| Patent | Date |
|---|
Elevated Pocket Pixels, Imaging Devices And Systems Including The Same And Method Of Forming The Same
App 20210408093 - Akram; Salman | 2021-12-30 |
Chip scale light emitting device package with dome
Grant 11,145,794 - Akram , et al. October 12, 2 | 2021-10-12 |
Elevated pocket pixels, imaging devices and systems including the same and method of forming the same
Grant 11,127,769 - Akram September 21, 2 | 2021-09-21 |
Laser de-bond carrier wafer from device wafer
Grant 10,741,718 - Zou , et al. A | 2020-08-11 |
Elevated Pocket Pixels, Imaging Devices And Systems Including The Same And Method Of Forming The Same
App 20200098804 - Akram; Salman | 2020-03-26 |
Elevated pocket pixels, imaging devices and systems including the same and method of forming the same
Grant 10,504,948 - Akram Dec | 2019-12-10 |
Hybrid gate dielectrics for semiconductor power devices
Grant 10,490,644 - Akram , et al. Nov | 2019-11-26 |
Semiconductor devices comprising nickel-- and copper--containing interconnects
Grant 10,446,440 - Akram , et al. Oc | 2019-10-15 |
Elevated pocket pixels, imaging devices and systems including the same and method of forming the same
Grant 10,181,486 - Akram Ja | 2019-01-15 |
Semiconductor Devices Comprising Nickel-and Copper-containing Interconnects
App 20180358263 - Akram; Salman ; et al. | 2018-12-13 |
Elevated Pocket Pixels, Imaging Devices And Systems Including The Same And Method Of Forming The Same
App 20180342547 - Akram; Salman | 2018-11-29 |
Hybrid Gate Dielectrics For Semiconductor Power Devices
App 20180269302 - AKRAM; Salman ; et al. | 2018-09-20 |
Semiconductor devices comprising nickel- and copper-containing interconnects
Grant 10,062,608 - Akram , et al. August 28, 2 | 2018-08-28 |
LED with stress-buffer layer under metallization layer
Grant 10,050,180 - Akram , et al. August 14, 2 | 2018-08-14 |
Elevated Pocket Pixels, Imaging Devices And Systems Including The Same And Method Of Forming The Same
App 20180175085 - Akram; Salman | 2018-06-21 |
Hybrid gate dielectrics for semiconductor power devices
Grant 10,002,941 - Akram , et al. June 19, 2 | 2018-06-19 |
Methods for transferring heat from stacked microfeature devices
Grant 9,960,148 - Akram , et al. May 1, 2 | 2018-05-01 |
Reducing solder pad topology differences by planarization
Grant 9,935,069 - Lei , et al. April 3, 2 | 2018-04-03 |
Elevated pocket pixels, imaging devices and systems including the same and method of forming the same
Grant 9,911,769 - Akram March 6, 2 | 2018-03-06 |
Led With Stress-buffer Layer Under Metallization Layer
App 20170358715 - Akram; Salman ; et al. | 2017-12-14 |
Chip Scale Light Emitting Device Package With Dome
App 20170301834 - Akram; Salman ; et al. | 2017-10-19 |
Methods Of Forming Interconnects And Semiconductor Structures
App 20170283954 - Akram; Salman ; et al. | 2017-10-05 |
Method of attaching a light emitting device to a support substrate
Grant 9,705,047 - Steigerwald , et al. July 11, 2 | 2017-07-11 |
Chip scale light emitting device package with dome
Grant 9,660,154 - Akram , et al. May 23, 2 | 2017-05-23 |
Methods of forming interconnects and semiconductor structures
Grant 9,640,433 - Akram , et al. May 2, 2 | 2017-05-02 |
LED with stress-buffer layer under metallization layer
Grant 9,640,729 - Akram , et al. May 2, 2 | 2017-05-02 |
Elevated Pocket Pixels, Imaging Devices And Systems Including The Same And Method Of Forming The Same
App 20160372505 - Akram; Salman | 2016-12-22 |
Hybrid Gate Dielectrics For Semiconductor Power Devices
App 20160343823 - AKRAM; Salman ; et al. | 2016-11-24 |
Led With Stress-buffer Layer Under Metallization Layer
App 20160329468 - Akram; Salman ; et al. | 2016-11-10 |
Elevated pocket pixels, imaging devices and systems including the same and method of forming the same
Grant 9,437,762 - Akram September 6, 2 | 2016-09-06 |
Method of attaching a light emitting device to a support substrate
Grant 9,431,581 - Steigerwald , et al. August 30, 2 | 2016-08-30 |
Method Of Bonding A Semiconductor Device To A Support Substrate
App 20160247969 - Zou; Quanbo ; et al. | 2016-08-25 |
Chip scale light emitting device with metal pillars in a molding compound formed at wafer level
Grant 9,406,857 - Lei , et al. August 2, 2 | 2016-08-02 |
Method Of Attaching A Light Emitting Device To A Support Substrate
App 20160197244 - STEIGERWALD; DANIEL ALEXANDER ; et al. | 2016-07-07 |
Reducing Solder Pad Topology Differences By Planarization
App 20160181216 - Lei; Jipu ; et al. | 2016-06-23 |
Method of bonding a semiconductor device to a support substrate
Grant 9,343,612 - Zou , et al. May 17, 2 | 2016-05-17 |
Chip Scale Light Emitting Device Package With Dome
App 20160118554 - Akram; Salman ; et al. | 2016-04-28 |
Method Of Attaching A Light Emitting Device To A Support Substrate
App 20160020198 - STEIGERWALD; DANIEL ALEXANDER ; et al. | 2016-01-21 |
Method of attaching a light emitting device to a support substrate
Grant 9,153,758 - Steigerwald , et al. October 6, 2 | 2015-10-06 |
Laser De-bond Of Carrier Wafer From Device Wafter
App 20150228849 - Zou; Quanbo ; et al. | 2015-08-13 |
Chip Scale Light Emitting Device With Metal Pillars In A Molding Compound Formed At Wafer Level
App 20150144971 - Lei; Jipu ; et al. | 2015-05-28 |
Elevated Pocket Pixels, Imaging Devices And Systems Including The Same And Method Of Forming The Same
App 20150014689 - Akram; Salman | 2015-01-15 |
Elevated pocket pixels, imaging devices and systems including the same and method of forming the same
Grant 8,816,405 - Akram August 26, 2 | 2014-08-26 |
Wafer-level packaged microelectronic imagers having interconnects formed through terminals
Grant 8,816,463 - Akram , et al. August 26, 2 | 2014-08-26 |
Method Of Attaching A Light Emitting Device To A Support Substrate
App 20140220716 - Steigerwald; Daniel Alexandria ; et al. | 2014-08-07 |
Method of forming vias in semiconductor substrates and resulting structures
Grant 8,786,097 - Watkins , et al. July 22, 2 | 2014-07-22 |
Semiconductor device having copper interconnect for bonding
Grant 8,759,970 - Akram June 24, 2 | 2014-06-24 |
Methods Of Forming Interconnects And Semiconductor Structures
App 20140154879 - Akram; Salman ; et al. | 2014-06-05 |
Method Of Bonding A Semiconductor Device To A Support Substrate
App 20140141552 - Zou; Quanbo ; et al. | 2014-05-22 |
Packaged microelectronic imagers and methods of packaging microelectronic imagers
