U.S. patent application number 11/237261 was filed with the patent office on 2006-02-02 for hermetic chip in wafer form.
Invention is credited to Salman Akram, Warren M. Farnworth, Alan G. Wood.
Application Number | 20060022337 11/237261 |
Document ID | / |
Family ID | 24460169 |
Filed Date | 2006-02-02 |
United States Patent
Application |
20060022337 |
Kind Code |
A1 |
Farnworth; Warren M. ; et
al. |
February 2, 2006 |
Hermetic chip in wafer form
Abstract
A fully hermetically sealed semiconductor chip and its method of
manufacture. The semiconductor chip of the present invention is
fully hermetically sealed on both sides and the edges thereof
through the use of suitable coatings applied thereto, such as
glass, to prevent an environmental attack of the semiconductor
chip. The fully hermetically sealed semiconductor chip of the
present invention does not require the use of a separate package
for the hermetic sealing of the chip, thereby reducing the size of
such a chip. The method of the manufacture of the semiconductor
chip of the present invention provides a simple process for the
fully hermetic sealing of both sides and the edges of the
semiconductor chip without the use of a separate package.
Inventors: |
Farnworth; Warren M.;
(Nampa, ID) ; Akram; Salman; (Boise, ID) ;
Wood; Alan G.; (Boise, ID) |
Correspondence
Address: |
TRASK BRITT
P.O. BOX 2550
SALT LAKE CITY
UT
84110
US
|
Family ID: |
24460169 |
Appl. No.: |
11/237261 |
Filed: |
September 27, 2005 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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10624766 |
Jul 22, 2003 |
6953995 |
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11237261 |
Sep 27, 2005 |
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09639422 |
Aug 14, 2000 |
6597066 |
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10624766 |
Jul 22, 2003 |
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|
09518293 |
Mar 3, 2000 |
6287942 |
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09639422 |
Aug 14, 2000 |
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|
09244733 |
Feb 5, 1999 |
6084288 |
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09518293 |
Mar 3, 2000 |
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08910613 |
Aug 13, 1997 |
5903044 |
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09244733 |
Feb 5, 1999 |
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08614178 |
Mar 12, 1996 |
5682065 |
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08910613 |
Aug 13, 1997 |
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Current U.S.
Class: |
257/735 ;
257/E21.502; 257/E23.02; 257/E23.118; 257/E23.124 |
Current CPC
Class: |
H01L 24/05 20130101;
H01L 2224/48464 20130101; Y10S 438/958 20130101; H01L 2224/48247
20130101; H01L 2224/48227 20130101; H01L 23/3107 20130101; H01L
2224/023 20130101; H01L 2224/04042 20130101; H01L 23/291 20130101;
H01L 24/48 20130101; H01L 2924/00014 20130101; H01L 2924/01022
20130101; H01L 2924/10253 20130101; Y10S 438/959 20130101; H01L
2224/48091 20130101; H01L 2924/01031 20130101; H01L 2924/01005
20130101; H01L 24/03 20130101; H01L 2924/014 20130101; H01L
2924/01032 20130101; H01L 2224/05599 20130101; H01L 21/56 20130101;
H01L 2924/01006 20130101; H01L 2924/09701 20130101; H01L 2224/05556
20130101; H01L 2924/01014 20130101; H01L 2924/01074 20130101; H01L
2924/04941 20130101; H01L 2224/48091 20130101; H01L 2924/00014
20130101; H01L 2924/00014 20130101; H01L 2224/45099 20130101; H01L
2924/00014 20130101; H01L 2224/05599 20130101; H01L 2924/00014
20130101; H01L 2224/05556 20130101; H01L 2924/00014 20130101; H01L
2224/85399 20130101; H01L 2924/10253 20130101; H01L 2924/00
20130101; H01L 2224/023 20130101; H01L 2924/0001 20130101 |
Class at
Publication: |
257/735 |
International
Class: |
H01L 23/48 20060101
H01L023/48 |
Claims
1. A portion of a semiconductor wafer having at least one
semiconductor device thereon comprising: a portion of a silicon
semiconductor wafer having a first side, a second side and at least
one street area forming an area on the portion of the silicon
semiconductor wafer within which the at least one semiconductor
device is located, the portion of the silicon semiconductor wafer
having a portion thereof removed through a thickness thereof in the
at least one street area; a semiconductor device located on the
first side of the portion of the silicon semiconductor wafer, the
semiconductor device having a periphery having the at least one
street area extending therefrom, the semiconductor device having at
least one bond pad formed thereon, the semiconductor device formed
on the portion of the silicon semiconductor wafer having portions
of the silicon semiconductor wafer substrate removed from the at
least one street area; a first coating comprised of glass covering
the first side of the portion of the silicon semiconductor wafer
and the semiconductor device, the first coating sealingly engaging
the first side of the portion of the silicon semiconductor wafer
substrate, the first coating on the first side of the portion of a
silicon semiconductor wafer covering the semiconductor device
without substantially covering the at least one bond pad formed
thereon; a second coating comprising a removable glass material
covering the second side of the portion of the silicon
semiconductor wafer and substantially filling the portions of the
silicon semiconductor wafer which have been removed, the second
coating contacting the first coating in the portions of the silicon
semiconductor wafer which have been removed, the second coating
substantially sealingly engaging the periphery of the semiconductor
device; and a circuit connected to the at least one bond pad of the
semiconductor device.
