comprising: providing a workpiece; forming a material layer to be
patterned over the workpiece; disposing an anti-reflective coating
over the material layer; disposing a layer of photosensitive
material over the anti-reflective coating; patterning the layer of
photosensitive material with a first pattern; introducing an
additional substance and patterning the anti-reflective coating;
and using the layer of photosensitive material, the additional
substance, and the anti-reflective coating to pattern the material
layer with a second pattern, wherein the second pattern is larger
than the first pattern.
8. The method according to claim 7, wherein introducing the
additional substance comprises introducing a by-product during the
patterning of the anti-reflective coating, or wherein introducing
the additional substance comprises depositing a polymer material
over the patterned layer of photosensitive material, after
patterning the layer of photosensitive material with the first
pattern.
9. The method according to claim 7, wherein the first pattern
comprises a plurality of first features, the plurality of first
features comprising a first distance from an end of one first
feature to an end of an adjacent first feature, and wherein the
second pattern comprises a plurality of second features, the
plurality of second features comprising a second distance from an
end of one second feature to an end of an adjacent second feature,
the second distance being less than the first distance.
10. The method according to claim 9, wherein the plurality of
second features comprises a plurality of transistor gates.
11. A semiconductor device manufactured in accordance with the
method of claim 7.
12. The method according to claim 7, wherein patterning the layer
of photosensitive material with the first pattern comprises using a
single lithography mask or using a plurality of lithography
masks.
13. The method according to claim 7, further comprising disposing
an organic dielectric layer (ODL) over the material layer before
disposing the anti-reflective coating over the material layer,
wherein patterning the anti-reflective coating further comprises
patterning the ODL, and wherein patterning the material layer with
the second pattern further comprises using the ODL.
14. A method of patterning a material layer of a semiconductor
device, the method comprising: providing a workpiece, the workpiece
comprising a material layer to be patterned disposed thereon;
forming an anti-reflective coating over the material layer; forming
a layer of photosensitive material over the anti-reflective
coating; exposing the layer of photosensitive material using a
lithography mask; developing the layer of photosensitive material;
etching away portions of the layer of photosensitive material to
form a first pattern in the layer of photosensitive material;
etching the anti-reflective coating using the layer of
photosensitive material as a mask using an etch process, wherein
the etch process includes a redeposition component that forms on
sidewalls of the anti-reflective coating during the etch process,
forming a second pattern in the anti-reflective coating and
redeposition component, the second pattern being larger than the
first pattern; and patterning the material layer of the workpiece
with the second pattern using the layer of photosensitive material,
the redeposition component, and the anti-reflective coating as a
mask.
15. The method according to claim 14, wherein the etch process
comprises a carbon fluorine-oxygen gas chemistry, CF.sub.4/O.sub.2,
or CF.sub.4/CH.sub.2F.sub.2/O.sub.2.
16. The method according to claim 14, wherein the redeposition
component reduces line shortening of features formed in the
material layer of the workpiece.
17. The method according to claim 14, wherein the first pattern
comprises a plurality of first features comprising a first width
and a first length, wherein the second pattern comprises a
plurality of second features comprising a second width and a second
length, wherein the second length is greater than the first length,
and wherein the second width is greater than the first width.
18. The method according to claim 17, wherein the second length is
greater than the first length by a first amount, and wherein the
second width is greater than the first width by a second amount,
the first amount being greater than the second amount.
19. A method of patterning a material layer of a semiconductor
device, the method comprising: providing a workpiece, the workpiece
comprising a material layer to be patterned disposed thereon;
forming an anti-reflective coating over the material layer of the
workpiece; forming a layer of photosensitive material over the
anti-reflective coating; patterning the layer of photosensitive
material using a lithography mask, exposing portions of the
anti-reflective coating; depositing a thin layer of material over
the layer of photosensitive material and the exposed portions of
the anti-reflective coating; etching the anti-reflective coating
using the thin layer of material and the layer of photosensitive
material as a mask, wherein the thin layer of material remains on
sidewalls of the layer of photosensitive material; and patterning
the material layer using at least the thin layer of material, the
layer of photosensitive material, and the anti-reflective coating
as a mask, wherein the thin layer of material enlarges a pattern
transferred to the material layer from the lithography mask.
20. The method according to claim 19, wherein etching the
anti-reflective coating using the thin layer of material and the
layer of photosensitive material as a mask comprises using an etch
process, wherein the etch process includes a redeposition component
that forms on sidewalls of the anti-reflective coating during the
etch process, wherein patterning the material layer further
comprises using the redeposition component as the mask, and wherein
the redeposition component further enlarges the pattern transferred
to the material layer from the lithography mask.
21. The method according to claim 19, wherein the thin layer of
material comprises a polymer comprising a thickness of about 20 nm
or less.
22. The method according to claim 19, wherein the material layer
comprises a conductive material, a semiconductive material, an
insulator, a hard mask, or combinations thereof.
23. A method of manufacturing a semiconductor device, the method
comprising: providing a workpiece; forming a material layer over
the workpiece; forming a first anti-reflective coating over the
workpiece; disposing a first photosensitive material over the first
anti-reflective coating; exposing the first photosensitive material
and the first anti-reflective coating using a first lithography
mask, the first lithography mask comprising a first portion of a
pattern; developing the first photosensitive material, forming the
first portion of the pattern in the first photosensistive material;
using the first photosensitive material and/or the first
anti-reflective coating as a mask to form the first portion of the
pattern in the material layer; removing the first photosensitive
material and the first anti-reflective coating; forming a second
anti-reflective coating over the patterned material layer and
exposed portions of the workpiece; disposing a second
photosensitive material over the second anti-reflective coating;
exposing the second photosensitive material using a second
lithography mask, the second lithography mask comprising a second
portion of a pattern, the second portion of the pattern comprising
a different pattern than the first portion of the pattern and
intersecting in regions with the first portion of the pattern;
developing the second photosensitive material, forming the second
portion of the pattern in the second photosensistive material;
forming a polymer material over the patterned second photosensitive
material and over exposed portions of the second anti-reflective
coating; etching portions of the second anti-reflective coating
using the polymer material and the patterned second photosensitive
material as a mask using an anisotropic etch process; and using the
polymer material and the patterned second photosensitive material
and/or the patterned second anti-reflective coating as a mask to
pattern the material layer of the workpiece with an enlarged second
portion of the pattern.