Grant 8,703,518 - Kirby , et al. April 22, 2 | 2014-04-22 |
Light Emitting Device Bonded To A Support Substrate
App 20140077246 - Bhat; Jerome Chandra ; et al. | 2014-03-20 |
Through-wafer interconnects for photoimager and memory wafers
Grant 8,669,179 - Akram , et al. March 11, 2 | 2014-03-11 |
Methods of forming interconnects in a semiconductor structure
Grant 8,647,982 - Akram , et al. February 11, 2 | 2014-02-11 |
Semiconductor dice including at least one blind hole, wafers including such semiconductor dice, and intermediate products made while forming at least one blind hole in a substrate
Grant 8,637,962 - Akram , et al. January 28, 2 | 2014-01-28 |
Through-wafer Interconnects For Photoimager And Memory Wafers
App 20130295766 - Akram; Salman ; et al. | 2013-11-07 |
Through-wafer interconnects for photoimager and memory wafers
Grant 8,502,353 - Akram , et al. August 6, 2 | 2013-08-06 |
Strained semiconductor by full wafer bonding
Grant 8,470,687 - Forbes , et al. June 25, 2 | 2013-06-25 |
Method and apparatus for breaking surface tension during a recessed color filter array process
Grant 8,389,920 - Akram , et al. March 5, 2 | 2013-03-05 |
Semiconductor Dice Including At Least One Blind Hole, Wafers Including Such Semiconductor Dice, And Intermediate Products Made While Forming At Least One Blind Hole In A Substrate
App 20130043588 - Akram; Salman ; et al. | 2013-02-21 |
Methods of forming conductive vias
Grant 8,324,100 - Akram , et al. December 4, 2 | 2012-12-04 |
Semiconductor dice including at least one blind hole, wafers including such semiconductor dice, and intermediate products made while forming at least one blind hole in a substrate
Grant 8,324,101 - Akram , et al. December 4, 2 | 2012-12-04 |
Methods for fabricating and filling conductive vias and conductive vias so formed
Grant 8,294,273 - Akram , et al. October 23, 2 | 2012-10-23 |
Methods And Apparatuses For Transferring Heat From Stacked Microfeature Devices
App 20120135567 - Akram; Salman ; et al. | 2012-05-31 |
Wafer-level Packaged Microelectronic Imagers And Processes For Wafer-level Packaging
App 20120104528 - Akram; Salman ; et al. | 2012-05-03 |
Imager devices having differing gate stack sidewall spacers, method for forming such imager devices, and systems including such imager devices
Grant 8,129,764 - Akram March 6, 2 | 2012-03-06 |
Methods and apparatuses for transferring heat from stacked microfeature devices
Grant 8,111,515 - Akram , et al. February 7, 2 | 2012-02-07 |
Packaged Microelectronic Imagers And Methods Of Packaging Microelectronic Imagers
App 20120009717 - Kirby; Kyle K. ; et al. | 2012-01-12 |
Strained Semiconductor By Full Wafer Bonding
App 20110281407 - Forbes; Leonard ; et al. | 2011-11-17 |
Semiconductor Dice Including At Least One Blind Hole, Wafers Including Such Semiconductor Dice, And Intermediate Products Made While Forming At Least One Blind Hole In A Substrate
App 20110272806 - Akram; Salman ; et al. | 2011-11-10 |
Packaged microelectronic imagers and methods of packaging microelectronic imagers
Grant 8,053,857 - Akram , et al. November 8, 2 | 2011-11-08 |
Packaged microelectronic imagers and methods of packaging microelectronic imagers
Grant 8,035,179 - Kirby , et al. October 11, 2 | 2011-10-11 |
Through-wafer Interconnects For Photoimager And Memory Wafers
App 20110233777 - Akram; Salman ; et al. | 2011-09-29 |
Semiconductor devices and assemblies including back side redistribution layers in association with through wafer interconnects
Grant 7,994,547 - Benson , et al. August 9, 2 | 2011-08-09 |
Strained semiconductor by full wafer bonding
Grant 7,994,595 - Forbes , et al. August 9, 2 | 2011-08-09 |
Elevated Pocket Pixels, Imaging Devices And Systems Including The Same And Method Of Forming The Same
App 20110189809 - Akram; Salman | 2011-08-04 |
Methods of forming blind wafer interconnects, and related structures and assemblies
Grant 7,989,345 - Akram , et al. August 2, 2 | 2011-08-02 |
Strained semiconductor by full wafer bonding
Grant 7,989,311 - Forbes , et al. August 2, 2 | 2011-08-02 |
Support structure for use in thinning semiconductor substrates and for supporting thinned semiconductor substrates
Grant 7,960,829 - Wood , et al. June 14, 2 | 2011-06-14 |
Methods Of Forming Conductive Vias
App 20110136336 - Akram; Salman ; et al. | 2011-06-09 |
Through-wafer interconnects for photoimager and memory wafers
Grant 7,956,443 - Akram , et al. June 7, 2 | 2011-06-07 |
Elevated pocket pixels, imaging devices and systems including the same and method of forming the same
Grant 7,952,158 - Akram May 31, 2 | 2011-05-31 |
Methods For Fabricating And Filling Conductive Vias And Conductive Vias So Formed
App 20110095429 - Akram; Salman ; et al. | 2011-04-28 |
Packaged Microelectronic Imagers And Methods Of Packaging Microelectronic Imagers
App 20110089539 - Akram; Salman ; et al. | 2011-04-21 |
Methods for protecting imaging elements of photoimagers during back side processing
Grant 7,919,348 - Akram , et al. April 5, 2 | 2011-04-05 |
Methods for placing substrates in contact with molten solder
Grant 7,918,383 - Kirby , et al. April 5, 2 | 2011-04-05 |
Method Of Forming Vias In Semiconductor Substrates And Resulting Structures
App 20110074043 - Watkins; Charles M. ; et al. | 2011-03-31 |
Methods for fabricating and filling conductive vias and conductive vias so formed
Grant 7,892,972 - Akram , et al. February 22, 2 | 2011-02-22 |
Packaged microelectronic imagers and methods of packaging microelectronic imagers
Grant 7,858,429 - Akram , et al. December 28, 2 | 2010-12-28 |
Semiconductor device structures including nickel plated aluminum, copper, and tungsten structures
Grant 7,855,454 - Akram , et al. December 21, 2 | 2010-12-21 |
Method of forming vias in semiconductor substrates and resulting structures
Grant 7,855,140 - Watkins , et al. December 21, 2 | 2010-12-21 |
Microelectronic imagers with integrated optical devices and methods for manufacturing such microelectronic imagers
Grant 7,842,915 - Akram November 30, 2 | 2010-11-30 |
Microelectronic devices and methods for forming interconnects in microelectronic devices
Grant 7,829,976 - Kirby , et al. November 9, 2 | 2010-11-09 |
High permeability layered films to reduce noise in high speed interconnects
Grant 7,829,979 - Forbes , et al. November 9, 2 | 2010-11-09 |
Image sensor packages and frame structure thereof
