Wood; Alan G.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Wood; Alan G..The latest application filed is for "semiconductor constructions".

Company Profile

0.200.200

Wood; Alan G. - Boise ID
Wood; Alan G - Boise ID

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor constructions Grant 10,121,738 - Wood , et al. November 6, 2	2018-11-06
Semiconductor Constructions App 20170125342 - Wood; Alan G. ; et al.	2017-05-04
Semiconductor constructions having through-substrate interconnects Grant 9,583,419 - Wood , et al. February 28, 2	2017-02-28
Semiconductor Constructions Having Through-Substrate Interconnects App 20150130029 - Wood; Alan G. ; et al.	2015-05-14
Semiconductor module system having encapsulated through wire interconnect (TWI) Grant 9,018,751 - Hembree , et al. April 28, 2	2015-04-28
Through wire interconnect (TWI) for semiconductor components having wire in via and bonded connection with substrate contact Grant 9,013,044 - Wood , et al. April 21, 2	2015-04-21
Methods of forming through-substrate interconnects Grant 8,853,072 - Wood , et al. October 7, 2	2014-10-07
Semiconductor Module System Having Encapsulated Through Wire Interconnect (twi) App 20140225259 - Hembree; David R ; et al.	2014-08-14
Method of forming vias in semiconductor substrates and resulting structures Grant 8,786,097 - Watkins , et al. July 22, 2	2014-07-22
Method for fabricating a through wire interconnect (TWI) on a semiconductor substrate having a bonded connection and an encapsulating polymer layer Grant 8,741,667 - Hembree , et al. June 3, 2	2014-06-03
Method for fabricating semiconductor components having lasered features containing dopants Grant 8,728,921 - Wood , et al. May 20, 2	2014-05-20
Methods for wafer-level packaging of microfeature devices and microfeature devices formed using such methods Grant 8,704,380 - Farnworth , et al. April 22, 2	2014-04-22
Through-wafer interconnects for photoimager and memory wafers Grant 8,669,179 - Akram , et al. March 11, 2	2014-03-11
Method For Fabricating A Through Wire Interconnect (twi) On A Semiconductor Substrate Having A Bonded Connection And An Encapsulating Polymer Layer App 20140038406 - Hembree; David R ; et al.	2014-02-06
Method For Fabricating Semiconductor Components Having Lasered Features Containing Dopants App 20130323909 - Wood; Alan G. ; et al.	2013-12-05
Through Wire Interconnect (TWI) For Semiconductor Components Having Wire In Via And Bonded Connection With Substrate Contact App 20130299983 - Wood; Alan G. ; et al.	2013-11-14
Through wire interconnect (TWI) having bonded connection and encapsulating polymer layer Grant 8,581,387 - Hembree , et al. November 12, 2	2013-11-12
Through-wafer Interconnects For Photoimager And Memory Wafers App 20130295766 - Akram; Salman ; et al.	2013-11-07
Stacked semiconductor components having conductive interconnects Grant 8,546,931 - Wood , et al. October 1, 2	2013-10-01
Thinned semiconductor components having lasered features and method of fabrication Grant 8,530,895 - Wood , et al. September 10, 2	2013-09-10
Stacked semiconductor component having through wire interconnect (TWI) with compressed wire Grant 8,513,797 - Wood , et al. August 20, 2	2013-08-20
Through-wafer interconnects for photoimager and memory wafers Grant 8,502,353 - Akram , et al. August 6, 2	2013-08-06
Microelectronic device wafers and methods of manufacturing Grant 8,455,983 - Wood , et al. June 4, 2	2013-06-04
Method for fabricating stacked semiconductor system with encapsulated through wire interconnects (TWI) Grant 8,404,523 - Hembree , et al. March 26, 2	2013-03-26
Semiconductor Constructions Having Through-Substrate Interconnects, and Methods of Forming Through-Substrate Interconnects App 20120306084 - Wood; Alan G. ; et al.	2012-12-06
Methods of forming conductive vias Grant 8,324,100 - Akram , et al. December 4, 2	2012-12-04
Method For Fabricating Stacked Semiconductor System With Encapsulated Through Wire Interconnects (twi) App 20120288997 - HEMBREE; DAVID R. ; et al.	2012-11-15
Methods for fabricating and filling conductive vias and conductive vias so formed Grant 8,294,273 - Akram , et al. October 23, 2	2012-10-23
Thinned Semiconductor Components Having Lasered Features And Method Of Fabrication App 20120241742 - Wood; Alan G. ; et al.	2012-09-27
Stacked Semiconductor Component Having Through Wire Interconnect (twi) With Compressed Wire App 20120228781 - Wood; Alan G. ; et al.	2012-09-13