24. The method according to claim 23, wherein the first lithography
mask comprises a lithography mask for a plurality of elongated
transistor gates, wherein the second lithography mask comprises a
cutter lithography mask adapted to cut the ends of the plurality of
elongated transistor gates patterned by the first lithography mask,
and wherein the polymer material decreases a tip-to-tip distance
between adjacent ends of transistor gates formed in the material
layer.
25. The method according to claim 24, wherein a length of the
transistor gates formed in the material layer is greater than a
length of a pattern in the second lithography mask by about twice a
thickness of the polymer material.
26. The method according to claim 23, wherein the anisotropic etch
process for etching the second anti-reflective coating using the
polymer material and the second photosensitive material includes a
redeposition component that forms on sidewalls of the second
anti-reflective coating during the etch process, wherein patterning
the material layer further comprises using the redeposition
component as the mask, and wherein the redeposition component
further enlarges the second portion of the pattern transferred to
the material layer from the second lithography mask.
27. The method according to claim 23, further comprising
introducing a tapered profile to the material layer when using the
polymer material and the patterned second photosensitive material
and/or the patterned second anti-reflective coating as a mask to
pattern the material layer of the workpiece.
Description
TECHNICAL FIELD
[0001] The present invention relates generally to the fabrication
of semiconductor devices, and more particularly to the fabrication
of transistors and other features.
BACKGROUND
[0002] Semiconductor devices are used in a variety of electronic
applications, such as personal computers, cell phones, digital
cameras, and other electronic equipment, as examples. Semiconductor
devices are typically fabricated by sequentially depositing
insulating or dielectric layers, conductive layers, and
semiconductive layers of material over a semiconductor substrate,
and patterning the various layers using lithography to form circuit
components and elements thereon.
[0003] Optical photolithography involves projecting or transmitting
light through a pattern made of optically opaque areas and
optically clear areas on a lithography mask or reticle. For many
years in the semiconductor industry, optical lithography techniques
such as contact printing, proximity printing, and projection
printing have been used to pattern material layers of integrated
circuits. In optical lithography, lens projection systems and
transmission lithography masks are used for patterning, wherein
light is passed through the lithography mask to impinge upon a
photosensitive material layer disposed on a semiconductor wafer or
workpiece. The patterned photosensistive material layer is then
used as a mask to pattern a material layer of the workpiece.
[0004] A transistor is an element that is utilized extensively in
semiconductor devices. There may be millions of transistors on a
single integrated circuit (IC), for example. A common type of
transistor used in semiconductor device fabrication is a metal
oxide semiconductor field effect transistor (MOSFET). A transistor
typically includes a gate dielectric disposed over a channel
region, and a gate formed over the gate dielectric. A source region
and a drain region are formed on either side of the channel region
within a substrate or workpiece.
[0005] A complementary metal oxide semiconductor (CMOS) device is a
device that utilizes p channel metal oxide semiconductor (PMOS)
field effect transistors (FETs) and n channel metal oxide
semiconductor (PMOS) field effect transistors (FETs) in a
complementary arrangement. One example of a memory device that uses
both PMOS FETs and NMOS FETs is a static random access memory
(SRAM) device. A typical SRAM device includes arrays of thousands
of SRAM cells, with each SRAM cell having four or six transistors,
for example. A commonly used SRAM cell is a six-transistor (6T)
SRAM cell, which has two PMOS FETs interconnected with four NMOS
FETs.
[0006] One challenge in transistor manufacturing processes is the
patterning of the transistor gates. Reducing the final tip-to-tip
(T2T) distance of gate conductor line ends in SRAM cells to the
desired target values has become one of the major patterning
challenges for CMOS technologies with smaller ground rules, for
example. Limitations in optical resolution and space angle
dependent variations in etch/redeposition processes may result in
device features not printing in desired shapes or sizes. Efforts to
compensate for line end shortening in patterned device structures
by length corrections of corresponding mask features may be
restricted by geometrical limitations on the mask or limited
resolution capability of the exposure tool.
[0007] Thus, what are needed in the art are improved methods of
patterning transistor gates and other features of semiconductor
devices.
SUMMARY OF THE INVENTION
[0008] These and other problems are generally solved or
circumvented, and technical advantages are generally achieved, by
preferred embodiments of the present invention, which provide novel
methods of reducing tip-to-tip distance between features by
optimizing lithography and reactive ion etch (RIE) processes.
[0009] In accordance with a preferred embodiment of the present
invention, a method of processing a semiconductor device includes
providing a workpiece having a material layer to be patterned
disposed thereon. A masking material is formed over the material
layer of the workpiece. The masking material includes a lower
portion and an upper portion disposed over the lower portion. The
upper portion of the masking material is patterned with a first
pattern. An additional substance is introduced and the lower
portion of the masking material is patterned. The masking material
and the additional substance are used to pattern the material layer
of the workpiece.
[0010] The foregoing has outlined rather broadly the features and
technical advantages of embodiments of the present invention in
order that the detailed description of the invention that follows
may be better understood. Additional features and advantages of
embodiments of the invention will be described hereinafter, which
form the subject of the claims of the invention. It should be
appreciated by those skilled in the art that the conception and
specific embodiments disclosed may be readily utilized as a basis
for modifying or designing other structures or processes for
carrying out the same purposes of the present invention. It should
also be realized by those skilled in the art that such equivalent
constructions do not depart from the spirit and scope of the
invention as set forth in the appended claims.
BRIEF DESCRIPTION OF THE DRAWINGS
[0011] For a more complete understanding of the present invention,
and the advantages thereof, reference is now made to the following
descriptions taken in conjunction with the accompanying drawings,
in which:
[0012] FIG. 1 shows a top view of a lithography mask in accordance
with a preferred embodiment of the present invention, having a
pattern for a plurality of transistor gates formed thereon;
[0013] FIGS. 2 through 6 show cross-sectional views of a method of
patterning a plurality of gates using the lithography mask of FIG.
1 in accordance with a preferred embodiment of the present
invention;
[0014] FIG. 7 shows a top view of a semiconductor device that has
been patterned using the lithography mask of FIG. 1 and the method
illustrated in FIGS. 2 through 6;
[0015] FIG. 8 shows a top view of a lithography mask in accordance
with another preferred embodiment of the present invention;
[0016] FIGS. 9 through 12 show cross-sectional views of a method of
patterning a plurality of gates using the lithography mask of FIG.