Grant 7,791,184 - Wood , et al. September 7, 2 | 2010-09-07 |
Methods of forming blind wafer interconnects
Grant 7,772,116 - Akram , et al. August 10, 2 | 2010-08-10 |
Microelectronics devices, having vias, and packaged microelectronic devices having vias
Grant 7,759,800 - Rigg , et al. July 20, 2 | 2010-07-20 |
Use of palladium in IC manufacturing with conductive polymer bump
Grant 7,759,240 - Farnworth , et al. July 20, 2 | 2010-07-20 |
Through-wafer Interconnects For Photoimager And Memory Wafers
App 20100171217 - Akram; Salman ; et al. | 2010-07-08 |
Semiconductor structures with dual isolation structures, methods for forming same and systems including same
Grant 7,732,885 - Chapman , et al. June 8, 2 | 2010-06-08 |
Method for fabricating a chip scale package using wafer level processing
Grant 7,727,858 - Kinsman , et al. June 1, 2 | 2010-06-01 |
Methods for thinning semiconductor substrates that employ support structures formed on the substrates
Grant 7,713,841 - Wood , et al. May 11, 2 | 2010-05-11 |
Methods for testing semiconductor devices methods for protecting the same from electrostatic discharge events during testing, and methods for fabricating inserts for use in testing semiconductor devices
Grant 7,709,279 - Hembree , et al. May 4, 2 | 2010-05-04 |
Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers
Grant 7,709,776 - Farnworth , et al. May 4, 2 | 2010-05-04 |
Test inserts and interconnects with electrostatic discharge structures
Grant 7,705,349 - Hembree , et al. April 27, 2 | 2010-04-27 |
Through-wafer interconnects for photoimager and memory wafers
Grant 7,683,458 - Akram , et al. March 23, 2 | 2010-03-23 |
Methods, Structures And Systems For Interconnect Structures In An Imager Sensor Device
App 20100025746 - Chapman; James ; et al. | 2010-02-04 |
Microelectronic imagers having front side contacts
Grant 7,646,075 - Akram January 12, 2 | 2010-01-12 |
Frame structure and semiconductor attach process for use therewith for fabrication of image sensor packages and the like, and resulting packages
Grant 7,645,635 - Wood , et al. January 12, 2 | 2010-01-12 |
Methods And Apparatuses For Transferring Heat From Stacked Microfeature Devices
App 20090321061 - Akram; Salman ; et al. | 2009-12-31 |
Method And Semiconductor Device Having Copper Interconnect For Bonding
App 20090309222 - Akram; Salman | 2009-12-17 |
Methods For Protecting Imaging Elements Of Photoimagers During Back Side Processing, Photoimagers And Systems
App 20090309176 - Akram; Salman ; et al. | 2009-12-17 |
Imager Devices Having Differing Gate Stack Sidewall Spacers, Method For Forming Such Imager Devices, And Systems Including Such Imager Devices
App 20090309142 - Akram; Salman | 2009-12-17 |
Methods and apparatuses for transferring heat from stacked microfeature devices
Grant 7,602,618 - Akram , et al. October 13, 2 | 2009-10-13 |
Method of forming vias in semiconductor substrates without damaging active regions thereof and resulting structures
Grant 7,598,167 - Watkins , et al. October 6, 2 | 2009-10-06 |
Method and semiconductor device having copper interconnect for bonding
Grant 7,592,246 - Akram September 22, 2 | 2009-09-22 |
Microelectronic Imagers With Integrated Optical Devices And Methods For Manufacturing Such Microelectronic Imagers
App 20090230087 - Akram; Salman | 2009-09-17 |
Method And Apparatus For Breaking Surface Tension During A Recessed Color Filter Array Process
App 20090231475 - Akram; Salman ; et al. | 2009-09-17 |
Methods Of Forming Imager Devices, Imager Devices Configured For Back Side Illumination, And Systems Including The Same
App 20090224343 - Akram; Salman | 2009-09-10 |
Semiconductor Structures With Dual Isolation Structures, Methods For Forming Same And Systems Including Same
App 20090200633 - Chapman; James M. ; et al. | 2009-08-13 |
Copper interconnect
Grant 7,569,934 - Akram August 4, 2 | 2009-08-04 |
Packaged Microelectronic Imagers And Methods Of Packaging Microelectronic Imagers
App 20090189238 - Kirby; Kyle K. ; et al. | 2009-07-30 |
Microelectronic Devices And Methods For Forming Interconnects In Microelectronic Devices
App 20090191701 - Kirby; Kyle K. ; et al. | 2009-07-30 |
Method for using data regarding manufacturing procedures integrated circuits (ICS) have undergone, such as repairs, to select procedures the ICs will undergo, such as additional repairs
Grant 7,561,938 - Akram , et al. July 14, 2 | 2009-07-14 |
Methods Of Forming Interconnects In A Semiconductor Structure
App 20090176362 - Akram; Salman ; et al. | 2009-07-09 |
Microelectronic Imagers With Optical Devices And Methods Of Manufacturing Such Microelectronic Imagers
App 20090155949 - Farnworth; Warren M. ; et al. | 2009-06-18 |
Microelectronic imagers with integrated optical devices and methods for manufacturing such microelectronic imagers
Grant 7,547,877 - Akram June 16, 2 | 2009-06-16 |
Microelectronic devices and methods for forming interconnects in microelectronic devices
Grant 7,531,453 - Kirby , et al. May 12, 2 | 2009-05-12 |
Carrier for wafer-scale package, wafer-scale package including the carrier, and methods
Grant 7,517,797 - Akram April 14, 2 | 2009-04-14 |
Multiple die stack apparatus employing T-shaped interposer elements
Grant 7,518,227 - Akram April 14, 2 | 2009-04-14 |
Deep Recess Color Filter Array and Process of Forming the Same
App 20090090850 - Liu; Saijin ; et al. | 2009-04-09 |
Methods relating to singulating semiconductor wafers and wafer scale assemblies
Grant 7,514,291 - Akram April 7, 2 | 2009-04-07 |
Copper interconnect
Grant 7,511,363 - Akram March 31, 2 | 2009-03-31 |
Optical device and assembly for use with imaging dies, and wafer-label imager assembly
Grant 7,511,262 - Akram March 31, 2 | 2009-03-31 |
Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers
Grant 7,504,615 - Farnworth , et al. March 17, 2 | 2009-03-17 |
Packaged microelectronic imagers and methods of packaging microelectronic imagers
Grant 7,498,647 - Kirby , et al. March 3, 2 | 2009-03-03 |
Strained Semiconductor By Full Wafer Bonding
App 20090042360 - Forbes; Leonard ; et al. | 2009-02-12 |
Copper interconnect
Grant 7,489,041 - Akram February 10, 2 | 2009-02-10 |
Semiconductor memory device with high permeability lines interposed between adjacent transmission lines
Grant 7,483,286 - Forbes , et al. January 27, 2 | 2009-01-27 |