Method for fabricating stacked semiconductor components Grant 8,258,006 - Wood September 4, 2	2012-09-04
Semiconductor module system having stacked components with encapsulated through wire interconnects (TWI) Grant 8,217,510 - Hembree , et al. July 10, 2	2012-07-10
Semiconductor component having through wire interconnect (TWI) with compressed wire Grant 8,193,646 - Wood , et al. June 5, 2	2012-06-05
Methods for fabricating semiconductor components using thinning and back side laser processing Grant 8,187,983 - Wood , et al. May 29, 2	2012-05-29
Microelectronic Device Wafers And Methods Of Manufacturing App 20120070959 - Wood; Alan G. ; et al.	2012-03-22
Semiconductor Module System Having Stacked Components With Encapsulated Through Wire Interconnects (TWI) App 20120043670 - Hembree; David R. ; et al.	2012-02-23
System with semiconductor components having encapsulated through wire interconnects (TWI) Grant 8,120,167 - Hembree , et al. February 21, 2	2012-02-21
Microelectronic device wafers and methods of manufacturing Grant 8,062,958 - Wood , et al. November 22, 2	2011-11-22
Packaged microelectronic imagers and methods of packaging microelectronic imagers Grant 8,053,857 - Akram , et al. November 8, 2	2011-11-08
Stacked Semiconductor Components Having Conductive Interconnects App 20110175223 - Wood; Alan G. ; et al.	2011-07-21
Support structure for use in thinning semiconductor substrates and for supporting thinned semiconductor substrates Grant 7,960,829 - Wood , et al. June 14, 2	2011-06-14
Methods Of Forming Conductive Vias App 20110136336 - Akram; Salman ; et al.	2011-06-09
Through-wafer interconnects for photoimager and memory wafers Grant 7,956,443 - Akram , et al. June 7, 2	2011-06-07
Methods for fabricating semiconductor components with conductive interconnects having planar surfaces Grant 7,951,702 - Wood , et al. May 31, 2	2011-05-31
Semiconductor components with conductive interconnects Grant 7,935,991 - Wood , et al. May 3, 2	2011-05-03
Methods For Fabricating And Filling Conductive Vias And Conductive Vias So Formed App 20110095429 - Akram; Salman ; et al.	2011-04-28
Packaged Microelectronic Imagers And Methods Of Packaging Microelectronic Imagers App 20110089539 - Akram; Salman ; et al.	2011-04-21
Method Of Forming Vias In Semiconductor Substrates And Resulting Structures App 20110074043 - Watkins; Charles M. ; et al.	2011-03-31
Methods for fabricating and filling conductive vias and conductive vias so formed Grant 7,892,972 - Akram , et al. February 22, 2	2011-02-22
Method for fabricating semiconductor component having encapsulated through wire interconnect (TWI) Grant 7,883,908 - Hembree , et al. February 8, 2	2011-02-08
System With Semiconductor Components Having Encapsulated Through Wire Interconnects (TWI) App 20110024745 - Hembree; David R. ; et al.	2011-02-03
Semiconductor device including through-wafer interconnect structure Grant 7,880,307 - Farnworth , et al. February 1, 2	2011-02-01
Methods For Wafer-level Packaging Of Microfeature Devices And Microfeature Devices Formed Using Such Methods App 20100327462 - Farnworth; Warren M. ; et al.	2010-12-30
Packaged microelectronic imagers and methods of packaging microelectronic imagers Grant 7,858,429 - Akram , et al. December 28, 2	2010-12-28
Method of forming vias in semiconductor substrates and resulting structures Grant 7,855,140 - Watkins , et al. December 21, 2	2010-12-21
Method of fabricating semiconductor components with through interconnects Grant 7,833,832 - Wood , et al. November 16, 2	2010-11-16
Semiconductor Component Having Through Wire Interconnect (TWI) With Compressed Wire App 20100264521 - Wood; Alan G. ; et al.	2010-10-21
Thinned Semiconductor Components Having Lasered Features And Methods For Fabricating Semiconductor Components Using Back Side Laser Processing App 20100264423 - Wood; Alan G. ; et al.	2010-10-21
Microelectronic Device Wafers And Methods Of Manufacturing App 20100252915 - Wood; Alan G. ; et al.	2010-10-07
Methods for wafer-level packaging of microfeature devices and microfeature devices formed using such methods Grant 7,807,505 - Farnworth , et al. October 5, 2	2010-10-05
Image sensor packages and frame structure thereof Grant 7,791,184 - Wood , et al. September 7, 2	2010-09-07
Stacked semiconductor components with through wire interconnects (TWI) Grant 7,786,605 - Wood , et al. August 31, 2	2010-08-31