8 in accordance with a preferred embodiment of the present
invention;
[0017] FIG. 13 shows a top view of a semiconductor device that has
been patterned using the lithography mask of FIG. 8 and the method
illustrated in FIGS. 9 through 12;
[0018] FIGS. 14 and 15 show top views of lithography masks in
accordance with yet another preferred embodiment of the present
invention;
[0019] FIGS. 16 through 18 show perspective views of a method of
patterning a plurality of gates using the lithography masks of
FIGS. 14 and 15 in accordance with a preferred embodiment of the
present invention;
[0020] FIG. 19 shows a top view of the semiconductor device shown
in FIG. 18; and
[0021] FIG. 20 shows a perspective view, and FIG. 21 shows a top
view of a semiconductor device that has been patterned using the
lithography masks of FIGS. 14 and 15 and the method illustrated in
FIGS. 16 through 19.
[0022] Corresponding numerals and symbols in the different figures
generally refer to corresponding parts unless otherwise indicated.
The figures are drawn to clearly illustrate the relevant aspects of
the preferred embodiments and are not necessarily drawn to
scale.
DETAILED DESCRIPTION OF ILLUSTRATIVE EMBODIMENTS
[0023] The making and using of the presently preferred embodiments
are discussed in detail below. It should be appreciated, however,
that the present invention provides many applicable inventive
concepts that may be embodied in a wide variety of specific
contexts. The specific embodiments discussed are merely
illustrative of specific ways to make and use the invention, and do
not limit the scope of the invention.
[0024] The present invention will be described with respect to
preferred embodiments in a specific context, namely in the
patterning of transistor gates of SRAM devices. The invention may
also be applied, however, to the patterning of other features of
semiconductor devices, particularly features having a repeating
pattern, wherein positioning the features closer together in a
controlled manner is desired. Embodiments of the invention may also
be implemented in other semiconductor applications such as other
types of memory devices, logic devices, mixed signal devices, and
other applications, as examples.
[0025] Reducing the tip-to-tip distance between transistor gates is
a key challenge for achieving high density, particularly in
applications such as SRAM devices. Both a small pitch (e.g.,
between elongated edges) and small tip-to-tip distance (e.g.,
between short edges) between adjacent gates are required in some
designs. However, there are limitations in existing lithography
capabilities in printing small tip-to-tip distances. In some etch
processes, the etch process itself contributes to a line end
shortening effect, for example.
[0026] Embodiments of the present invention provide methods for
reducing etch-related line end shortening effects. The size of the
features is made slightly larger using several methods or
combinations thereof, to be described further herein, resulting in
reducing the space between the features. In some embodiments, the
size of the features is slightly enlarged by the selection of the
gas chemistries used to open an anti-reflective coating (ARC)
disposed beneath a layer of photosensitive material, resulting in a
redeposition of etch-protective material on the sidewalls of the
ARC, which slightly enlarges features formed in a material layer
and reduces the space between features. In other embodiments, the
size of the features is slightly enlarged by the introduction of a
polymer material after the patterning of the photoresist but before
the opening of the anti-reflective coating. The polymer material
coats the patterned photosensitive material sidewalls, making the
patterns formed in the anti-reflective coating and the patterned
material layer slightly larger and also reducing the space between
the features.
[0027] A first preferred embodiment of the present invention will
be described with reference to FIGS. 1 through 7, in which an etch
chemistry used to open an anti-reflective coating is selected that
has a redeposition component during the etch process. Referring
first to FIG. 1, a lithography mask 101 is shown in a top view. The
lithography mask 101 comprises a bright field binary mask that
includes a substantially opaque material 105 attached or coupled to
a substantially transparent material 103. The substantially opaque
material 105 preferably comprises a material that is opaque to
light or energy, such as chromium or other opaque material. The
substantially transparent material 103 preferably comprises a
transparent material such as quartz or glass, although other
materials may also be used. The lithography mask 101 may also
comprise an alternating phase shift mask, an attenuating mask, a
dark field mask, or other types of masks, as examples, not
shown.
[0028] The opaque material 105 of the lithography mask 101 in
accordance with a preferred embodiment of the present invention
comprises a pattern for a plurality of transistor gates formed
thereon. The pattern preferably comprises a plurality of opaque
features formed in the opaque material 105. The patterns for the
features comprised of the opaque material 105 are preferably
arranged in a plurality of rows and columns, as shown in FIG. 1.
The patterns for the features may comprise a plurality of opaque
substantially rectangular shapes having rounded ends, or the
feature patterns may comprise other shapes, such as a plurality of
square, round, elliptical, triangular, rectangular, polygonal, or
trapezoidal features. Alternatively, the patterns for the features
in the opaque material 105 may also comprise other shapes, for
example. The rows and columns of the feature patterns may be
staggered, e.g., in alternating rows or columns in pairs, as shown,
staggered singularly (not shown), or alternatively, the feature
patterns may be aligned singularly or in pairs (see FIG. 8) in rows
and columns. The pattern features may also be arranged in other
configurations, for example.
[0029] In some embodiments, the patterns for the features
preferably comprise a width (e.g., dimension d.sub.1) along at
least one side comprising a minimum feature size of the lithography
system the manufacturing process will be used in, and the patterns
for the features may be spaced apart by the same minimum feature
size, as an example. The width d.sub.1 and spaces may also comprise
dimensions greater than the minimum feature size, alternatively.
The patterns for the features in the opaque material 105 comprise a
length represented by dimension d.sub.2. The length-wise ends of
the patterns for the features in the opaque material 105 are
separated from adjacent patterns for features by a tip-to-tip
dimension represented by dimension d.sub.3. The patterns for the
corresponding features on the semiconductor device, after being
multiplied by the demagnification (reduction) factor of the
exposure tool, which is generally 4, as an example (although
exposure tools with other reduction factors or 1:1 ratios may also
be used), may comprise a width or dimension d.sub.1 of about 100 nm
or less, a length or dimension d.sub.2 of about 500 nm or less, and
a tip-to-tip distance or dimension d.sub.3 of about 150 nm or less
in some applications, as examples, although the patterns for the
features in the opaque material 105 of the mask 101 may also
comprise other dimensions.