Microelectronic imagers with integrated optical devices and methods for manufacturing such microelectronic imagers
App 20080293179 - Akram; Salman | 2008-11-27 |
Wafer Level Lens Arrays For Image Sensor Packages And The Like, Image Sensor Packages, And Related Methods
App 20080290435 - Oliver; Steve ; et al. | 2008-11-27 |
Low Temperature Methods Of Forming Back Side Redistribution Layers In Association With Through Wafer Interconnects, Semiconductor Devices Including Same, And Assemblies
App 20080277799 - Benson; Peter A. ; et al. | 2008-11-13 |
Board-on-chip packages
Grant 7,443,022 - Akram October 28, 2 | 2008-10-28 |
Strained semiconductor by full wafer bonding
Grant 7,439,158 - Forbes , et al. October 21, 2 | 2008-10-21 |
Low temperature methods of forming back side redistribution layers in association with through wafer interconnects
Grant 7,435,620 - Benson , et al. October 14, 2 | 2008-10-14 |
Low temperature methods of forming back side redistribution layers in association with through wafer interconnects, semiconductor devices including same, and assemblies
Grant 7,419,852 - Benson , et al. September 2, 2 | 2008-09-02 |
Microelectronic imagers and methods of packaging microelectronic imagers
Grant 7,419,841 - Farnworth , et al. September 2, 2 | 2008-09-02 |
Methods of sensing temperature of an electronic device workpiece
Grant 7,419,299 - Akram , et al. September 2, 2 | 2008-09-02 |
Methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices
Grant 7,413,979 - Rigg , et al. August 19, 2 | 2008-08-19 |
Elevated pocket pixels, imaging devices and systems including the same and method of forming the same
App 20080173964 - Akram; Salman | 2008-07-24 |
Semiconductor memory device with high permeability composite films to reduce noise in high speed interconnects
Grant 7,391,637 - Forbes , et al. June 24, 2 | 2008-06-24 |
Dicing saw with variable indexing capability
Grant 7,387,119 - Akram , et al. June 17, 2 | 2008-06-17 |
Microelectronic Devices And Methods For Forming Interconnects In Microelectronic Devices
App 20080138973 - Kirby; Kyle K. ; et al. | 2008-06-12 |
Systems and methods for testing microfeature devices
Grant 7,385,412 - Akram , et al. June 10, 2 | 2008-06-10 |
Use Of Palladium In Ic Manufacturing With Conductive Polymer Bump
App 20080119038 - Farnworth; Warren M. ; et al. | 2008-05-22 |
High permeability layered films to reduce noise in high speed interconnects
Grant 7,375,414 - Forbes , et al. May 20, 2 | 2008-05-20 |
Through-wafer Interconnects For Photoimager And Memory Wafers
App 20080111213 - Akram; Salman ; et al. | 2008-05-15 |
Interposers for chip-scale packages and intermediates thereof
Grant 7,368,812 - Akram May 6, 2 | 2008-05-06 |
Modular sockets using flexible interconnects
Grant 7,367,845 - Farnworth , et al. May 6, 2 | 2008-05-06 |
Device isolation for semiconductor devices
Grant 7,358,596 - Akram April 15, 2 | 2008-04-15 |
Copper interconnect for semiconductor device
Grant 7,345,358 - Akram March 18, 2 | 2008-03-18 |
Methods of packaging and testing microelectronic imaging devices
Grant 7,341,881 - Watkins , et al. March 11, 2 | 2008-03-11 |
Recessed color filter array and method of forming the same
App 20080054386 - Akram; Salman | 2008-03-06 |
Method of improving copper interconnects of semiconductor devices for bonding
Grant 7,338,889 - Akram March 4, 2 | 2008-03-04 |
High permeability composite films to reduce noise in high speed interconnects
Grant 7,335,968 - Forbes , et al. February 26, 2 | 2008-02-26 |
Use of palladium in IC manufacturing with conductive polymer bump
Grant 7,335,988 - Farnworth , et al. February 26, 2 | 2008-02-26 |
Microelectronic devices and methods for forming interconnects in microelectronic devices
Grant 7,329,943 - Kirby , et al. February 12, 2 | 2008-02-12 |
High permeability composite films to reduce noise in high speed interconnects
Grant 7,327,016 - Forbes , et al. February 5, 2 | 2008-02-05 |
Packaged Microelectronic Imagers And Methods Of Packaging Microelectronic Imagers
App 20080020505 - Akram; Salman ; et al. | 2008-01-24 |
Methods For Placing Substrates In Contact With Molten Solder
App 20080011815 - Kirby; Kyle K. ; et al. | 2008-01-17 |
Interconnect for bumped semiconductor components
Grant 7,317,322 - Farnworth , et al. January 8, 2 | 2008-01-08 |
Multiple Die Stack Apparatus Employing T-shaped Interposer Elements
App 20070278648 - Akram; Salman | 2007-12-06 |
Through-wafer interconnects for photoimager and memory wafers
Grant 7,300,857 - Akram , et al. November 27, 2 | 2007-11-27 |
Semiconductor substrate-based interconnection assembly for semiconductor device bearing external elements
App 20070262463 - Akram; Salman | 2007-11-15 |
Method Of Forming Vias In Semiconductor Substrates And Resulting Structures
App 20070262464 - Watkins; Charles M. ; et al. | 2007-11-15 |
Packaged microelectronic imagers and methods of packaging microelectronic imagers
Grant 7,294,897 - Akram , et al. November 13, 2 | 2007-11-13 |
Methods Of Forming Blind Wafer Interconnects, And Related Structures And Assemblies
App 20070257373 - Akram; Salman ; et al. | 2007-11-08 |
Low Temperature Methods Of Forming Back Side Redistribution Layers In Association With Through Wafer Interconnects
App 20070259517 - Benson; Peter A. ; et al. | 2007-11-08 |
Multiple die stack apparatus employing T-shaped interposer elements
Grant 7,282,793 - Akram October 16, 2 | 2007-10-16 |
Multiple die stack apparatus employing t-shaped interposer elements
Grant 7,282,794 - Akram October 16, 2 | 2007-10-16 |
Selective nickel plating of aluminum, copper, and tungsten structures
Grant 7,279,407 - Akram , et al. October 9, 2 | 2007-10-09 |
Technique To Control Tunneling Currents In Dram Capacitors, Cells, And Devices
App 20070228438 - Forbes; Leonard ; et al. | 2007-10-04 |
Carrier for wafer-scale package and wafer-scale package including the carrier
Grant 7,271,491 - Akram September 18, 2 | 2007-09-18 |
Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers
Grant 7,265,330 - Farnworth , et al. September 4, 2 | 2007-09-04 |
System for testing semiconductor components having interconnect with variable flexure contacts
Grant 7,259,578 - Akram , et al. August 21, 2 | 2007-08-21 |
Wafer-level package and methods of fabricating
Grant 7,256,069 - Akram , et al. August 14, 2 | 2007-08-14 |
Methods for fabricating and filling conductive vias and conductive vias so formed