Semiconductor components and methods of fabrication with circuit side contacts, conductive vias and backside conductors Grant 7,776,647 - Farnworth , et al. August 17, 2	2010-08-17
System for fabricating semiconductor components with conductive interconnects Grant 7,768,096 - Wood , et al. August 3, 2	2010-08-03
Methods For Fabricating Semiconductor Components With Conductive Interconnects Having Planar Surfaces App 20100144139 - Wood; Alan G. ; et al.	2010-06-10
Methods for fabricating semiconductor components with conductive interconnects Grant 7,727,872 - Wood , et al. June 1, 2	2010-06-01
Spacers for packaged microelectronic imagers and methods of making and using spacers for wafer-level packaging of imagers Grant 7,723,741 - Farnworth , et al. May 25, 2	2010-05-25
Methods for thinning semiconductor substrates that employ support structures formed on the substrates Grant 7,713,841 - Wood , et al. May 11, 2	2010-05-11
Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers Grant 7,709,776 - Farnworth , et al. May 4, 2	2010-05-04
Through-wafer interconnects for photoimager and memory wafers Grant 7,683,458 - Akram , et al. March 23, 2	2010-03-23
Method For Fabricating Semiconductor Component Having Encapsulated Through Wire Interconnect (TWI) App 20100047934 - Hembree; David R. ; et al.	2010-02-25
Microelectronic imaging devices and associated methods for attaching transmissive elements Grant 7,663,096 - Farnworth , et al. February 16, 2	2010-02-16
Semiconductor components having encapsulated through wire interconnects (TWI) Grant 7,659,612 - Hembree , et al. February 9, 2	2010-02-09
Frame structure and semiconductor attach process for use therewith for fabrication of image sensor packages and the like, and resulting packages Grant 7,645,635 - Wood , et al. January 12, 2	2010-01-12
Method of forming vias in semiconductor substrates without damaging active regions thereof and resulting structures Grant 7,598,167 - Watkins , et al. October 6, 2	2009-10-06
Electromagnetic Interference Shield Structures For Semiconductor Components App 20090243012 - Vanam; Kiran Kumar ; et al.	2009-10-01
Integrated Conductive Shield For Microelectronic Device Assemblies And Associated Methods App 20090243051 - Vanam; Kiran Kumar ; et al.	2009-10-01
Methods of bonding solder balls to bond pads on a substrate, and bonding frames Grant 7,591,069 - Farnworth , et al. September 22, 2	2009-09-22
Semiconductor devices with permanent polymer stencil and method for manufacturing the same Grant 7,589,010 - Farnworth , et al. September 15, 2	2009-09-15
Stacked semiconductor component Grant 7,589,406 - Wood September 15, 2	2009-09-15
Method And System For Fabricating Semiconductor Components With Through Interconnects App 20090224404 - Wood; Alan G. ; et al.	2009-09-10
Methods and systems for fabricating semiconductor components with through wire interconnects (TWI) Grant 7,579,267 - Wood , et al. August 25, 2	2009-08-25
Method for using data regarding manufacturing procedures integrated circuits (ICS) have undergone, such as repairs, to select procedures the ICs will undergo, such as additional repairs Grant 7,561,938 - Akram , et al. July 14, 2	2009-07-14
Microelectronic Imagers With Optical Devices And Methods Of Manufacturing Such Microelectronic Imagers App 20090155949 - Farnworth; Warren M. ; et al.	2009-06-18
Semiconductor components having through interconnects Grant 7,538,413 - Wood , et al. May 26, 2	2009-05-26
Methods of fabricating a microlens including selectively curing flowable, uncured optically trasmissive material Grant 7,521,296 - Wood , et al. April 21, 2	2009-04-21
Universal wafer carrier for wafer level die burn-in Grant 7,511,520 - Wood , et al. March 31, 2	2009-03-31
Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers Grant 7,504,615 - Farnworth , et al. March 17, 2	2009-03-17
Method For Fabricating Stacked Semiconductor Components App 20090068791 - Wood; Alan G.	2009-03-12
Semiconductor component having plate, stacked dice and conductive vias Grant 7,498,675 - Farnworth , et al. March 3, 2	2009-03-03
Compliant contact pin assembly and card system Grant 7,488,899 - Kirby , et al. February 10, 2	2009-02-10
Microlenses including a plurality of mutually adhered layers of optically transmissive material and systems including the same Grant 7,488,618 - Wood , et al. February 10, 2	2009-02-10
Semiconductor component sealed on five sides by polymer sealing layer Grant 7,482,702 - Farnworth , et al. January 27, 2	2009-01-27