[0030] Note that the patterns for features in the opaque material
105 of the lithography mask 101 may also include small protrusions
or serifs along their length or at their ends, for optical
proximity correction (OPC) in the lithography process, for example,
not shown. The OPC structures are not printed on a material layer
during a lithography process, but rather, accommodate at least
partially for diffraction effects in the lithography process and
system.
[0031] FIGS. 2 through 6 show cross-sectional views of a method of
patterning a plurality of transistor gates using the lithography
mask 101 of FIG. 1 in accordance with a preferred embodiment of the
present invention, wherein an anti-reflective coating open etch
step is optimized to control the amount of line end shortening.
FIG. 2 illustrates a cross-sectional view of a semiconductor device
100 patterned using the lithography mask 101 at "2-2" in FIG. 1,
for example.
[0032] To manufacture a semiconductor device 100 using the
lithography mask 101 of FIG. 1, first, a workpiece 102 is provided.
The workpiece 102 may include a semiconductor substrate comprising
silicon or other semiconductor materials covered by an insulating
layer, for example. The workpiece 102 may also include other active
components or circuits, not shown. The workpiece 102 may comprise
silicon oxide over single-crystal silicon, for example. The
workpiece 102 may include other conductive layers or other
semiconductor elements, e.g., transistors, diodes, etc. Compound
semiconductors, GaAs, InP, Si/Ge, or SiC, as examples, may be used
in place of silicon. The workpiece 102 may comprise a
silicon-on-insulator (SOI) substrate, for example.
[0033] A material layer 104/106 to be patterned is formed over the
workpiece 102. The material layer 104/106 may comprise a gate
dielectric material 104 disposed over the workpiece 102 and a gate
material 106 disposed over the gate dielectric material 104, as
examples, although alternatively, the material layer 104/106 may
comprise other materials. The gate dielectric material 104 may
comprise an insulating material such as silicon dioxide, silicon
nitride, a high dielectric constant (k) material, or combinations
or multiple layers thereof, as examples. The gate dielectric
material 104 may comprise a thickness of about 300 Angstroms or
less, for example. The gate material 106 may comprise a
semiconductive material such as polysilicon or a conductor such as
a metal, or combinations or multiple layers thereof, as examples.
The gate material 106 may comprise a thickness of about 2,000
Angstroms or less, for example. Alternatively, the gate dielectric
material 104 and the gate material 106 may comprise other materials
and dimensions. The material layer 104/106 may also include an
optional hard mask disposed over the gate material 106, for
example, not shown. The material layer 104/106 may comprise a
nitride material layer disposed proximate a top surface thereof
that is used as a mask for a later etch process, as another
example, also not shown.
[0034] A masking material 110/114 is formed over the material layer
104/106 to be patterned, as shown in FIG. 2. The masking material
110/114 preferably comprises an anti-reflective coating 110
disposed over the material layer 104/106, and a layer of
photosensitive material 114 disposed over the anti-reflective
coating 110. The anti-reflective coating 110 is also referred to
herein as a-lower portion 110 of the masking material 110/114. The
anti-reflective coating 110 may comprise an organic material, for
example, although other materials may also be used. The masking
material 110/114 may include an optional organic dielectric layer
(ODL) also comprising an organic material disposed beneath the
anti-reflective coating 110 in embodiments, not shown. The layer of
photoresist 114 is also referred to herein as an upper portion 114
of the masking material 110/114, for example.
[0035] The upper portion 114 of the masking material 110/114 is
patterned with a first pattern, as shown at 114a, using the
lithography mask 101 shown in FIG. 1. The first pattern comprises
substantially the same shape as the pattern in the opaque material
105 of the lithography mask (e.g., before OPC structures are added
to the mask 101), for example. The first pattern may exhibit line
shortening of pattern features of the lithography mask 101 in some
embodiments, for example. The masking material 110/114 is exposed
to light or energy through or reflected from the mask 101 to expose
portions of the layer of photoresist 114 not protected by the mask
101, leaving portions 114a of the layer of photoresist 114
unexposed. The layer of photoresist 114 is then developed, and
exposed portions of the layer of photoresist 114 are etched away,
as shown in FIG. 3.
[0036] Next, an additional substance is introduced and the lower
portion 110, e.g., the anti-reflective coating 110 of the masking
material 110/114 is patterned or opened using an etch process 116,
as shown in FIG. 3. In this embodiment, the additional substance
117 that is introduced comprises a by-product of the etch process
116 used to pattern the lower portion of the masking material 110.
The etch process 116 preferably comprises a reactive ion etch (RIE)
process that preferably comprises a redeposition component 117
(e.g., also referred to herein as an additional substance 117) that
redeposits, lines, or forms on sidewalls of the anti-reflective
coating 110 as the anti-reflective coating 110 is etched away, for
example. The semiconductor device 100 is shown in FIG. 4 after the
etch process 116 for the anti-reflective coating 110 is
completed.
[0037] The redeposition component 117 may comprise a dimension
d.sub.4 of about 20 nm or less of a material such as a polymer
material. The redeposition component 117 preferably comprises a
polymer, and may comprise C--F--O--Si, or a material comprising C,
F, O, Si, or combinations thereof, as examples. Alternatively, the
redeposition component 117 may also comprise other dimensions and
materials. The redeposition component 117 preferably comprises a
material that is resistant to the etch chemistries that are used
later to pattern the material layer 104/106, for example.
[0038] The etch process 116 is preferably selected to achieve a
desired material type and thickness of the redeposition component
117, in accordance with embodiments of the present invention. For
example, in a preferred embodiment, a pure carbon fluorine oxygen
(CF.sub.4/O.sub.2) gas chemistry is used as the gas chemistry for
the etch process 116. In another preferred embodiment,
CF.sub.4/CH.sub.2F.sub.2/O.sub.2 may be used for the etch process
116, as another example. Alternatively, other gas chemistries may
be used for the etch process 116, such as other
carbon-fluorine-oxygen gas chemistries or other gas
chemistries.
[0039] The material layer 104/106 is then patterned using the layer
of photoresist 114, the additional substance 117, the optional ODL
if present, and the anti-reflective coating 110 as a mask, while
exposed portions of the material layer 104/106 are etched away. A
portion of or the entire layer of photoresist 114 may be consumed
or removed during the etch process to pattern the material layer
104/106, as shown in FIG. 5. Any remaining anti-reflective coating
110 and photoresist 114 are then removed.
