Patent | Date |
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Moving Robot Without Detection Dead Zone App 20220253068 - LIN; SHIH-CHIN ;   et al. | 2022-08-11 |
Semiconductor Device With Dummy Thermal Features On Interposer App 20220199593 - Yang; Bo-Jiun ;   et al. | 2022-06-23 |
Robot without detection dead zone Grant 11,353,884 - Lin , et al. June 7, 2 | 2022-06-07 |
Visualization device and observation method for flow field Grant 11,320,449 - Huang , et al. May 3, 2 | 2022-05-03 |
Semiconductor Package With Improved Board Level Reliability App 20220115303 - Chang; Chin-Chiang ;   et al. | 2022-04-14 |
Ai Frame Engine For Mobile Edge App 20210174473 - LUNG; Jen Cheng ;   et al. | 2021-06-10 |
Visualization Device And Observation Method For Flow Field App 20210132104 - Huang; Chih-Yung ;   et al. | 2021-05-06 |
Chip Scale Package Structure And Method Of Forming The Same App 20200312732 - CHI; Yen-Yao ;   et al. | 2020-10-01 |
Robot Without Detection Dead Zone App 20200241550 - LIN; Shih-Chin ;   et al. | 2020-07-30 |
Flow Field Visualization Device, Flow Field Observation Method, And Plasma Generator App 20200154555 - Huang; Chih-Yung ;   et al. | 2020-05-14 |
Structure and formation method of chip package structure Grant 10,354,974 - Hsu , et al. July 16, 2 | 2019-07-16 |
Semiconductor package and semiconductor device using the same Grant 10,312,222 - Hsu , et al. | 2019-06-04 |
Semiconductor package, semiconductor device using the same and manufacturing method thereof Grant 10,242,927 - Hsu , et al. | 2019-03-26 |
Manufacturing method of semiconductor package and manufacturing method of semiconductor device Grant 10,186,488 - Hsu , et al. Ja | 2019-01-22 |
Bandwidth efficient method for generating an alpha hint buffer Grant 10,121,222 - Chen , et al. November 6, 2 | 2018-11-06 |
Arbitrating circuit Grant 10,027,330 - Zhang , et al. July 17, 2 | 2018-07-17 |
Apparatus For Producing Inorganic Powder And Apparatus For Producing And Classifying Inorganic Powder App 20180169606 - Lu; Chun-An ;   et al. | 2018-06-21 |
Frame Difference Generation Hardware In A Graphics System App 20180174359 - Chen; Ying-Chieh ;   et al. | 2018-06-21 |
Evaporation Apparatus And Method Of Evaporation Using The Same App 20180119273 - Huang; Chih-Yung ;   et al. | 2018-05-03 |
Semiconductor Package And Semiconductor Device Using The Same App 20180114779 - Hsu; Wen-Sung ;   et al. | 2018-04-26 |
Composite solder ball, semiconductor package using the same, semiconductor device using the same and manufacturing method thereof Grant 9,908,203 - Cheng , et al. March 6, 2 | 2018-03-06 |
Semiconductor integrated circuit layout structure Grant 9,905,562 - Lin , et al. February 27, 2 | 2018-02-27 |
Semiconductor package, semiconductor device using the same and manufacturing method thereof Grant 9,881,902 - Hsu , et al. January 30, 2 | 2018-01-30 |
Manufacturing Method Of Semiconductor Package And Manufacturing Method Of Semiconductor Device App 20170338183 - Hsu; Wen-Sung ;   et al. | 2017-11-23 |
Semiconductor package, semiconductor device using the same and manufacturing method thereof Grant 9,761,534 - Hsu , et al. September 12, 2 | 2017-09-12 |
Semiconductor Integrated Circuit Layout Structure App 20170221897 - Lin; Shih-Chin ;   et al. | 2017-08-03 |