Method for fabricating semiconductor component with thinned substrate having pin contacts Grant 7,473,582 - Wood , et al. January 6, 2	2009-01-06
Seminconductor Device Including Through-wafer Interconnect Structure App 20080308910 - Farnworth; Warren M. ; et al.	2008-12-18
Method for fabricating semiconductor components with thinned substrate, circuit side contacts, conductive vias and backside contacts Grant 7,459,393 - Farnworth , et al. December 2, 2	2008-12-02
Methods of forming conductive elements using organometallic layers and flowable, curable conductive materials Grant 7,442,643 - Wood , et al. October 28, 2	2008-10-28
Semiconductor component and system having thinned, encapsulated dice Grant 7,432,604 - Farnworth , et al. October 7, 2	2008-10-07
System having semiconductor component with multiple stacked dice Grant 7,432,600 - Klein , et al. October 7, 2	2008-10-07
Methods of forming through-wafer interconnects and structures resulting therefrom Grant 7,429,529 - Farnworth , et al. September 30, 2	2008-09-30
System For Fabricating Semiconductor Components With Conductive Interconnects App 20080229573 - Wood; Alan G. ; et al.	2008-09-25
Microelectronic imagers and methods of packaging microelectronic imagers Grant 7,419,841 - Farnworth , et al. September 2, 2	2008-09-02
Methods For Fabricating Semiconductor Components With Conductive Interconnects App 20080206990 - Wood; Alan G. ; et al.	2008-08-28
Semiconductor Components With Conductive Interconnects App 20080203539 - Wood; Alan G. ; et al.	2008-08-28
Semiconductor component having thinned die with conductive vias configured as conductive pin terminal contacts Grant 7,417,325 - Farnworth , et al. August 26, 2	2008-08-26
Semiconductor components having through interconnects and methods of fabrication App 20080157361 - Wood; Alan G. ; et al.	2008-07-03
Compliant contact pin assembly and card system Grant 7,394,267 - Kirby , et al. July 1, 2	2008-07-01
Backside method for fabricating semiconductor components with conductive interconnects Grant 7,393,770 - Wood , et al. July 1, 2	2008-07-01
Semiconductor components having stacked dice Grant 7,388,294 - Klein , et al. June 17, 2	2008-06-17
Systems and methods for testing microfeature devices Grant 7,385,412 - Akram , et al. June 10, 2	2008-06-10
Semiconductor component having thinned die, polymer layers, contacts on opposing sides, and conductive vias connecting the contacts Grant 7,382,060 - Farnworth , et al. June 3, 2	2008-06-03
Universal wafer carrier for wafer level die burn-in Grant 7,362,113 - Wood , et al. April 22, 2	2008-04-22
Contact pin assembly and contactor card Grant 7,358,751 - Kirby , et al. April 15, 2	2008-04-15
Semiconductor component having multiple stacked dice Grant 7,335,994 - Klein , et al. February 26, 2	2008-02-26
Stacked Semiconductor Components With Through Wire Interconnects (TWI) App 20080042247 - Wood; Alan G. ; et al.	2008-02-21
Packaged Microelectronic Imagers And Methods Of Packaging Microelectronic Imagers App 20080020505 - Akram; Salman ; et al.	2008-01-24
Microelectronic imaging devices and associated methods for attaching transmissive elements App 20080001068 - Farnworth; Warren M. ; et al.	2008-01-03
Universal Wafer Carrier For Wafer Level Die Burn-in App 20070285115 - Wood; Alan G. ; et al.	2007-12-13
Semiconductor components having through wire interconnects (TWI) Grant 7,307,348 - Wood , et al. December 11, 2	2007-12-11
Method of making contact pin card system Grant 7,297,563 - Kirby , et al. November 20, 2	2007-11-20
Method Of Forming Vias In Semiconductor Substrates And Resulting Structures App 20070262464 - Watkins; Charles M. ; et al.	2007-11-15
Packaged microelectronic imagers and methods of packaging microelectronic imagers Grant 7,294,897 - Akram , et al. November 13, 2	2007-11-13
Microelectronic imaging devices and associated methods for attaching transmissive elements Grant 7,288,757 - Farnworth , et al. October 30, 2	2007-10-30
Method for testing using a universal wafer carrier for wafer level die burn-in Grant 7,288,953 - Wood , et al. October 30, 2	2007-10-30
Compliant contact pin test assembly and methods thereof Grant 7,288,954 - Kirby , et al. October 30, 2	2007-10-30
Methods of forming a contact pin assembly Grant 7,287,326 - Kirby , et al. October 30, 2	2007-10-30