[0040] The pattern formed in the material layer 104/106 comprises a
second pattern, wherein the second pattern is larger than the first
pattern of the layer of photoresist 114. The second pattern may
comprise a slight enlargement of the first pattern, for example.
The enlarged second pattern may provide a slight enlargement of the
first pattern to accommodate for line shortening during the
transfer of the mask 101 pattern to the layer of photoresist 114,
for example. Or, the second pattern may intentionally be slightly
larger than the first pattern in order to reduce the tip-to-tip
distance d.sub.8 between adjacent features in the material layer
104/106, as another example, as shown in FIG. 6.
[0041] Because of the increased width, shown as dimension d.sub.5
in FIGS. 4 and 5, of the anti-reflective coating 110 by the width
or dimension d.sub.4 of the additional substance or redeposition
component 117, the width of the features formed in the material
layer 104/106 also comprises a width or dimension d.sub.5, as shown
in FIG. 5. The widths (dimension d.sub.5) of the features formed in
the material layer 104/106 are shown, which are slightly larger
that the widths (dimension d.sub.1) of the feature patterns of the
lithography mask 101 in FIG. 1, e.g., by an amount d.sub.4 on
either side.
[0042] Note that the material layer 104/106 may comprise a single
layer of material rather than two material layers 104 and 106, as
shown. Furthermore, only the gate material 106 may be patterned
using the methods described herein, leaving the gate dielectric
material 104 unpatterned (not shown). The gate dielectric material
104 may be patterned in a later manufacturing step in these
embodiments, for example.
[0043] In FIG. 6, a cross-sectional view of the semiconductor
device 100 of FIG. 5 is shown rotated by ninety degrees. FIG. 7
shows a top view of a semiconductor device 100 that has been
patterned using the lithography mask 101 of FIG. 1 and the method
illustrated in FIGS. 2 through 6. The lengths (dimension d.sub.7)
of the features formed in the material layer 104/106 are shown in
FIGS. 6 and 7. The lengths (dimension d.sub.7) of the features are
slightly larger than the lengths (dimension d.sub.2) of the feature
patterns on the mask 101, e.g., by an amount d.sub.6 on either
side. Note that isolation regions 118, which may comprise shallow
trench isolation (STI) or other type of isolation structures, are
also shown in FIG. 6 and in FIG. 7 in phantom. The amount of
overlap of transistor gates (e.g., features formed in the gate
material 106) with isolation regions 118 and/or active areas can be
a critical dimension in a semiconductor device 100 design, for
example, and embodiments of the present invention provide increased
control of such overlaps with underlying structures, and a
reduction of the line shortening effect on patterned features.
[0044] Advantageously, the features formed in the material layer
104/106 are spaced apart by a decreased amount or tip-to-tip
dimension d.sub.8, as shown in FIG. 6. Because the ends of the
features have been lengthened by amount d.sub.6 (see FIG. 5) due to
the novel redeposition component or additional substance 117 of the
etch process 116, the tip-to-tip dimension d.sub.8 is decreased
compared with the tip-to-tip dimension d.sub.3 of the pattern on
the mask 101, forming a more dense array of transistor gates 106,
for example.
[0045] Experimental results show that due to the shape of the
feature patterns of the lithography mask 101 and due to the nature
of the etch process used to pattern the material layer 104/106,
narrower portions of the features (the width, d.sub.5) may tend to
not be increased in size as much as longer portions (the length,
d.sub.7) of the features are increased. For example, dimension
d.sub.6 of the amount of increase of the length d.sub.7 of the
features may be greater than dimension d.sub.4 of the amount of
increase of the width d.sub.5, advantageously, in accordance with
this embodiment of the present invention.
[0046] Table 1 shows experimental results after the novel
optimization of the anti-reflective coating 110 open etch step of
the first embodiment of the present invention for two SRAM cells,
SRAM cell A and SRAM cell B, using two etch processes. The
manufacturing method provides a high amount of leverage for
minimizing etch-induced line end shortening. For example, Table 1
shows the variation of line width for polysilicon gates and
tip-to-tip distance as a function of the ARC 110 open gas chemistry
(e.g., for the etch process 116).
TABLE-US-00001 TABLE 1 Final CD Final CD Develop CD of Process A of
Process B SRAM cell A SRAM NFET 107.5 92.1 75.9 SRAM PFET 106.4
95.1 80.1 Tip-to-tip 105.9 174.7 140.6 Line end pull 4.5 1.1 Back
ratio (LEPBR) SRAM cell B SRAM NFET 114.7 96.2 78.4 SRAM PFET 107.1
97.1 82.3 Tip-to-tip 89.5 161.5 130.2 LEPBR 3.9 1.1
[0047] Table 1 shows the line end pull-back ratio (LEPBR), i.e.,
the ratio of the final line end pull-back vs. the lateral critical
dimension (CD) reduction/edge for two different gases chemistries
used for the ARC open etch process 116, wherein process A comprised
CHF.sub.3/HBr/He/O.sub.2 and process B comprised
CF.sub.4/CH.sub.2F.sub.2/O.sub.2. In one experiment, a tip-to-tip
distance difference resulting from the two processes resulted in a
large difference of about 60 nm.
[0048] Line ends of features are more easily accessible to etching
and also for polymer deposition, due to the comparatively larger
space angle from which impinging species can arrive from the gas
phase. By properly balancing the competing processes of etch attack
and polymer material (e.g., of the redeposition component 117)
deposition, LEPBR values of close to 1 can be obtained, as shown
for process B. Note that the use of highly polymerizing etch
processes may reduce the average trim amount (e.g., the litho-etch
CD offset) and therefore may require an adjustment of the
lithography CD target towards lower values, requiring improved
resolution capability.
[0049] Moreover, the variation of the etch bias as a function of
pitch may be effected. Etch bias data results from experiments
indicated a similar through-pitch behavior for etch processes with
a varying degree of polymer deposition. A gradual decrease in etch
bias is observable with increasing pitch from the smallest pitch
towards a pitch range around 400-500 nm, for example.
[0050] A reduction in tip-to-tip distance (e.g., dimension d.sub.8
in FIGS. 6 and 7) of about 20 to 30 nm was achieved in experimental
results by the proper selection of the ARC material 110 open etch
process 116, advantageously. Also advantageously, experimental
results show that the tip-to-tip dimension may be reduced faster
than the line width increases using the first embodiment described
herein, for example.