2. A portion of a semiconductor wafer having at least two
semiconductor devices formed thereon comprising: a portion of a
silicon semiconductor wafer substrate having a first side, a second
side and a plurality of street areas thereon forming areas for a
semiconductor device, the portion of the silicon semiconductor
wafer substrate having portions removed; at least two semiconductor
devices formed on the first side of the portion of the silicon
semiconductor wafer substrate, the at least two semiconductor
devices each having a periphery having a street area of the
plurality of street areas extending therefrom, the at least two
semiconductor devices each having at least one bond pad formed
thereon, the at least two semiconductor devices each formed on the
portion of the silicon semiconductor wafer substrate having
portions of the silicon semiconductor wafer substrate removed, the
periphery of each of the at least two semiconductor devices formed
by the portions of the silicon semiconductor wafer substrate
removed; a first coating comprised of a permanent glass material
covering the first side of the portion of the silicon semiconductor
wafer substrate and the at least two semiconductor devices formed
on the first side of the portion of the silicon semiconductor wafer
substrate, the first coating sealingly engaging the first side of
the portion of the silicon semiconductor wafer substrate, the first
coating on the first side of the portion of a silicon semiconductor
wafer substrate covering the at least two semiconductor devices
formed thereon without substantially covering the at least one bond
pad formed thereon; a second coating comprising a removable glass
material covering the second side of the portion of the silicon
semiconductor wafer substrate and substantially filling the
portions of the silicon semiconductor wafer substrate which have
been removed to separate areas of the portion of the silicon
semiconductor wafer substrate from other areas thereof, the second
coating contacting the first coating in the portions of the silicon
semiconductor wafer substrate which have been removed, the second
coating substantially sealingly engaging the periphery of each of
the at least two semiconductor devices; and a plurality of metal
circuits connected to the at least one bond pad of each of the at
least two semiconductor devices, the at least one metal circuit
extending to a location adjacent the periphery of each of the at
least two semiconductor devices, the plurality of metal circuits
sealingly engaging the first coating on the portion of the silicon
semiconductor wafer substrate and the at least one bond pad of each
of the at least two semiconductor devices.
3. The semiconductor wafer of claim 2, wherein: the second coating
comprises a glass coating which is etchable.
4. The semiconductor wafer of claim 2, further comprising: a
plurality of metal circuits located on the first coating on the
first side of the portion of the silicon semiconductor wafer
substrate.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application is a continuation of application Ser. No.
10/624,766, filed Jul. 22, 2003, pending, which is a continuation
of application Ser. No. 09/639,422, filed Aug. 14, 2000, now U.S.
Pat. No. 6,597,066, issued Jul. 22, 2003, which is a divisional of
application Ser. No. 09/518,293, filed Mar. 3, 2000, now U.S. Pat.
No. 6,287,942, issued Sep. 11, 2001, which is a continuation of
application Ser. No. 09/244,733, filed Feb. 5, 1999, now U.S. Pat.
No. 6,084,288, issued Jul. 4, 2000, which is continuation of
application Ser. No. 08/910,613, filed Aug. 13, 1997, now U.S. Pat.
No. 5,903,044, issued May 11, 1999, which is a continuation of
application Ser. No. 08/614,178, filed Mar. 12, 1996, now U.S. Pat.
No. 5,682,065, issued Oct. 28, 1997.