Semiconductor components and systems having encapsulated through wire interconnects (TWI) and wafer level methods of fabrication App 20070246819 - Hembree; David R. ; et al.	2007-10-25
Compliant contact pin assembly, card system and methods thereof Grant 7,282,932 - Kirby , et al. October 16, 2	2007-10-16
Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers Grant 7,265,330 - Farnworth , et al. September 4, 2	2007-09-04
Double-packaged multi-chip semiconductor module Grant 7,259,450 - Wood , et al. August 21, 2	2007-08-21
System for testing semiconductor components having interconnect with variable flexure contacts Grant 7,259,578 - Akram , et al. August 21, 2	2007-08-21
Wafer-level package and methods of fabricating Grant 7,256,069 - Akram , et al. August 14, 2	2007-08-14
Test carrier for semiconductor components having conductors defined by grooves Grant 7,256,490 - Farnworth , et al. August 14, 2	2007-08-14
Methods for fabricating and filling conductive vias and conductive vias so formed App 20070184654 - Akram; Salman ; et al.	2007-08-09
Probe card for semiconductor wafers having mounting plate and socket Grant 7,250,780 - Hembree , et al. July 31, 2	2007-07-31
Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers App 20070170350 - Farnworth; Warren M. ; et al.	2007-07-26
Methods for fabricating fences on interposer substrates App 20070170942 - Akram; Salman ; et al.	2007-07-26
Methods and systems for fabricating semiconductor components with through wire interconnects (TWI) App 20070167000 - Wood; Alan G. ; et al.	2007-07-19
Methods for packaging a plurality of semiconductor dice using a flowable dielectric material Grant 7,235,431 - Wood , et al. June 26, 2	2007-06-26
Semiconductor component having plate, stacked dice and conductive vias App 20070132104 - Farnworth; Warren M. ; et al.	2007-06-14
Semiconductor components having through wire interconnects (TWI) App 20070126091 - Wood; Alan G. ; et al.	2007-06-07
Semiconductor device structures that include sacrificial, readily removable materials App 20070123058 - Farnworth; Warren M. ; et al.	2007-05-31
Programmed material consolidation methods employing machine vision App 20070124012 - Farnworth; Warren M. ; et al.	2007-05-31
Spacers for packaged microelectronic imagers and methods of making and using spacers for wafer-level packaging of imagers Grant 7,223,626 - Farnworth , et al. May 29, 2	2007-05-29
Semiconductor component having plate and stacked dice Grant 7,224,051 - Farnworth , et al. May 29, 2	2007-05-29
Wafer level semiconductor component having thinned, encapsulated dice and polymer dam Grant 7,221,059 - Farnworth , et al. May 22, 2	2007-05-22
Universal wafer carrier for wafer level die burn-in App 20070103180 - Wood; Alan G. ; et al.	2007-05-10
Apparatus and methods of testing and assembling bumped devices using an anisotropically conductive layer Grant 7,214,962 - Akram , et al. May 8, 2	2007-05-08
Semiconductor device package and method Grant 7,214,566 - Wood , et al. May 8, 2	2007-05-08
Machine vision systems for use with programmable material consolidation system and associated methods and structures Grant 7,216,009 - Farnworth , et al. May 8, 2	2007-05-08
Method for using data regarding manufacturing procedures integrated circuits (ICS) have undergone, such as repairs, to select procedures the ICs will undergo, such as additional repairs App 20070088451 - Akram; Salman ; et al.	2007-04-19
Under bump metallization pad and solder bump connections Grant 7,205,221 - Akram , et al. April 17, 2	2007-04-17
Microelectronic imagers and methods of packaging microelectronic imagers Grant 7,199,439 - Farnworth , et al. April 3, 2	2007-04-03
Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers Grant 7,189,954 - Farnworth , et al. March 13, 2	2007-03-13
Methods for wafer-level packaging of microfeature devices and microfeature devices formed using such methods App 20070045875 - Farnworth; Warren M. ; et al.	2007-03-01
Microelectronic imaging devices and associated methods for attaching transmissive elements App 20070045515 - Farnworth; Warren M. ; et al.	2007-03-01
Test carrier for semiconductor components having conductors defined by grooves App 20070045808 - Farnworth; Warren M. ; et al.	2007-03-01
Methods of forming through-wafer interconnects and structures resulting therefrom App 20070032061 - Farnworth; Warren M. ; et al.	2007-02-08
Method for testing using a universal wafer carrier for wafer level die burn-in Grant 7,167,014 - Wood , et al. January 23, 2	2007-01-23