[0051] Thus, in accordance with the first embodiment of the present
invention, patterns are made slightly larger by selecting an etch
process 116 for opening the ARC material 110 that has a
redeposition component 117 that slightly increases the size of the
features patterned. In accordance with a second and third
embodiment of the present invention, patterns are made slightly
larger by an additional deposition process to form a thin material
220 (see FIG. 10) and 320 (see FIG. 18) over and lining a patterned
portion of the masking material, to be described further
herein.
[0052] A second embodiment of the present invention will be
described next with reference to FIGS. 8 through 13. Like numerals
are used for the various elements that were used to describe FIGS.
1 through 7. To avoid repetition, each reference number shown in
FIGS. 8 through 13 is not described again in detail herein. Rather,
similar materials x02, x04, x06, x08, etc. . . . are preferably
used for the various material layers shown as were used to describe
FIGS. 1 through 7, where x=1 in FIGS. 1 through 7 and x=2 in FIGS.
8 through 13.
[0053] A lithography mask 201 is shown in FIG. 8 comprising a
pattern formed in an opaque material 205 of the mask 201 comprising
rows and columns of pairs of gate patterns. The feature patterns
comprise a width of dimension d.sub.1, and length of dimension
d.sub.2, and a tip-to-tip distance between adjacent ends of
dimension d.sub.3.
[0054] The lithography mask 201 is used to pattern an upper portion
214 of a masking material 210/214 formed over a material layer
204/206 of a semiconductor device 200, as shown in FIG. 9. An
additional substance 220 is introduced, and the lower portion 210
of the masking material 210/214 is patterned. In this embodiment,
the additional substance 220 preferably comprises a polymer
material that is formed over the patterned upper portion of the
masking material and over the lower portion of the masking
material, before patterning the lower portion of the masking
material 210, as shown in FIG. 10. The polymer material 220 is
preferably conformally deposited, equally covering all exposed
portions of the anti-reflective coating 210 and the patterned
photosensitive material 214, as shown.
[0055] The polymer material 220 preferably comprises a material
that is resistant to the etch process used to open or pattern the
anti-reflective coating material 210, for example. The etch process
for the anti-reflective coating 210 is preferably anisotropic,
resulting in a portion of the polymer material 220 remaining on the
sidewalls of the photosensitive material 214, as shown in FIG. 11.
The polymer material 220 preferably comprises a thickness d.sub.9
of about 20 nm or less in some embodiments, although alternatively,
the polymer material 220 may comprise other dimensions. The polymer
material 220 preferably comprises C--F--O--Si, or a material
comprising C, F, O, Si, or combinations thereof, as examples,
although other materials may also be used.
[0056] The polymer material 220 may be formed by introducing a gas
such as C.sub.4F.sub.8, C.sub.xH.sub.yF.sub.z, other C--F based
gases, or other gases, to the etch chamber the semiconductor device
200 is being processed in, while applying a small bias power, e.g.,
about 20 to 50 Watts, although other levels of bias power may also
be used, and turning on a plasma source, resulting in the formation
of the polymer material 220, as an example. Alternatively, the
polymer material 220 may be formed using deposition or growth
methods, as examples.
[0057] The masking material 210/214 and the polymer material 220 on
the sidewalls of the photosensitive material 214 are used as a mask
while portions of the material layer 204/206 are etched away, as
shown in FIG. 12. The masking material 210/214 and the polymer
material 220 are then removed. The etch process of the material
layer 204/206 preferably comprises an anisotropic, directional etch
process that results in a portion of the polymer material 220 being
left remaining on the sidewalls of the photosensitive material 214
during the patterning of the underlying material layer 204/206,
enlarging the pattern of the material layer 204/206-by the
thickness of the polymer material 220 on all sides. The pattern of
the material layer 204/206 comprises a width or dimension d.sub.10
in the cross-sectional view shown in FIG. 12, wherein the dimension
d.sub.10 is greater than the width of the upper portion 214 of the
masking material by about twice the amount of the thickness d.sub.9
of the polymer material 220, for example.
[0058] FIG. 13 shows a top view of a semiconductor device 200
patterned using the method shown in FIGS. 8 through 12,
illustrating the patterned gate material 206. The patterned gate
material 206 has an extended or greater length (dimension d.sub.11)
compared to the feature pattern length (dimension d.sub.2) of the
mask 201 shown in FIG. 8, e.g., divided by a reduction factor if
other than a 1:1 mask and exposure tool is used. The patterned gate
material 206 has a reduced or shortened tip-to-tip distance
(dimension d.sub.12) compared to the feature pattern tip-to-tip
distance (dimension d.sub.3) of the mask 201, divided by the
reduction factor. The patterned gate material 206 also has an
extended or greater width (dimension d.sub.13) compared to the
feature pattern width (dimension d.sub.1) of the mask 201, due to
the presence of the polymer material 220 on the sidewalls of the
photosensitive material 214 during the etch process.
[0059] Thus, the second embodiment of the present invention
provides another method of decreasing line end shortening and
decreasing the tip-to-tip distance between features formed in a
material layer 206. Furthermore, the second embodiment may also be
combined with the first embodiment; for example, the polymer
material 220 may be deposited over the patterned layer of
photoresist 214, and an etch process such as the etch process 116
described for the first embodiment may be used that also forms a
redeposition component 117 on the sidewalls of the anti-reflective
coating 210 during the etching of the anti-reflective coating 210,
further enlarging the features formed in the material layer
204/206.
[0060] Note that an optional ODL may be included in the masking
material 210/214 in the second embodiment, e.g., disposed beneath
the anti-reflective coating 210, not shown, e.g., if the masking
material 210/214 comprises a tri-layer photoresist.
[0061] A third embodiment of the present invention will be
described next with reference to FIGS. 14 through 21. Again, like
numerals are used for the various elements that were described in
FIGS. 1 through 7 and 8 through 13, and to avoid repetition, each
reference number shown in FIGS. 14 through 21 is not described
again in detail herein.
[0062] In this embodiment, a two step etch process is used to
pattern the material layer 306, using two lithography masks and two
masking material layers. FIGS. 14 and 15 show top views of
lithography masks 301a and 301b in accordance with the third
embodiment of the present invention. A first lithography mask 301a
is shown in FIG. 14, and a second lithography mask 301b is shown in
FIG. 15. The first lithography mask 301a may comprise a pattern
305a for lengthwise portions of gate electrodes, for example,
defining the width (dimension d.sub.14) of the gates but not the
lengths. The second lithography mask 301b may comprise a "cutter
mask" that is adapted to define the length (dimension d.sub.15) of
the gates, e.g., the ends of the gates in a lengthwise
direction.