Bandwidth Efficient Method for Generating an Alpha Hint Buffer App 20170213315 - Chen; Ying-Chieh ;   et al. | 2017-07-27 |
Semiconductor Package, Semiconductor Device Using The Same And Manufacturing Method Thereof App 20170194227 - Hsu; Wen-Sung ;   et al. | 2017-07-06 |
Semiconductor integrated circuit layout structure Grant 9,673,145 - Lin , et al. June 6, 2 | 2017-06-06 |
Composite Solder Ball, Semiconductor Package Using The Same, Semiconductor Device Using The Same And Manufacturing Method Thereof App 20170136582 - Cheng; Tao ;   et al. | 2017-05-18 |
Integrated FinFET structure having a contact plug pitch larger than fin and first metal pitch Grant 9,653,346 - Lin , et al. May 16, 2 | 2017-05-16 |
Semiconductor Package, Semiconductor Device Using The Same And Manufacturing Method Thereof App 20170084541 - Hsu; Wen-Sung ;   et al. | 2017-03-23 |
Composite solder ball, semiconductor package using the same, semiconductor device using the same and manufacturing method thereof Grant 9,597,752 - Cheng , et al. March 21, 2 | 2017-03-21 |
Integrated circuit and signal monitoring method thereof Grant 9,571,079 - Liow , et al. February 14, 2 | 2017-02-14 |
Semiconductor Package, Semiconductor Device Using The Same And Manufacturing Method Thereof App 20170040292 - Hsu; Wen-Sung ;   et al. | 2017-02-09 |
Integrated Circuit And Signal Monitoring Method Thereof App 20160373095 - LIOW; YU-YEE ;   et al. | 2016-12-22 |
Semiconductor Integrated Circuit Layout Structure App 20160329276 - Lin; Shih-Chin ;   et al. | 2016-11-10 |
Integrated Circuit Structure And Method For Forming The Same App 20160329241 - LIN; Shih-Chin ;   et al. | 2016-11-10 |
Composite Solder Ball, Semiconductor Package Using The Same, Semiconductor Device Using The Same And Manufacturing Method Thereof App 20160263709 - Cheng; Tao ;   et al. | 2016-09-15 |
Package on package structure with pillar bump pins and related method thereof Grant 9,437,577 - Hsu , et al. September 6, 2 | 2016-09-06 |
Brushless Rotary Plasma Electrode Structure And Film Coating System App 20160208403 - LIN; Shih-Chin ;   et al. | 2016-07-21 |
Graphic Processing Circuit With Binning Rendering And Pre-Depth Processing Method Thereof App 20160180539 - Liao; Ming-Hao ;   et al. | 2016-06-23 |
Structure And Formation Method Of Chip Package Structure App 20160172334 - HSU; Wen-Sung ;   et al. | 2016-06-16 |
Semiconductor Package Assembly App 20160172292 - HSU; Wen-Sung ;   et al. | 2016-06-16 |
Graphic processing circuit with binning rendering and pre-depth processing method thereof Grant 9,361,697 - Liao , et al. June 7, 2 | 2016-06-07 |
Semiconductor package Grant 9,252,068 - Chen , et al. February 2, 2 | 2016-02-02 |
Package On Package Structure With Pillar Bump Pins And Related Method Thereof App 20150325549 - Hsu; Wen-Sung ;   et al. | 2015-11-12 |
Semiconductor package Grant 9,184,107 - Chen , et al. November 10, 2 | 2015-11-10 |
Multi-mode Thin Film Deposition Apparatus And Method Of Depositing A Thin Film App 20150147890 - Lin; Kung-Liang ;   et al. | 2015-05-28 |
Semiconductor Package App 20150145113 - CHEN; Tai-Yu ;   et al. | 2015-05-28 |
Multi-mode thin film deposition apparatus and method of depositing a thin film Grant 9,023,693 - Lin , et al. May 5, 2 | 2015-05-05 |
Semiconductor Package App 20150115429 - CHEN; Tai-Yu ;   et al. | 2015-04-30 |