Universal wafer carrier for wafer level die burn-in Grant 7,167,012 - Wood , et al. January 23, 2	2007-01-23
Method for testing using a universal wafer carrier for wafer level die burn-in Grant 7,161,373 - Wood , et al. January 9, 2	2007-01-09
Method for fabricating encapsulated semiconductor components Grant 7,157,353 - Farnworth , et al. January 2, 2	2007-01-02
Stacked semiconductor component, fabrication method and fabrication system App 20060289992 - Wood; Alan G.	2006-12-28
Method for using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs Grant 7,155,300 - Akram , et al. December 26, 2	2006-12-26
Interposers with alignment fences and semiconductor device assemblies including the interposers App 20060279943 - Akram; Salman ; et al.	2006-12-14
Systems and methods for testing microelectronic imagers and microfeature devices Grant 7,148,715 - Akram , et al. December 12, 2	2006-12-12
Semiconductor components and methods of fabrication with circuit side contacts, conductive vias and backside conductors App 20060275949 - Farnworth; Warren M. ; et al.	2006-12-07
Method for fabricating semiconductor components with thinned substrate, circuit side contacts, conductive vias and backside contacts App 20060270108 - Farnworth; Warren M. ; et al.	2006-11-30
Method for testing using a universal wafer carrier for wafer level die burn-in Grant 7,141,997 - Wood , et al. November 28, 2	2006-11-28
Microelectronic imagers and methods of packaging microelectronic imagers App 20060261340 - Farnworth; Warren M. ; et al.	2006-11-23
Backside method and system for fabricating semiconductor components with conductive interconnects App 20060261446 - Wood; Alan G. ; et al.	2006-11-23
Systems and methods for testing microelectronic imagers and microfeature devices App 20060255826 - Akram; Salman ; et al.	2006-11-16
Semiconductor component and assembly having female conductive members Grant 7,132,731 - Wood , et al. November 7, 2	2006-11-07
Method for fabricating semiconductor components using conductive layer and grooves Grant 7,132,366 - Farnworth , et al. November 7, 2	2006-11-07
Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers App 20060243889 - Farnworth; Warren M. ; et al.	2006-11-02
Compliant contact pin test assembly and methods thereof App 20060244475 - Kirby; Kyle K. ; et al.	2006-11-02
Method for fabricating a silicon carbide interconnect for semiconductor components using heating Grant 7,129,156 - Akram , et al. October 31, 2	2006-10-31
Semiconductor test interconnect with variable flexure contacts having polymer material Grant 7,129,725 - Akram , et al. October 31, 2	2006-10-31
System having semiconductor component with multiple stacked dice App 20060237833 - Klein; Dean A. ; et al.	2006-10-26
Apparatus for conducting heat in a flip-chip assembly App 20060237839 - Akram; Salman ; et al.	2006-10-26
Spacers for packaged microelectronic imagers and methods of making and using spacers for wafer-level packaging of imagers App 20060234422 - Farnworth; Warren M. ; et al.	2006-10-19
Method for using data regarding manufacturing procedures integrated circuits (ICS) have undergone, such as repairs, to select procedures the ICS will undergo, such as additional repairs Grant 7,120,513 - Akram , et al. October 10, 2	2006-10-10
Alignment fences and devices and assemblies including the same App 20060220665 - Akram; Salman ; et al.	2006-10-05
Method for testing using a universal wafer carrier for wafer level die burn-in Grant 7,112,986 - Wood , et al. September 26, 2	2006-09-26
Method for testing using a universal wafer carrier for wafer level die burn-in Grant 7,112,985 - Wood , et al. September 26, 2	2006-09-26
Electrical device allowing for increased device densities App 20060201705 - Salman; Akram ; et al.	2006-09-14
Electronic device components including protective layers on surfaces thereof App 20060197235 - Farnworth; Warren M. ; et al.	2006-09-07
Image sensor packages and frame structure thereof App 20060192230 - Wood; Alan G. ; et al.	2006-08-31
Method for fabricating an interposer Grant 7,093,358 - Akram , et al. August 22, 2	2006-08-22
Semiconductor component having thinned die with polymer layers App 20060183349 - Farnworth; Warren M. ; et al.	2006-08-17
System for testing semiconductor components having interconnect with variable flexure contacts App 20060181294 - Akram; Salman ; et al.	2006-08-17