BACKGROUND OF THE INVENTION
[0002] 1. Field of the Invention
[0003] The present invention relates to hermetically sealed
semiconductor chips. More specifically, the present invention
relates to a fully hermetically sealed semiconductor chip and its
method of manufacture.
[0004] 2. State of the Art
[0005] Solid state electronic devices, or semiconductor chips, are
typically manufactured from a semiconductor material, such as
silicon, germanium, or gallium/arsenide. Circuitry is formed on one
surface of the device with input and output pads being either
formed around the periphery or generally in the center of the
device to facilitate electrical connection.
[0006] The semiconductor chips are typically packaged to protect
the chip from mechanical damage, external contamination, and
moisture. Typical semiconductor chip packages may be divided into
the broad categories of plastic encapsulated type, quasi-hermetic
cavity type and fully hermetic cavity type. While
plastic-encapsulation of semiconductor chips is the most common
form of packaging chips, the plastic encapsulation allows the chip
to be vulnerable to electrochemical processes. The numerous and
extensive polymer/metal interfaces in the plastic encapsulated
semiconductor package affords ample opportunities for moisture
ingress as well as allowing the soluble ions present to provide an
electrolyte for the corrosive failure mechanism of the
semiconductor chip. Also, the extensive use of precious metals
coupled with base metals in chips and packages provides dc galvanic
potentials for electrochemical corrosion reactions and dendrite
growth, thereby affecting the performance and life of the
encapsulated semiconductor chip.
[0007] As a result of the problems associated with the plastic
encapsulation of semiconductor chips, it is desirable to
hermetically package chips to prevent external moisture and
chemicals from contacting a chip. Hermetic packages for
semiconductor chips generally are of the metal and ceramic material
type. The common feature shared by these packages is the use of a
lid or a cap to seal the semiconductor device mounted on a suitable
substrate. The leads from the lead frame also need to be
hermetically sealed. In metal packages, the individual leads are
sealed into the metal platform by separated glass seals. In ceramic
packages the leads are commonly embedded in the ceramic itself.
[0008] Several types of ceramic packages are used to hermetically
seal semiconductor chips. Typically, such types of hermetic
packages are ceramic dual-in-line package, hard glass package,
side-brazed dual-in-line package, bottom-or top-brazed chip
carrier, pin-grid array or other multilayer ceramic package. Some
of such types of packages are described in U.S. Pat. Nos.
4,769,345, 4,821,151, 4,866,571, 4,967,260, 5,014,159, and
5,323,051.
[0009] However, such prior art type hermetically sealed packages
for semiconductor chips all use an external package formed around
the chip to form the hermetic seal. Such external packages increase
the size and cost of the semiconductor chip for installation of the
chip with associated circuitry.
[0010] While it is well known to attempt to seal semiconductor chip
active circuitry at the wafer stage of production by applying a
passivation coating to the wafer with ceramic materials such as
silica and/or silicone nitride by CVD techniques, the subsequent
etching back of the passivation coating at the bond pads of the
semiconductor chip damages the passivation coating around the bond
pads, thereby affecting the reliability of the chip and shortening
the life of the chip from environmental corrosion, as such chips
are not truly hermetically sealed or considered to be fully
hermetically sealed chips.
[0011] In an attempt to hermetically seal semiconductor chips
without the use of external packages, in U.S. Pat. Nos. 4,756,977
and 4,749,631 it has been suggested to use lightweight ceramic
protective coatings on such chips derived from hydrogen
silsesquiozane and silicate esters as well as additional ceramic
layers as hermetic barriers.
[0012] In another attempt to hermetically seal semiconductor chips
without the use of external packages, as disclosed in U.S. Pat. No.
5,481,135, when certain ceramic protective coatings, such as those
derived from hydrogen silsesquiozane and silicate esters, are
applied to the active surface of a semiconductor chip at the wafer
level, even though the bond pads are subsequently exposed by
removing a portion of the ceramic protective coating, the resultant
circuits remain hermetically sealed. However, the use of such
ceramic protective coatings applied to the semiconductor chip at
the wafer level are applied only to the active circuitry side of
the wafer, not both sides of the wafer, nor on the edges of the
semiconductor chips. As such, the semiconductor chip is not truly
or fully hermetically sealed. At best, only one side of the
semiconductor chip may be thought to be hermetically sealed,
thereby leaving the other side of the chip unsealed as well as the
edges of the chip.