[0063] The patterns in the lithography masks 301a and 301b
preferably comprise positive patterns in some embodiments, for
example, wherein the patterns in the opaque material 305a and 305b
represent regions where the gate material 306 will remain residing
after the two-step etch process, at the intersections of the
patterns in the opaque material 305a and 305b after the two-step
etch process. Alternatively, the patterns may comprise negative
patterns (not shown).
[0064] Again, the widths of the patterns 305a of the transistor
width definition mask 301a comprise a dimension d.sub.14. The
widths of the patterns in the opaque material 305b of the cutter
mask 301b that define the ends of the transistor gates, e.g., the
length of the gates, comprise a dimension d.sub.15. The tip-to-tip
spacings on the mask 305b between line ends of the gate lengths
comprise a dimension d.sub.16.
[0065] FIGS. 16 through 18 show perspective views of a method of
patterning a plurality of gates using the lithography masks 301a
and 301b of FIGS. 14 and 15 in accordance with a preferred
embodiment of the present invention. FIG. 16 shows a first masking
material 310a/314a comprising an anti-reflective coating 310a
disposed over a gate material 306 and a photosensitive material
314a disposed over the anti-reflective coating 310a, after the
first lithography mask 301a of FIG. 14 has been used to pattern the
first masking material 310a/314a, and after the first masking
material 310a/314a has been used to pattern the gate material 306
and the gate dielectric material 304, defining the widths of the
gates 306. Note that the smaller sides of the gates 306 are often
referred to in the art as a "gate length." However, for purposes of
this discussion, the smaller sides of the gates 306 are referred to
herein as widths. The widths of the gate material 306 and the gate
dielectric material 304 comprise substantially the same dimension
d.sub.14 (also dimension d.sub.19 in FIG. 21) as the widths of the
patterns on the first lithography mask 301a, e.g., divided by the
reduction factor.
[0066] Next, the first masking material 310a/314a is removed, and
then a second masking material 310b/314b is formed over the
width-patterned gate material 306 and gate dielectric material 304,
as shown in FIG. 17 in a perspective view. The upper portion of the
second masking material 314b is patterned using the second
lithography mask 301b shown in FIG. 15, as shown.
[0067] A polymer material 320 preferably comprising similar
materials and thickness as polymer material 220 shown in FIGS. 10
through 12 is deposited or formed over the exposed portions of the
workpiece 302. The polymer material 320 is formed over the
patterned second masking material 314b and over exposed portions of
the second anti-reflective coating 310b comprising the lower
portion of the second masking material 310b/314b, similar to the
second embodiment previously described herein, as shown in FIG. 18
in a perspective view and in FIG. 19 in a top view. The polymer
material 320 coats the patterned photosensitive material 314b, and
preferably an etch process is used to open the anti-reflective
coating 310b that is anisotropic and leaves the polymer material
320 on the sidewalls of the patterned photosensitive material
314b.
[0068] The polymer material 320 enlarges the patterns of the second
masking material 310b/314b to lengths comprising a dimension
d.sub.17, e.g., which lengths d.sub.17 are longer compared to the
patterns 305b on the second lithography mask 301b defining the
lengths of the gate comprising dimension d.sub.15 shown in FIG. 15.
The second masking material 310b/314b and the polymer material 320
are used as a mask while the gate material 306 and gate dielectric
material 304 are patterned, leaving the structure shown in a
perspective view in FIG. 20 and shown in a top view in FIG. 21. The
tip-to-tip distance d.sub.18 of the gates 306 has been reduced,
compared to dimension d.sub.16 on the second lithography mask 301b
(see FIG. 15), e.g., by an amount substantially equal to twice the
thickness of the polymer material 320.
[0069] Thus, using a two-step etch process, two lithography masks
301a and 301b, and two masking materials 310a/314a and 310b/314b,
the vertical and horizontal ends of the material layer 304/306 to
be patterned may be defined and patterned, wherein the length-wise
distance between gates, the tip-to-tip distance, and line end
shortening is reduced by the additional deposition step of the
polymer material 320, before the step of opening the
anti-reflective coating 310b of the masking material 310b/314b used
for the patterning of the second lithography mask 310b.
Advantageously, because the "cutter mask" 301b comprises a pattern
that is substantially rectangular, the ends of the transistor gates
306 may comprise flat or squared edges 322, which may be
advantageous in some applications, for example.
[0070] In accordance with the third embodiment of the present
invention, a method of manufacturing a semiconductor device 300
preferably comprises providing a workpiece 302 as shown in FIG. 16,
and forming a material layer such as gate material 306 (and
optionally also gate dielectric material 304) over the workpiece
302. A first anti-reflective coating 310a is formed over the
workpiece 302, and a first photosensitive material 314a is formed
over the first anti-reflective coating 310a. An optional first ODL
may be disposed over the gate material 306 before the first
anti-reflective coating 310a is formed, if a tri-layer resist is
used, for example, not shown.
[0071] The first photosensitive material 314a and the first
anti-reflective coating 310a are exposed using the first
lithography mask 301a, wherein the first lithography mask 301a
comprises a first portion 305a of a pattern. The first
photosensitive material 314a is developed, forming the first
portion 305a of the pattern in the first photosensistive material
314a. The method includes using the first photosensitive material
314a and/or the first anti-reflective coating 310a as a mask to
form the first portion 305a of the pattern in the material layer
306, as shown in FIG. 16.
[0072] The first photosensitive material 314a and the first
anti-reflective coating 310a are removed, and a second
anti-reflective coating 310b is formed over the patterned material
layer 306 and exposed portions of the workpiece 302, as shown in
FIG. 17. A second photosensitive material 314b is disposed over the
second anti-reflective coating 310b. An optional second ODL may be
formed before the second anti-reflective coating 310b is formed, if
a tri-layer resist is used, for example, not shown.
[0073] The second photosensitive material 314b is exposed using a
second lithography mask 301b, the second lithography mask 301b
comprising a second portion 305b of a pattern, the second portion
of the pattern 305b comprising a different pattern than the first
portion 305a of the pattern of the first lithography mask and
intersecting in regions with the first portion 305a of the pattern.