App 20070184654 - Akram; Salman ; et al. | 2007-08-09 |
Integrated optics units and methods of manufacturing integrated optics units for use with microelectronic imagers
Grant 7,253,957 - Akram , et al. August 7, 2 | 2007-08-07 |
Probe card for semiconductor wafers having mounting plate and socket
Grant 7,250,780 - Hembree , et al. July 31, 2 | 2007-07-31 |
Methods for fabricating fences on interposer substrates
App 20070170942 - Akram; Salman ; et al. | 2007-07-26 |
Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers
App 20070170350 - Farnworth; Warren M. ; et al. | 2007-07-26 |
Microelectronic imagers with integrated optical devices and methods for manufacturing such microelectronic imagers
App 20070148807 - Akram; Salman | 2007-06-28 |
Method for fabricating a chip scale package using wafer level processing
App 20070148918 - Kinsman; Larry D. ; et al. | 2007-06-28 |
High permeability layered films to reduce noise in high speed interconnects
Grant 7,235,457 - Forbes , et al. June 26, 2 | 2007-06-26 |
Technique to control tunneling currents in DRAM capacitors, cells, and devices
Grant 7,235,837 - Forbes , et al. June 26, 2 | 2007-06-26 |
Microelectronic devices and methods for forming interconnects in microelectronic devices
Grant 7,232,754 - Kirby , et al. June 19, 2 | 2007-06-19 |
Air socket for testing integrated circuits
Grant 7,233,158 - Akram June 19, 2 | 2007-06-19 |
Projected contact structures for engaging bumped semiconductor devices
App 20070132097 - Wark; James M. ; et al. | 2007-06-14 |
Selective activation of aluminum, copper, and tungsten structures
App 20070132105 - Akram; Salman ; et al. | 2007-06-14 |
Methods for fabricating protective layers on semiconductor device components
App 20070117277 - Akram; Salman | 2007-05-24 |
Air Socket For Testing Integrated Circuits
App 20070113394 - Akram; Salman | 2007-05-24 |
Die stacking scheme
Grant 7,217,597 - Akram May 15, 2 | 2007-05-15 |
Apparatus and methods of testing and assembling bumped devices using an anisotropically conductive layer
Grant 7,214,962 - Akram , et al. May 8, 2 | 2007-05-08 |
Method for using data regarding manufacturing procedures integrated circuits (ICS) have undergone, such as repairs, to select procedures the ICs will undergo, such as additional repairs
App 20070088451 - Akram; Salman ; et al. | 2007-04-19 |
Under bump metallization pad and solder bump connections
Grant 7,205,221 - Akram , et al. April 17, 2 | 2007-04-17 |
Projected contact structures for engaging bumped semiconductor devices and methods of making the same
Grant 7,205,661 - Wark , et al. April 17, 2 | 2007-04-17 |
Microelectronic imagers and methods of packaging microelectronic imagers
Grant 7,199,439 - Farnworth , et al. April 3, 2 | 2007-04-03 |
Packaged die on PCB with heat sink encapsulant and methods
App 20070069372 - Akram; Salman ; et al. | 2007-03-29 |
Method of forming an electrical contact
App 20070066042 - Akram; Salman | 2007-03-22 |
Semiconductor structure having stacked semiconductor devices
Grant 7,193,306 - Akram , et al. March 20, 2 | 2007-03-20 |
Apparatus for forming modular sockets using flexible interconnects and resulting structures
Grant 7,192,311 - Farnworth , et al. March 20, 2 | 2007-03-20 |
Method of forming an electrical contact
App 20070059915 - Akram; Salman | 2007-03-15 |
Modular sockets using flexible interconnects
App 20070059984 - Farnworth; Warren M. ; et al. | 2007-03-15 |
Semiconductor processing method and field effect transistor
Grant 7,189,623 - Akram , et al. March 13, 2 | 2007-03-13 |
Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers
Grant 7,189,954 - Farnworth , et al. March 13, 2 | 2007-03-13 |
High permeability layered films to reduce noise in high speed interconnects
App 20070045817 - Forbes; Leonard ; et al. | 2007-03-01 |
Methods of forming blind wafer interconnects, and related structures and assemblies
App 20070045780 - Akram; Salman ; et al. | 2007-03-01 |
Method for fabricating a chip scale package using wafer level processing
Grant 7,183,191 - Kinsman , et al. February 27, 2 | 2007-02-27 |
Process of forming socket contacts
App 20070037418 - Akram; Salman ; et al. | 2007-02-15 |
High permeability layered films to reduce noise in high speed interconnects
App 20070029645 - Forbes; Leonard ; et al. | 2007-02-08 |
Collar positionable about a periphery of a contact pad and around a conductive structure secured to the contact pads, semiconductor device components including same, and methods for fabricating same
Grant 7,169,693 - Akram , et al. January 30, 2 | 2007-01-30 |
Method of making an interposer with contact structures
App 20070017093 - Wark; James M. ; et al. | 2007-01-25 |
Semiconductor processing method and field effect transistor
App 20070020868 - Akram; Salman ; et al. | 2007-01-25 |
Multi-chip module system
Grant 7,166,915 - Akram , et al. January 23, 2 | 2007-01-23 |
Semiconductor devices having stereolithographically fabricated protective layers thereon through which contact pads are exposed and assemblies including the same
Grant 7,166,925 - Akram January 23, 2 | 2007-01-23 |
Process of forming socket contacts
Grant 7,165,322 - Akram , et al. January 23, 2 | 2007-01-23 |
Method of making an interposer with contact structures
Grant 7,162,796 - Wark , et al. January 16, 2 | 2007-01-16 |
Method and structures for reduced parasitic capacitance in integrated circuit metallizations
Grant 7,160,795 - Batra , et al. January 9, 2 | 2007-01-09 |
Method of making an interposer with contact structures
Grant 7,159,311 - Wark , et al. January 9, 2 | 2007-01-09 |
Projected contact structures for engaging bumped semiconductor devices and methods of making the same
Grant 7,161,250 - Wark , et al. January 9, 2 | 2007-01-09 |
Selective activation of aluminum, copper, and tungsten structures
App 20070004200 - Akram; Salman ; et al. | 2007-01-04 |
Method and apparatus for forming metal contacts on a substrate
Grant 7,156,361 - Akram January 2, 2 | 2007-01-02 |
Method for forming metal contacts on a substrate
Grant 7,157,364 - Akram January 2, 2 | 2007-01-02 |
Method and apparatus for forming metal contacts on a substrate
Grant 7,156,362 - Akram January 2, 2 | 2007-01-02 |
Method for using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs
Grant 7,155,300 - Akram , et al. December 26, 2 | 2006-12-26 |
High permeability layered magnetic films to reduce noise in high speed interconnection