Semiconductor package Grant 9,000,581 - Chen , et al. April 7, 2 | 2015-04-07 |
Printed circuit board and electronic apparatus thereof Grant 8,927,878 - Jiang , et al. January 6, 2 | 2015-01-06 |
Encapsulation film, package structure utilizing the same, and method for forming the package structure Grant 8,896,135 - Wang , et al. November 25, 2 | 2014-11-25 |
Memory Cell And Memory Cell Array Using The Same App 20140140120 - CHEN; Hsin-Wen ;   et al. | 2014-05-22 |
Memory cell and memory cell array using the same Grant 8,711,598 - Chen , et al. April 29, 2 | 2014-04-29 |
Semiconductor Package App 20130313698 - CHEN; Tai-Yu ;   et al. | 2013-11-28 |
Hidden refresh method and operating method for pseudo SRAM Grant 8,576,653 - Lin , et al. November 5, 2 | 2013-11-05 |
Integrated circuit device having die bonded to the polymer side of a polymer substrate Grant 8,456,021 - Feng , et al. June 4, 2 | 2013-06-04 |
Printed Circuit Board And Electronic Apparatus Thereof App 20130107483 - JIANG; Jieyun ;   et al. | 2013-05-02 |
Hidden Refresh Method And Operating Method For Pseudo Sram App 20130003481 - LIN; Shih-Chin ;   et al. | 2013-01-03 |
Integrated Circuit Device Having Die Bonded To The Polymer Side Of A Polymer Substrate App 20120126418 - Feng; Chien-Te ;   et al. | 2012-05-24 |
Film Deposition System And Method And Gas Supplying Apparatus Being Used Therein App 20120121807 - Chiang; Ming-Tung ;   et al. | 2012-05-17 |
Apparatus And Method For Image Correction App 20120106868 - Lin; Shih-Chin | 2012-05-03 |
Encapsulation Film, Package Structure Utilizing The Same, And Method For Forming The Package Structure App 20120032355 - Wang; Ching-Chiun ;   et al. | 2012-02-09 |
Apparatus And Method For Surface Processing App 20110305846 - CHIEN; JUNG-CHEN ;   et al. | 2011-12-15 |
Easy Operated Cigar Cutter App 20100257741 - Lin; Shih-Chin ;   et al. | 2010-10-14 |
Long Linear-type Microwave Plasma Source Using Variably-reduced-height Rectangular Waveguide As Plasma Reactor App 20100164381 - CHANG; CHIH-CHEN ;   et al. | 2010-07-01 |
Command Distribution Method, and Multimedia Apparatus and System Using the Same for Playing Games App 20090137319 - LIN; SHIH CHIN ;   et al. | 2009-05-28 |
Shift register and shift register set using the same Grant 7,499,517 - Lin , et al. March 3, 2 | 2009-03-03 |
Apparatus and method for generating an interleaved stereo image Grant 7,034,819 - Lee , et al. April 25, 2 | 2006-04-25 |
DC/DC converter App 20060012357 - Lin; Shih-Chin ;   et al. | 2006-01-19 |
Shift register and shift register set using the same App 20050289422 - Lin, Shih-Chin ;   et al. | 2005-12-29 |
Low leakage current static random access memory Grant 6,970,374 - Lin November 29, 2 | 2005-11-29 |
Low Leakage Current Static Random Access Memory App 20050185448 - Lin, Shih-Chin | 2005-08-25 |
Apparatus and method for generating an interleaved stereo image App 20040066450 - Lee, Ruen-Rone ;   et al. | 2004-04-08 |
Apparatus and method for controlling a stereo 3D display using overlay mechanism App 20030103062 - Lee, Ruen-Rone ;   et al. | 2003-06-05 |
Cigar Hole-drilling Device App 20030056800 - Lin, Shih Chin | 2003-03-27 |
Circuit for burn-in operation on a wafer of memory devices Grant 5,995,428 - Chien , et al. November 30, 1 | 1999-11-30 |