[0013] None of the prior art hermetically sealed semiconductor
chips described hereinabove are fully hermetically sealed without
the use of a separate package, either metal or ceramic. A need
exists for a fully hermetically sealed semiconductor chip which is
fully hermetically sealed on both sides and the edges thereof
without the use of a separate package.
BRIEF SUMMARY OF THE INVENTION
[0014] The present invention relates to hermetically sealed
semiconductor chips. More specifically, the present invention
relates to a fully hermetically sealed semiconductor chip and its
method of manufacture. The semiconductor chip of the present
invention is fully hermetically sealed on both sides and the edges
thereof through the use of suitable coatings applied thereto, such
as glass, to prevent an environmental attack of the semiconductor
chip. The fully hermetically sealed semiconductor chip of the
present invention does not require the use of a separate package
for the hermetic sealing of the chip, thereby reducing the size of
such a chip. The method of the manufacture of the semiconductor
chip of the present invention provides a simple process for the
fully hermetic sealing of both sides and the edges of the
semiconductor chip without the use of a separate package.
BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS
[0015] The semiconductor chip of the present invention and its
method of manufacture will be better understood when the
description of the invention is taken in conjunction with the
drawings wherein:
[0016] FIG. 1 is a top view of a semiconductor wafer having a
plurality of semiconductor chips formed thereon.
[0017] FIG. 2 is a top view of one type of semiconductor chip
formed by the method of the present invention.
[0018] FIG. 3 is a top view of a second type of semiconductor chip
formed by the method of the present invention.
[0019] FIG. 4 is a top view of a third type of semiconductor chip
formed by the method of the present invention.
[0020] FIG. 5 is a partial cross-sectional view of the wafer of
semiconductor chips illustrating a portion of the method of the
present invention.
[0021] FIG. 6 is a partial cross-sectional view of the wafer of
semiconductor chips illustrating another portion of the method of
the present invention.
[0022] FIG. 7 is a partial cross-sectional view of the wafer of
semiconductor chips illustrating another portion of the method of
the present invention.
[0023] FIG. 8 is a partial cross-sectional view of the wafer of
semiconductor chips illustrating another portion of the method of
the present invention.
[0024] FIG. 9 is a partial cross-sectional view of the wafer of
semiconductor chips illustrating another portion of the method of
the present invention.
[0025] FIG. 10 is a partial cross-sectional view of the wafer of
semiconductor chips illustrating another portion of the method of
the present invention.
[0026] FIG. 11 is a partial cross-sectional view of a semiconductor
chip of the present invention connected to a lead of a lead
frame.
[0027] FIG. 12A is a portion of a flow chart illustrating the steps
of the present invention.
[0028] FIG. 12B is a portion of a flow chart illustrating the steps
of the present invention.
[0029] FIG. 12C is a portion of a flow chart illustrating the steps
of the present invention.
DETAILED DESCRIPTION OF THE INVENTION
[0030] Referring to drawing FIG. 1, shown is a wafer 10 having a
plurality of semiconductor chips 12 formed thereon. The
semiconductor chips 12 each include a suitable passivation layer or
layers thereon (not shown) which are well known in the industry to
provide protection for the active circuitry on each semiconductor
chip 12. While such passivation layers on areas of each
semiconductor chip 12 provide some sealing effect, they are not
sufficient to provide a fully hermetically sealed semiconductor
chip 12. As shown, the semiconductor chips 12 have not been
separated but remain in the form of a wafer 10 for further
processing. When in wafer form, each semiconductor chip 12 is
separated on all sides from another semiconductor chip 12 by a
street area 22.
[0031] Referring to drawing FIG. 2, a semiconductor chip 12 having
a lead-over-chip configuration is shown having a plurality of bond
pads 14 which are, in turn, connected to a plurality of circuits 16
formed on the semiconductor chip 12, the circuits 16 extending to
opposite sides of the semiconductor chip 12 for subsequent use. The
circuits 16 can be used to connect the semiconductor chip 12
through use of a suitable connector (not shown) to a substrate.
Alternatively, the bond pads 14 may be connected to a lead frame
without the use of the circuits 16.
[0032] Referring to drawing FIG. 3, a semiconductor chip 12 is
shown having a plurality of bond pads 14 located about a portion of
the periphery of the semiconductor chip 12 which are, in turn,
connected to a plurality of circuits 16 formed on the semiconductor
chip 12. The circuits 16 are used to connect the semiconductor chip
12 through the use of a suitable connector (not shown) to a
substrate. The circuits 16 extend to a peripheral edge of the
semiconductor chip 12 and extend around a peripheral edge of the
semiconductor chip as shown at 16' for use with a suitable
connector (not shown). Alternatively, the bond pads 14 located on
the periphery of the semiconductor chip 12 may be connected to a
conventional type lead frame without the use of the circuits
16.