The second photosensitive material 314b is developed, forming the
second portion 305b of the pattern in the second photosensistive
material 314b, also shown in FIG. 17.
[0074] The polymer material 320 is formed over the patterned second
photosensitive material 314b and over exposed portions of the
second anti-reflective coating 310b, as shown in FIG. 18. Portions
of the second anti-reflective coating 310b are etched using the
polymer material 320 and the patterned second photosensitive
material 314b as a mask, using a directional, anisotropic etch
process. The polymer material 320 and the patterned second
photosensitive material 314b and/or the patterned second
anti-reflective coating 310b are then used as a mask to pattern the
material layer 306 of the workpiece 302 with an enlarged second
portion 305b of the pattern.
[0075] The first embodiment previously described herein may also be
used in combination with the third embodiment. For example, the
anisotropic etch process used to etch the second anti-reflective
coating 310b using the polymer material 320 and the second
photosensitive material 314b may include a redeposition component
(such as 117 described for FIGS. 1 through 7) that forms on
sidewalls of the second anti-reflective coating 310b during the
etch process. Patterning the material layer 306 in this embodiment
may further comprise using the redeposition component 117 as a mask
during the patterning. The redeposition component 117 further
enlarges the second portion 305b of the pattern transferred to the
material layer from the second lithography mask 301b in this
embodiment, advantageously further reducing line end shortening and
decreasing the tip-to-tip distance between transistor gate
ends.
[0076] Furthermore, in the third embodiment, a tapered profile may
be intentionally introduced during the etch process to pattern the
second portion 305b of the pattern, to further reduce the
tip-to-tip distance d.sub.18 without having an impact on the gate
line (e.g., width or dimension d.sub.19 shown in FIG. 21) profile,
advantageously, because the widths of the gates 306 are masked
during the etching of the gate lengths. The tapered profile may be
introduced during the final etch process of the gate material 306,
for example. The line ends of the gates 306 may be narrower at the
top than at the bottom proximate the workpiece 302 in these
embodiments, so that the gate length at the bottom of the gates 306
is increased and the tip-to-tip distance is decreased, for example,
not shown.
[0077] Note that in the third embodiment, the order of the masks
301a and 301b may be reversed: the second lithography mask 301b may
be used to pattern the semiconductor device 300 first with the line
end-defining patterns 305b and using the polymer material 320 to
enlarge the patterns 305b, and then the first lithography mask 310a
may be used to pattern the semiconductor device 300 with the gate
width-defining patterns 305a.
[0078] Embodiments of the present invention have been described
herein for applications that utilize a positive photoresist,
wherein the patterns transferred to the photoresist and also the
material layer comprise the same patterns on the lithography mask.
Embodiments of the present invention may also be implemented in
applications where a negative photoresist is used, e.g., wherein
the patterns transferred to the photoresist and the material layer
comprise the reverse image of the patterns on the lithography
mask.
[0079] The novel lithography methods and semiconductor device 100,
200, and 300 manufacturing methods described herein may be used to
fabricate many types of semiconductor devices 100, 200, and 300,
including memory devices and logic devices, as examples, although
other types of semiconductor devices 100, 200, and 300, integrated
circuits, and circuitry may be fabricated using the novel
embodiments of the present invention described herein. Embodiments
of the present invention may be implemented in lithography systems
using light at wavelengths of 248 nm or 193 nm, for example,
although alternatively, other wavelengths of light may also be
used.
[0080] The lithography masks 101, 201, 301a, and 301b described
herein may comprise binary masks, phase-shifting masks, attenuating
masks, dark field, bright field, transmissive, reflective, or other
types of masks, as examples.
[0081] Advantages of embodiments of the invention include providing
several methods for reducing line end shortening and reducing the
tip-to-tip distance (e.g., the space between ends of elongated
features). Features that are denser than the patterns on
lithography masks may advantageously be manufactured using the
novel methods described herein. Some embodiments involve the use of
an etch process with a redeposition component 117, requiring few
manufacturing and process changes to implement. Other embodiments
require an additional deposition step (e.g., of polymer materials
220 and 320) and the use of an anisotropic etch process to ensure
that a portion of the polymer materials 220 and 320 remain on
sidewalls of the photosensitive materials 214 and 314b during the
anti-reflective coating 210 and 310b open step.
[0082] Excellent control and reduction of the tip-to-tip distance
may be achieved by the use of the novel embodiments of the
invention described herein. Many combinations of the embodiments
described herein may be implemented to achieve a desired line end
shortening reduction or elimination, or a reduced tip-to-tip
distance, for example. Tip-to-tip distances that are smaller than
the resolution limits of the optical lithography equipment and
systems used to pattern the material layers 106, 206, and 306 may
be achieved by the novel methods described herein.
[0083] An unexpected result or advantage of the second and third
embodiments described herein that utilize an intentionally
deposited polymer material 220 and 320 introduced before the
anti-reflective coating 210 and 310b open step is a reduction in
the line end roughness (LER), due to the presence of the polymer
material 220 and 320 during the etch process to pattern the gate
material 206 and 306, for example. A 10 to 20% decrease in LER near
the tops of gates 206 and 306 and a 5 to 8% decrease in LER near
the bottoms of gates 206 and 306 (e.g., proximate the workpiece 202
or 302) after the etch process used to pattern the gates 206 and
306 was observed in experimental test results, for example.
[0084] Although embodiments of the present invention and their
advantages have been described in detail, it should be understood
that various changes, substitutions and alterations can be made
herein without departing from the spirit and scope of the invention
as defined by the appended claims. For example, it will be readily
understood by those skilled in the art that many of the features,
functions, processes, and materials described herein may be varied
while remaining within the scope of the present invention.
Moreover, the scope of the present application is not intended to
be limited to the particular embodiments of the process, machine,
manufacture, composition of matter, means, methods and steps
described in the specification. As one of ordinary skill in the art
will readily appreciate from the disclosure of the present
invention, processes, machines, manufacture, compositions of
matter, means, methods, or steps, presently existing or later to be
developed, that perform substantially the same function or achieve
substantially the same result as the corresponding embodiments
described herein may be utilized according to the present
invention. Accordingly, the appended claims are intended to include
within their scope such processes, machines, manufacture,
compositions of matter, means, methods, or steps.
* * * * *