Method of making a center bond flip chip semiconductor carrier Grant 7,091,065 - Jiang , et al. August 15, 2	2006-08-15
Method for conducting heat in a flip-chip assembly Grant 7,087,511 - Akram , et al. August 8, 2	2006-08-08
Electrical device allowing for increased device densities Grant 7,084,351 - Akram , et al. August 1, 2	2006-08-01
Methods for forming protective layers on semiconductor device substrates Grant 7,084,013 - Farnworth , et al. August 1, 2	2006-08-01
Semiconductor component having thinned substrate, backside pin contacts and circuit side contacts Grant 7,081,665 - Wood , et al. July 25, 2	2006-07-25
Method for fabricating semiconductor components with thinned substrate, back side contacts and circuit side contacts Grant 7,078,266 - Wood , et al. July 18, 2	2006-07-18
Method for fabricating semiconductor component with thnned substrate having pin contacts App 20060154446 - Wood; Alan G. ; et al.	2006-07-13
Semiconductor devices including protective layers on active surfaces thereof Grant 7,067,901 - Farnworth , et al. June 27, 2	2006-06-27
Microlenses including a plurality of mutually adhered layers of optically transmissive material and systems including the same App 20060134827 - Wood; Alan G. ; et al.	2006-06-22
Wafer level methods for fabricating multi-dice chip scale semiconductor components Grant 7,060,526 - Farnworth , et al. June 13, 2	2006-06-13
Semiconductor component having thinned die with conductive vias App 20060118953 - Farnworth; Warren M. ; et al.	2006-06-08
Semiconductor component having plate and stacked dice App 20060113682 - Farnworth; Warren M. ; et al.	2006-06-01
Method for fabricating semiconductor components with conductive vias App 20060115932 - Farnworth; Warren M. ; et al.	2006-06-01
Methods of fabricating a microlens including selectively curing flowable, uncured optically trasmissive material App 20060115925 - Wood; Alan G. ; et al.	2006-06-01
Methods of forming conductive elements using organometallic layers and flowable, curable conductive materials App 20060115926 - Wood; Alan G. ; et al.	2006-06-01
Hybrid interconnect and system for testing semiconductor dice Grant 7,049,840 - Hembree , et al. May 23, 2	2006-05-23
Semiconductor test board having laser patterned conductors Grant 7,049,700 - Hembree , et al. May 23, 2	2006-05-23
Method for fabricating a silicon carbide interconnect for semiconductor components Grant 7,033,920 - Akram , et al. April 25, 2	2006-04-25
Method for fabricating encapsulated semiconductor components having conductive vias Grant 7,029,949 - Farnworth , et al. April 18, 2	2006-04-18
Method of tuning a multi-path circuit Grant 7,012,811 - Jiang , et al. March 14, 2	2006-03-14
Die package, conductive element, semiconductor device including same, microlens, system including same, and methods of manufacture App 20060046347 - Wood; Alan G. ; et al.	2006-03-02
Method of forming vias in semiconductor substrates without damaging active regions thereof and resulting structures App 20060046463 - Watkins; Charles M. ; et al.	2006-03-02
Methods of bonding solder balls to bond pads on a substrate Grant 7,003,874 - Farnworth , et al. February 28, 2	2006-02-28
Spacers for packaged microelectronic imagers and methods of making and using spacers for wafer-level packaging of imagers App 20060040421 - Farnworth; Warren M. ; et al.	2006-02-23
Frame structure and semiconductor attach process for use therewith for fabrication of image sensor packages and the like, and resulting packages App 20060035415 - Wood; Alan G. ; et al.	2006-02-16
Method for fabricating semiconductor components by forming conductive members using solder Grant 6,998,344 - Akram , et al. February 14, 2	2006-02-14
Method for burn-in testing semiconductor dice Grant 6,998,860 - Wood , et al. February 14, 2	2006-02-14
Multi-dice chip scale semiconductor components Grant 6,998,717 - Farnworth , et al. February 14, 2	2006-02-14
Semiconductor devices with permanent polymer stencil and method for manufacturing the same Grant 6,998,334 - Farnworth , et al. February 14, 2	2006-02-14
Hermetic chip in wafer form App 20060022337 - Farnworth; Warren M. ; et al.	2006-02-02
Substrates including alignment fences App 20060017451 - Akram; Salman ; et al.	2006-01-26
Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers App 20060011809 - Farnworth; Warren M. ; et al.	2006-01-19
Semiconductor component and system having back side and circuit side contacts App 20060006520 - Wood; Alan G. ; et al.	2006-01-12