Grant 7,154,354 - Akram , et al. December 26, 2 | 2006-12-26 |
Method and apparatus for forming modular sockets using flexible interconnects and resulting structures
Grant 7,153,164 - Farnworth , et al. December 26, 2 | 2006-12-26 |
Interposers with alignment fences and semiconductor device assemblies including the interposers
App 20060279943 - Akram; Salman ; et al. | 2006-12-14 |
Systems and methods for testing microelectronic imagers and microfeature devices
Grant 7,148,715 - Akram , et al. December 12, 2 | 2006-12-12 |
Air socket for testing integrated circuits
Grant 7,141,994 - Akram November 28, 2 | 2006-11-28 |
High permeability composite films to reduce noise in high speed interconnects
App 20060261448 - Forbes; Leonard ; et al. | 2006-11-23 |
Microelectronic imagers and methods of packaging microelectronic imagers
App 20060261340 - Farnworth; Warren M. ; et al. | 2006-11-23 |
Microelectronic devices, methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices
App 20060264041 - Rigg; Sidney B. ; et al. | 2006-11-23 |
Structures for stabilizing semiconductor devices relative to test substrates and methods for fabricating the stabilizers
Grant 7,138,653 - Akram November 21, 2 | 2006-11-21 |
Packaged microelectronic imaging devices and methods of packaging microelectronic imaging device
App 20060255418 - Watkins; Charles M. ; et al. | 2006-11-16 |
Systems and methods for testing microelectronic imagers and microfeature devices
App 20060255826 - Akram; Salman ; et al. | 2006-11-16 |
Method for forming metal contacts on a substrate
Grant 7,131,195 - Akram November 7, 2 | 2006-11-07 |
Strained semiconductor by full wafer bonding
App 20060244105 - Forbes; Leonard ; et al. | 2006-11-02 |
Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers
App 20060243889 - Farnworth; Warren M. ; et al. | 2006-11-02 |
Methods relating to singulating semiconductor wafers and wafer scale assemblies
Grant 7,129,114 - Akram October 31, 2 | 2006-10-31 |
Method for fabricating a silicon carbide interconnect for semiconductor components using heating
Grant 7,129,156 - Akram , et al. October 31, 2 | 2006-10-31 |
Semiconductor test interconnect with variable flexure contacts having polymer material
Grant 7,129,725 - Akram , et al. October 31, 2 | 2006-10-31 |
Apparatus for conducting heat in a flip-chip assembly
App 20060237839 - Akram; Salman ; et al. | 2006-10-26 |
Semiconductor substrate-based interconnection assembly for semiconductor device bearing external connection elements
Grant 7,126,224 - Akram October 24, 2 | 2006-10-24 |
Modular sockets using flexible interconnects
App 20060234560 - Farnworth; Warren M. ; et al. | 2006-10-19 |
Method for using data regarding manufacturing procedures integrated circuits (ICS) have undergone, such as repairs, to select procedures the ICS will undergo, such as additional repairs
Grant 7,120,513 - Akram , et al. October 10, 2 | 2006-10-10 |
Alignment fences and devices and assemblies including the same
App 20060220665 - Akram; Salman ; et al. | 2006-10-05 |
Packaged microelectronic imaging devices and methods of packaging microelectronic imaging devices
Grant 7,115,961 - Watkins , et al. October 3, 2 | 2006-10-03 |
Methods of making projected contact structures for engaging bumped semiconductor devices
Grant 7,115,495 - Wark , et al. October 3, 2 | 2006-10-03 |
Microelectronic devices, methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices
App 20060216862 - Rigg; Sidney B. ; et al. | 2006-09-28 |
Die stacking scheme
Grant 7,112,878 - Akram September 26, 2 | 2006-09-26 |
Through-substrate interconnect fabrication methods
Grant 7,109,068 - Akram , et al. September 19, 2 | 2006-09-19 |
Air socket for testing integrated circuits
App 20060200984 - Akram; Salman | 2006-09-14 |
Methods of forming a transistor gate
Grant 7,105,411 - Akram , et al. September 12, 2 | 2006-09-12 |
Microelectronic devices and methods for forming interconnects in microelectronic devices
App 20060199363 - Kirby; Kyle K. ; et al. | 2006-09-07 |
Image sensor packages and frame structure thereof
App 20060192230 - Wood; Alan G. ; et al. | 2006-08-31 |
Methods for fabricating semiconductor devices so as to stabilize the same when contact-bearing surfaces thereof face over test substrates
App 20060189005 - Akram; Salman | 2006-08-24 |
Method for fabricating an interposer
Grant 7,093,358 - Akram , et al. August 22, 2 | 2006-08-22 |
Apparatus for forming modular sockets using flexible interconnects and resulting structures
Grant 7,094,108 - Farnworth , et al. August 22, 2 | 2006-08-22 |
Collars, support structures, and forms for protruding conductive structures
Grant 7,095,106 - Akram , et al. August 22, 2 | 2006-08-22 |
Device isolation for semiconductor devices
App 20060180893 - Akram; Salman | 2006-08-17 |
System for testing semiconductor components having interconnect with variable flexure contacts
App 20060181294 - Akram; Salman ; et al. | 2006-08-17 |
Semiconductor device, ball grid array connection system, and method of making
Grant 7,091,622 - Kinsman , et al. August 15, 2 | 2006-08-15 |
Methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices
Grant 7,091,124 - Rigg , et al. August 15, 2 | 2006-08-15 |
Plating
Grant 7,090,750 - Akram , et al. August 15, 2 | 2006-08-15 |
Microelectronic workpieces and methods for forming interconnects in microelectronic workpieces
App 20060177999 - Hembree; David R. ; et al. | 2006-08-10 |
Method for conducting heat in a flip-chip assembly
Grant 7,087,511 - Akram , et al. August 8, 2 | 2006-08-08 |
Methods for protecting intermediate conductive elements of semiconductor device assemblies
Grant 7,087,984 - Akram August 8, 2 | 2006-08-08 |
Through-substrate interconnect structures and assemblies
App 20060170110 - Akram; Salman ; et al. | 2006-08-03 |
Programmed material consolidation processes for protecting intermediate conductive structures
Grant 7,084,012 - Akram August 1, 2 | 2006-08-01 |
Electrical device allowing for increased device densities
Grant 7,084,351 - Akram , et al. August 1, 2 | 2006-08-01 |
Removing heat from integrated circuit devices mounted on a support structure
Grant 7,082,033 - Akram July 25, 2 | 2006-07-25 |
Metallization structures for semiconductor device interconnects, methods for making same, and semiconductor devices including same
Grant 7,071,557 - Akram July 4, 2 | 2006-07-04 |
Air socket for testing integrated circuits