[0033] Referring to drawing FIG. 4, another lead-over-chip type
semiconductor chip 12 is shown having a plurality of bond pads 14
which are, in turn, connected to a plurality of circuits 16 formed
on the semiconductor chip 12 in a configuration that differs from
that of the circuits shown on the semiconductor chip 12 in drawing
FIG. 1. As previously stated, the circuits 16 are used to connect
the semiconductor chip 12 through use of a suitable connector (not
shown) to a substrate. As shown in drawing FIG. 4, the circuits 16
are formed to terminate along one edge of the semiconductor chip 12
for use with a suitable connector and may extend around the edge at
16'. Since the circuits 16 may have any desired configuration on
the semiconductor chip 12 and may extend to the edge thereof and,
if desired, therearound, the manner in which the semiconductor chip
12 may be connected to other circuitry offers a wide variety of
configurations.
[0034] Referring to drawing FIGS. 5 through 10, the method of the
present invention of making a substantially fully hermetically
sealed semiconductor chip 12 will be generally illustrated with
reference to a portion of a wafer 10 having portions of
semiconductor chips 12 located thereon. Subsequently with reference
to drawing FIGS. 12A, 12B, and 12C, the method of the present
invention of making a substantially fully hermetically sealed
semiconductor chip 12 will be generally set forth in a flow process
diagram illustrating the general steps of the method of the present
invention.
[0035] Referring initially to drawing FIG. 5, a portion of a
silicon substrate wafer 10 is shown having portions of two
semiconductor chips 12 formed thereon, each semiconductor chip 12
having, in turn, bond pads 14 thereon, passivation layers 18
thereon, circuitry 20 therein, and street areas 22 located between
the semiconductor chips 12 formed on the wafer 10. Initially, while
the semiconductor chips 12 are in the form of a wafer 10, the
active circuitry side of the semiconductor chips 12, i.e., the top
or first side of the wafer 10, is coated with suitable etchable
glass layer 30 of sufficient thickness to cover the wafer 10 in its
entirety including the street areas 22 formed between the adjacent
semiconductor chips 12 on the wafer 10 while maintaining the
surface of the wafer 10 in a substantially planar state. The glass
layer 30 of etchable glass may be added to the wafer 10 by any
suitable well known technique, such as spin coating, dip or flow
coating. It is preferable that the etchable glass coating be a type
of glass that cures at a relatively low temperature, such as curing
at a temperature generally less than six hundred degrees Centigrade
(600.degree. C.) and is easily etched in subsequent etching
processes. Such types of etchable glasses are well known and may be
selected depending upon processing convenience during
manufacture.
[0036] Referring to drawing FIG. 6, the next step in the method of
the present invention, which may be considered to be optional, is
to reduce the thickness of the wafer 10 by removing a portion of
the bottom or second side thereof by any suitable method of
processing, such as chemical-mechanical planarization of the wafer
10, mechanical abrasion, etc. Alternatively, if the substrate is
sufficiently flat and free of variations in thickness, the wafer 10
need not be reduced in thickness to provide a planar surface on the
bottom thereof but is used as is. Also, if the wafer 10 is
sufficiently thin for subsequent etching therethrough by
conventional etching processes, the step of thinning the wafer 10
may be omitted.
[0037] Referring to drawing FIG. 7, as shown in the next step of
the method of the present invention, a suitable resist material
(not shown) is applied using well known conventional techniques to
the bottom or second side of the wafer 10 with the street areas 22
located between the semiconductor chips 12 of the wafer 10 being
subsequently etched through to the etchable glass layer 30 applied
to the top or first side of the wafer 10. In this manner, the
semiconductor chips 12 are separated from each other while being
retained in the form of a wafer 10 by the etchable glass layer 30
on the top side of the wafer 10. If hard masking techniques are
used to apply the suitable resist material, the resist need not be
removed from the back side of the wafer 10 after the wafer 10 is
etched through to the etchable glass layer 30. Conversely, if
polymeric types of masking techniques are used to apply the
suitable resist material, the resist should be removed after the
etching of the wafer 10.