Grant 7,069,638 - Akram July 4, 2 | 2006-07-04 |
Copper interconnect
App 20060138660 - Akram; Salman | 2006-06-29 |
Multiple die stack apparatus employing T-shaped interposer elements
Grant 7,064,006 - Akram June 20, 2 | 2006-06-20 |
High-density modularity for ICS
Grant 7,061,092 - Akram , et al. June 13, 2 | 2006-06-13 |
Semiconductor substrate-based BGA interconnection for testing semiconductor devices
Grant 7,061,109 - Akram June 13, 2 | 2006-06-13 |
Hybrid interconnect and system for testing semiconductor dice
Grant 7,049,840 - Hembree , et al. May 23, 2 | 2006-05-23 |
Device isolation for semiconductor devices
Grant 7,049,206 - Akram May 23, 2 | 2006-05-23 |
Method for fabricating a test interconnect for bumped semiconductor components by forming recesses and cantilevered leads on a substrate
Grant 7,043,831 - Farnworth , et al. May 16, 2 | 2006-05-16 |
Chip package with grease heat sink
App 20060097381 - Akram; Salman | 2006-05-11 |
Methods for forming semiconductor devices so as to stabilize the same when positioned face-down over test substrates
Grant 7,041,513 - Akram May 9, 2 | 2006-05-09 |
Stereolithographic method for fabricating stabilizers for semiconductor devices
Grant 7,041,533 - Akram , et al. May 9, 2 | 2006-05-09 |
Modular sockets using flexible interconnects
Grant 7,040,930 - Farnworth , et al. May 9, 2 | 2006-05-09 |
Method for fabricating semiconductor component with on board capacitor
Grant 7,041,537 - Akram , et al. May 9, 2 | 2006-05-09 |
Die stacking scheme
App 20060094160 - Akram; Salman | 2006-05-04 |
Multiple die stack apparatus employing T-shaped interposer elements
App 20060091520 - Akram; Salman | 2006-05-04 |
Multiple die stack apparatus employing T-shaped interposer elements
App 20060091519 - Akram; Salman | 2006-05-04 |
Method for fabricating a silicon carbide interconnect for semiconductor components
Grant 7,033,920 - Akram , et al. April 25, 2 | 2006-04-25 |
Methods relating to singulating semiconductor wafers and wafer scale assemblies
App 20060079024 - Akram; Salman | 2006-04-13 |
Copper interconnect
App 20060071336 - Akram; Salman | 2006-04-06 |
Projected contact structures for engaging bumped semiconductor devices and methods of making the same
App 20060060968 - Wark; James M. ; et al. | 2006-03-23 |
Copper interconnect
App 20060055059 - Akram; Salman | 2006-03-16 |
Projected contact structures for engaging bumped semiconductor devices and methods of making the same
App 20060055034 - Wark; James M. ; et al. | 2006-03-16 |
Copper interconnect
App 20060055057 - Akram; Salman | 2006-03-16 |
Copper interconnect
App 20060055058 - Akram; Salman | 2006-03-16 |
Technique to control tunneling currents in DRAM capacitors, cells, and devices
App 20060054956 - Forbes; Leonard ; et al. | 2006-03-16 |
Copper interconnect
App 20060055060 - Akram; Salman | 2006-03-16 |
Spring element for use in an apparatus for attaching to a semiconductor and a method of making
Grant 7,011,532 - Hembree , et al. March 14, 2 | 2006-03-14 |
Die stacking scheme
Grant 7,008,823 - Akram March 7, 2 | 2006-03-07 |
Method of fabricating mounted multiple semiconductor dies in a package
Grant 7,008,824 - Akram March 7, 2 | 2006-03-07 |
Microelectronic imagers with integrated optical devices and methods for manufacturing such microelectronic imagers
App 20060043262 - Akram; Salman | 2006-03-02 |
Low temperature methods of forming back side redistribution layers in association with through wafer interconnects, semiconductor devices including same, and assemblies
App 20060043569 - Benson; Peter A. ; et al. | 2006-03-02 |
Packaged microelectronic imaging devices and methods of packaging microelectronic imaging devices
App 20060043509 - Watkins; Charles M. ; et al. | 2006-03-02 |
Methods and apparatus for placing substrates in contact with molten solder
App 20060043154 - Kirby; Kyle K. ; et al. | 2006-03-02 |
Interposers for chip-scale packages and intermediates thereof
App 20060043477 - Akram; Salman | 2006-03-02 |
Through-wafer interconnects for photoimager and memory wafers
App 20060043599 - Akram; Salman ; et al. | 2006-03-02 |
Microelectronic imagers having front side contacts and methods of packaging such microelectronic imagers
App 20060044433 - Akram; Salman | 2006-03-02 |
Method for fabricating a silicon carbide interconnect for semiconductor components using heating and oxidizing
App 20060046345 - Akram; Salman ; et al. | 2006-03-02 |
Through-substrate interconnect fabrication methods and resulting structures and assemblies
App 20060046468 - Akram; Salman ; et al. | 2006-03-02 |
Selective nickel plating of aluminum, copper, and tungsten structures
App 20060046088 - Akram; Salman ; et al. | 2006-03-02 |
Method of forming vias in semiconductor substrates without damaging active regions thereof and resulting structures
App 20060046463 - Watkins; Charles M. ; et al. | 2006-03-02 |
Methods and apparatuses for transferring heat from stacked microfeature devices
App 20060044773 - Akram; Salman ; et al. | 2006-03-02 |
Apparatus and methods for wafer-level testing of the chip-scale semiconductor device packages
App 20060038172 - Akram; Salman | 2006-02-23 |
Frame structure and semiconductor attach process for use therewith for fabrication of image sensor packages and the like, and resulting packages
App 20060035415 - Wood; Alan G. ; et al. | 2006-02-16 |
Method for forming metal contacts on a substrate
App 20060027632 - Akram; Salman | 2006-02-09 |
Method and apparatus for forming metal contacts on a substrate
App 20060027728 - Akram; Salman | 2006-02-09 |
Interconnect for bumped semiconductor components
App 20060028222 - Farnworth; Warren M. ; et al. | 2006-02-09 |
Hermetic chip in wafer form
App 20060022337 - Farnworth; Warren M. ; et al. | 2006-02-02 |
Substrates including alignment fences
App 20060017451 - Akram; Salman ; et al. | 2006-01-26 |
Collars, support structures, and forms for protuding conductive structures
App 20060017175 - Akram; Salman ; et al. | 2006-01-26 |
Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers
App 20060011809 - Farnworth; Warren M. ; et al. | 2006-01-19 |
Materials for use in programmed material consolidation processes
App 20060008739 - Wood; Alan G. ; et al. | 2006-01-12 |
Support structure for use in thinning semiconductor substrates and for supporting thinned semiconductor substrates
App 20060001139 - Wood; Alan G. ; et al. | 2006-01-05 |