[0038] Referring to drawing FIG. 8, after the removal of the resist
coating, the next step in the method of the present invention is to
apply a suitable etchable glass coating 40 to the bottom or second
side of the semiconductor chips 12 formed on the wafer 10 to
uniformly coat the bottom or second sides of the semiconductor
chips 12 and fill the etched portions of the street areas 22
located between the semiconductor chips 12 of the wafer 10. The
etchable glass coating 40 may be of any suitable material and
applied by any suitable manner as described hereinbefore. After the
application of the glass coating 40 of etchable glass to
semiconductor chips 12, the semiconductor chips 12 effectively
remain in the form of a wafer 10 by the glass layer 30 and the
glass coating 40 reforming the wafer 10 by filling the street areas
22 previously etched between the semiconductor chips 12 and coating
both the top and bottom, first and second sides, of the wafer
10.
[0039] Referring to drawing FIG. 9, the next step of the method of
the present invention comprises applying a suitable resist material
(not shown) to the glass layer 30 and etching the glass layer 30
through to expose the bond pads 14 of the semiconductor chips 12.
In this manner, the bond pads 14 of the individual semiconductor
chips 12 are exposed to have suitable connections made thereto.
[0040] Referring to drawing FIG. 10, the next steps in the method
of the present invention are (1) forming a suitable metal coating
on the glass layer 30 to substantially hermetically seal the areas
of the glass layer 30 etched to expose the bond pads 14 of the
semiconductor chips 12 and to form suitable electrical connections
to the bond pads 14, (2) applying a suitable resist coating (not
shown) to the metal coating on the glass layer 30 having the
desired circuitry 16 to connect the bond pads 14 to a predetermined
desired connector (not shown), and (3) etching the metal coating to
yield the desired circuitry connections 16 (see drawing FIGS. 2
through 4) to the bond pads 14 of each semiconductor chip 12.
Subsequent to the circuitry 16 being formed on the surface of the
glass layer 30 to form a substantially hermetical seal and to form
connections with the bond pads 14 of semiconductor chips 12, the
resist coating is removed from the circuits 16 and the individual
semiconductor chips 12 are separated by sawing, severing, dividing
or cutting the street areas 22 between each semiconductor chip 12
as shown at cuts 50. The cuts 50 are made in the street areas 22 so
that portions of the glass layer 30 and the glass coating 40 remain
in substantial contact with each edge of each semiconductor chip
12, thereby substantially hermetically sealing all edges of each
semiconductor chip 12. In this manner, each semiconductor chip 12
is substantially fully hermetically sealed on the top, bottom, and
all edges thereof by the glass layer 30 and the glass coating 40
and metal circuits 16 connected to bond pads 14, thereby leaving no
portion of the semiconductor chip 12 exposed for any environmental
attack thereto.
[0041] Referring to drawing FIG. 11, shown connected to a
conventional lead frame 60 is a portion of a semiconductor chip 12
substantially fully hermetically sealed on the top thereof by glass
layer 30, on the bottom thereof by glass coating 40, and all edges
thereof by the combination of the glass layer 30 and the glass
coating 40. As shown, a bond pad 14 having circuitry 16 connected
thereto and substantially hermetically sealing the same is
connected to a lead 62 of the conventional lead frame 60 by a
suitable wire connection 66 having one end thereof 68 connected to
the circuitry 16 connected, in turn, to bond pad 14 of
semiconductor chip 12, while the other end 70 of the wire 66 is
connected to the lead 62 of conventional lead frame 60. The
semiconductor chip 12 is secured to or mounted on the paddle 64 of
the conventional lead frame 60. Alternatively, the lead 62 of the
conventional lead frame 60 may extend over (not shown) the
semiconductor chip 12 for a typical lead-over-chip arrangement well
known in the art with the wires 66 attaching the circuitry 16 to
the lead 62 in such a manner.
[0042] Referring to drawing FIGS. 12A, 12B and 12C, the steps of
the method of the present invention of making a substantially fully
hermetically sealed semiconductor chip 12 are shown in flow process
form corresponding to such steps being previously described with
reference to drawing FIGS. 5-10. In a flow process form, the method
of the present invention of making a substantially fully
hermetically sealed semiconductor chip 12 generally comprises the
following sixteen (16) steps. The method of the present invention
substantially begins by forming the desired individual
semiconductor chips 12 on a wafer 10. If desired, the individual
semiconductor chips 12 are tested for functionality while on the
wafer 10. This step is shown as being optional.
[0043] The third step of the present invention occurs when the
active circuitry side of the semiconductor chips 12, while still in
the form of a wafer 10, is coated with a suitable etchable glass
layer 30. As previously stated, the etchable glass layer 30 may be
of any desired suitable glass, preferably an etchable glass which
cures at a relatively low temperature during processing, such as at
a temperature of less than six hundred degrees Centigrade
(600.degree. C.).
[0044] The fourth step of the present invention comprises another
optional step where the thickness of the wafer 10 is thinned to
provide an even planar surface. The wafer 10 may be thinned from
the bottom or second side thereof by any suitable means, such as
chemical-mechanical planarization, mechanical abrading, etc. While
such thinning is desired, it may not be necessary if the wafer 10
has a sufficiently planar lower surface. Also, if the wafer 10 is
sufficiently thin to be etched by conventional etching techniques
in the steps of the present invention described hereinafter, the
wafer 10 need not be thinned.
[0045] As the fifth step in the method of the present invention, a
coating of suitable resist material is applied to the lower surface
of the wafer 10 so that a portion of the street areas 22 located
between the individual semiconductor chips 12 on the wafer 10 may
be subsequently etched therethrough to the glass layer 30 on the
top of the wafer 10. Any suitable resist material may be used for
such an etching process, depending upon the desired process
parameters.
[0046] As the sixth step of the present invention, after the resist
coating has been applied to the bottom of the wafer 10 and cured,
portions of the street areas 22 located between the semiconductor
chips 12 of the wafer 10 are etched therethrough until the wafer 10
has been substantially etched through to the glass layer 30 applied
to the active circuitry side (top or first side) of the wafer 10
with care being taken not to substantially etch through the glass
layer 30. Any suitable etching process may be used, depending upon
the material from which the wafer 10 is formed, such etching
processes being well known in the art.
[0047] The seventh step of the present invention is optional,
depending upon the type of resist material applied to the wafer 10.
If hard resist masking techniques are used, the resist need not be
removed from the back of the wafer 10. If polymeric resist masking
techniques are used, the resist should be removed from the bottom
or second side of the wafer 10.
[0048] As the eighth step of the present invention, the bottom or
second side of the wafer 10 is next coated with a suitable glass
coating 40 to cover the bottom or second side of the wafer 10 and
fill the previously etched portions of the street areas 22 located
between the plurality of semiconductor chips 12 of the wafer 10.
Any suitable glass coating may be used for such coating of the
wafer 10 to provide a uniform, planar coating of glass on the
bottom of the wafer 10. The glass coating 40 must extend through
the portions of the street areas 22 previously etched, thereby
contacting the glass layer 30 to form an area of glass replacing
the portions of the wafer 10 which have been etched away. In this
manner, the wafer 10 has effectively been reformed or recreated by
the glass layer 30 and the glass coating 40 filling the portions of
the street areas 22 etched away.
[0049] The ninth step of the method of the present invention
comprises applying a coating of suitable resist material on the
active circuitry side (top or first side) of the semiconductor
chips 12 over the glass layer 30 on the wafer 10, leaving the bond
pad areas 14 of the semiconductor chips 12 free of resist material.
Any suitable resist material may be used, depending upon the
desired process parameters of the etching process to be used.
[0050] As the tenth step of the method of the present invention,
subsequent to applying the resist coating over the glass layer 30,
the glass layer 30 is etched through to uncover predetermined bond
pad areas 14 of each semiconductor chip 12 of the wafer 10. Any
suitable etching process may be used, depending upon the type of
glass layer 30 applied to the active circuitry side of the wafer
10.
[0051] As the eleventh step of the method of the present invention,
after etching the glass layer 30 over the bond pads 14 of the
semiconductor chips 12, the resist coating is removed from the
glass layer 30, leaving the bond pads 14 exposed.
[0052] As the twelfth step of the method of the present invention,
the glass layer 30 and exposed bond pads 14 of the semiconductor
chips 12 are coated with a suitable metal coating which is
compatible with the metal of the bond pads 14 of the semiconductor
chips 12. If desired, before the bond pads 14 are coated with a
metal coating, the bond pads 14 may have a diffusion barrier metal
layer applied thereto followed by the application of the metal
coating. The diffusion barrier metal layer may be applied by well
known techniques and may be any suitable metal such as tungsten or
metal alloys such as titanium-tungsten, titanium nitride, and the
like. The metal coating may be applied by any suitable technique to
the glass layer 30 and bond pads 14, such as by sputtering, etc. In
this manner, the metal coating substantially hermetically seals the
bond pads 14 of the semiconductor chips 12 and forms electrical
contact therewith.