Semiconductor processing method and field effect transistor
App 20060001054 - Akram; Salman ; et al. | 2006-01-05 |
Semiconductor test interconnect with variable flexure contacts having polymer material
App 20060001439 - Akram; Salman ; et al. | 2006-01-05 |
Assemblies including semiconductor substrates of reduced thickness and support structures therefor
App 20060003549 - Wood; Alan G. ; et al. | 2006-01-05 |
Methods for optimizing physical characteristics of selectively consolidatable materials
App 20060003255 - Wood; Alan G. ; et al. | 2006-01-05 |
Packaged microelectronic imagers and methods of packaging microelectronic imagers
App 20050285154 - Akram, Salman ; et al. | 2005-12-29 |
Microelectronic devices and methods for forming interconnects in microelectronic devices
App 20050287783 - Kirby, Kyle K. ; et al. | 2005-12-29 |
Methods for modifying semiconductor devices to stabilize the same and semiconductor device assembly
App 20050282313 - Akram, Salman ; et al. | 2005-12-22 |
Packaged microelectronic imagers and methods of packging microelectronic imagers
App 20050275049 - Kirby, Kyle K. ; et al. | 2005-12-15 |
Wafer-level packaged microelectronic imagers and processes for wafer-level packaging
App 20050275750 - Akram, Salman ; et al. | 2005-12-15 |
Microelectronic imagers and methods of packaging microelectronic imagers
App 20050275048 - Farnworth, Warren M. ; et al. | 2005-12-15 |
Method and apparatus for forming modular sockets using flexible interconnects and resulting structures
App 20050269686 - Farnworth, Warren M. ; et al. | 2005-12-08 |
Semiconductor device components with structures for stabilizing the semiconductor device components upon flip-chip arrangement with high-level substrates
App 20050269714 - Akram, Salman ; et al. | 2005-12-08 |
Systems and methods for testing microelectronic imagers and microfeature devices
App 20050270055 - Akram, Salman ; et al. | 2005-12-08 |
Electrical contact
App 20050270045 - Akram, Salman | 2005-12-08 |
Manufacturing methods for semiconductor structures having stacked semiconductor devices
App 20050266610 - Akram, Salman ; et al. | 2005-12-01 |
Integrated optics units and methods of manufacturing integrated optics units for use with microelectronic imagers
App 20050254133 - Akram, Salman ; et al. | 2005-11-17 |
Method of plating
App 20050247567 - Akram, Salman ; et al. | 2005-11-10 |
Apparatus and methods of testing and assembling bumped devices using an anisotropically conductive layer
App 20050230825 - Akram, Salman ; et al. | 2005-10-20 |
Method and semiconductor device having copper interconnect for bonding
App 20050218483 - Akram, Salman | 2005-10-06 |
Method of making chip package with grease heat sink
App 20050221533 - Akram, Salman | 2005-10-06 |
Use of palladium in IC manufacturing with conductive polymer bump
App 20050218510 - Farnworth, Warren M. ; et al. | 2005-10-06 |
Dicing saw with variable indexing capability
App 20050211236 - Akram, Salman ; et al. | 2005-09-29 |
Copper interconnect
App 20050212128 - Akram, Salman | 2005-09-29 |
Board-on-chip packages
App 20050205973 - Akram, Salman | 2005-09-22 |
Methods including fabrication of substrates and other semiconductor device components with collars on or around the contact pads thereof
App 20050208704 - Akram, Salman ; et al. | 2005-09-22 |
Methods and apparatus relating to singulating semiconductor wafers and wafer scale assemblies
App 20050202651 - Akram, Salman | 2005-09-15 |
Packaged die on PCB with heat sink encapsulant and methods
App 20050189646 - Akram, Salman ; et al. | 2005-09-01 |
Spring element for use in an apparatus for attaching to a semiconductor and a method of making
App 20050191876 - Hembree, David R. ; et al. | 2005-09-01 |
Multiple die package
App 20050189623 - Akram, Salman ; et al. | 2005-09-01 |
Metallization structures for semiconductor device interconnects
App 20050181595 - Akram, Salman | 2005-08-18 |
Protective structures for bond wires
App 20050173790 - Akram, Salman | 2005-08-11 |
Method and apparatus for forming metal contacts on a substrate
App 20050161490 - Akram, Salman | 2005-07-28 |
Method for fabricating a chip scale package using wafer level processing
App 20050164429 - Kinsman, Larry D. ; et al. | 2005-07-28 |
Semiconductor devices having stereolithographically fabricated protective layers thereon through which contact pads are exposed and assemblies including the same
App 20050156331 - Akram, Salman | 2005-07-21 |
High permeability layered magnetic films to reduce noise in high speed interconnection
App 20050140462 - Akram, Salman ; et al. | 2005-06-30 |
Modular sockets using flexible interconnects
App 20050142954 - Farnworth, Warren M. ; et al. | 2005-06-30 |
Methods of fabricating contact interfaces
App 20050136647 - Akram, Salman ; et al. | 2005-06-23 |
Chip-scale package and carrier for use therewith
App 20050127486 - Akram, Salman ; et al. | 2005-06-16 |
Use of palladium in IC manufacturing with conductive polymer bump
App 20050104210 - Farnworth, Warren M. ; et al. | 2005-05-19 |
Microelectronic devices, methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices
App 20050104228 - Rigg, Sidney B. ; et al. | 2005-05-19 |
Method and semiconductor device having copper interconnect for bonding
App 20050098888 - Akram, Salman | 2005-05-12 |
Method of forming an electrical contact
App 20050093557 - Akram, Salman | 2005-05-05 |
Method for forming metal contacts on a substrate
App 20050085063 - Akram, Salman | 2005-04-21 |
Contact For Semiconductor Components
App 20050073334 - Farnworth, Warren M. ; et al. | 2005-04-07 |
Method of making an interposer with contact structures
App 20050066523 - Wark, James M. ; et al. | 2005-03-31 |
Support structure for thinning semiconductor substrates and thinning methods employing the support structure
App 20050064681 - Wood, Alan G. ; et al. | 2005-03-24 |
Programmed material consolidation processes for protecting intermediate conductive structures
App 20050042856 - Akram, Salman | 2005-02-24 |
High permeability layered films to reduce noise in high speed interconnects
App 20050030803 - Forbes, Leonard ; et al. | 2005-02-10 |
High permeability composite films to reduce noise in high speed interconnects
App 20050017327 - Forbes, Leonard ; et al. | 2005-01-27 |
Strained semiconductor by full wafer bonding
App 20050020094 - Forbes, Leonard ; et al. | 2005-01-27 |
| 