[0053] As the thirteenth step of the method of the present
invention, a coating of suitable resist material is applied to the
metal coating applied over the glass layer 30 of the semiconductor
chips 12 of the wafer 10 with the resist material applied in the
desired pattern to etch away the metal coating in the areas where
paths for circuits 16 are not desired for connection to the bond
pads 14 of each semiconductor chip 12. Examples of such circuits 16
remaining after the etching of the metal coating applied to the
glass layer 30 and bond pads 14 are shown in drawing FIGS. 2
through 4 hereinabove previously described.
[0054] As the fourteenth step of the method of the present
invention, after the resist coating has been applied in the desired
paths for circuits 16, the metal coating is etched using a suitable
etching process to form the circuits 16 extending from each bond
pad 14 of each semiconductor chip 12 thereover to the desired
location thereon.
[0055] As the fifteenth step of the method of the present
invention, the resist material is then removed from the metal
coating on the glass layer 30 on the semiconductor chips 12 of the
wafer 10 to expose the circuits 16 electrically connected to and
hermetically sealing the bond pads 14 of the semiconductor chips
12.
[0056] As the sixteenth step of the method of the present
invention, portions of the street areas 22 located between the
semiconductor chips 12 of the wafer 10 are sawed through at
locations 50 in the street areas 22 so that glass layer 30 and
glass coating 40 are maintained on the edges of each semiconductor
chip 12 and the active circuitry (top or first) side of the
semiconductor chip 12 and the bottom (second side) of the
semiconductor chip 12, thereby substantially hermetically sealing
the semiconductor chip 12 in glass while the bond pads 14 are
substantially hermetically sealed by the metal coating forming the
desired circuits 16 connected thereto. In this manner a plurality
of semiconductor chips 12 have been formed with each semiconductor
chip 12 being substantially fully hermetically sealed on each side
thereof and on each edge thereof and the bond pads 14 being
substantially hermetically sealed by the metal coating forming the
circuits 16 to prevent environmental corrosion thereof without the
use of a separate package. By using the method of the present
invention to substantially fully hermetically seal the
semiconductor chip 12, without the use of a separate package, the
semiconductor chip 12 of the present invention is of minimum size
and occupies a minimum volume. Also, the semiconductor chip 12
formed by the method of the present invention has a desired
configuration of circuitry connecting the bond pads 14 of the
semiconductor chip 12 to a desired connector configuration which
may include conventional lead frames 60 or lead-over-chip frames.
If connected to lead frames, the semiconductor chip 12 of the
present invention which is fully hermetically sealed in glass layer
30 and glass coating 40 may be subsequently packaged in suitable
plastic materials in a conventional manner for further protection
from damage. If desired, since the semiconductor chips 12 are
substantially fully hermetically sealed by glass layer 30, having
the desired circuitry 16 thereon, and glass coating 40, the
semiconductor chips 12 may be directly inserted into mating
connectors which match the circuitry formed on the semiconductor
chips 12.
[0057] Additionally, while the circuits 16 have been shown formed
on the active circuitry side of the semiconductor chip 12, the
circuits may be formed in any desired pattern extending over an
edge or edges of the semiconductor chip 12 to facilitate
conventional lead frames, lead-over-chip frames or any desired
connector for use therewith.
[0058] Furthermore, the circuits 16 may simply be formed over the
bond pads 14 of the semiconductor chip 12 and overcoated with
solder and have solder balls stenciled thereon for use in a
flip-chip configuration to be reflowed to connect the semiconductor
chip 12 to a substrate. Similarly, the circuits 16 can be solder
masked and the solder reflowed to attach the semiconductor chip 12
to a substrate having a desired configuration. As shown, the
semiconductor chips 12 may have wires bonded to the circuits 16 by
way of conventional ball type wire bonding or wedge type wire
bonding techniques.
[0059] Additionally, since the semiconductor chips 12 are
substantially fully hermetically sealed having suitable circuitry
16 formed thereon, the semiconductor chips 12 are easily tested in
their final form for determining if the individual semiconductor
chips 12 are known-good-die ready for use.
[0060] From the foregoing it can be seen that changes, additions,
deletions, and modifications can be made to the semiconductor chip
of the present invention and the method of making thereof which
will fall within the scope of the present invention.
* * * * *