Materials for use in programmed material consolidation processes App 20060008739 - Wood; Alan G. ; et al.	2006-01-12
Semiconductor devices with permanent polymer stencil and method for manufacturing the same App 20060003569 - Farnworth; Warren M. ; et al.	2006-01-05
Methods for optimizing physical characteristics of selectively consolidatable materials App 20060003255 - Wood; Alan G. ; et al.	2006-01-05
Support structure for use in thinning semiconductor substrates and for supporting thinned semiconductor substrates App 20060001139 - Wood; Alan G. ; et al.	2006-01-05
Semiconductor test interconnect with variable flexure contacts having polymer material App 20060001439 - Akram; Salman ; et al.	2006-01-05
Method for fabricating semiconductor components using conductive layer and grooves App 20060003481 - Farnworth; Warren M. ; et al.	2006-01-05
Assemblies including semiconductor substrates of reduced thickness and support structures therefor App 20060003549 - Wood; Alan G. ; et al.	2006-01-05
Semiconductor test interconnect with variable flexure contacts Grant 6,982,564 - Akram , et al. January 3, 2	2006-01-03
Packaged microelectronic imagers and methods of packaging microelectronic imagers App 20050285154 - Akram, Salman ; et al.	2005-12-29
Semiconductor component and a method of fabricating the semiconductor component Grant 6,979,898 - Farnworth , et al. December 27, 2	2005-12-27
Interposer and methods for fabricating same Grant 6,980,014 - Akram , et al. December 27, 2	2005-12-27
Compliant contact pin assembly and card system App 20050275083 - Kirby, Kyle K. ; et al.	2005-12-15
Microelectronic imagers and methods of packaging microelectronic imagers App 20050275048 - Farnworth, Warren M. ; et al.	2005-12-15
Compliant contact pin assembly and card system App 20050275084 - Kirby, Kyle K. ; et al.	2005-12-15
Machine vision systems for use with programmable material consolidation system and associated methods and structures App 20050278056 - Farnworth, Warren M. ; et al.	2005-12-15
Semiconductor package having flex circuit with external contacts Grant 6,975,037 - Farnworth , et al. December 13, 2	2005-12-13
Silicon carbide contact for semiconductor components Grant 6,975,030 - Akram , et al. December 13, 2	2005-12-13
Semiconductor component and system having thinned, encapsulated dice App 20050269700 - Farnworth, Warren M. ; et al.	2005-12-08
Systems and methods for testing microelectronic imagers and microfeature devices App 20050270055 - Akram, Salman ; et al.	2005-12-08
Method for testing using a universal wafer carrier for wafer level die burn-in App 20050253620 - Wood, Alan G. ; et al.	2005-11-17
Method for testing using a universal wafer carrier for wafer level die burn-in App 20050253619 - Wood, Alan G. ; et al.	2005-11-17
Method of fabricating encapsulated semiconductor components by etching Grant 6,964,915 - Farnworth , et al. November 15, 2	2005-11-15
Semiconductor component having multiple stacked dice App 20050242422 - Klein, Dean A. ; et al.	2005-11-03
Method for testing using a universal wafer carrier for wafer level die burn-in App 20050237075 - Wood, Alan G. ; et al.	2005-10-27
Method for testing using a universal wafer carrier for wafer level die burn-in App 20050237076 - Wood, Alan G. ; et al.	2005-10-27
Method for testing using a universal wafer carrier for wafer level die burn-in App 20050237077 - Wood, Alan G. ; et al.	2005-10-27
Compliant contact pin assembly and card system App 20050230811 - Kirby, Kyle K. ; et al.	2005-10-20
Methods of forming a contact pin assembly App 20050229393 - Kirby, Kyle K. ; et al.	2005-10-20
Compliant contact pin assembly and card system App 20050230809 - Kirby, Kyle K. ; et al.	2005-10-20
Method of making contact pin card system App 20050233482 - Kirby, Kyle K. ; et al.	2005-10-20
Compliant contact pin assembly and card system App 20050230810 - Kirby, Kyle K. ; et al.	2005-10-20
Apparatus and methods of testing and assembling bumped devices using an anisotropically conductive layer App 20050230825 - Akram, Salman ; et al.	2005-10-20
Method for fabricating encapsulated semiconductor components App 20050227415 - Farnworth, Warren M. ; et al.	2005-10-13
Hermetic chip in wafer form Grant 6,953,995 - Farnworth , et al. October 11, 2	2005-10-11
Computer including optical interconnect, memory unit, and method of assembling a computer Grant 6,952,744 - Farnworth , et al. October 4, 2	2005-10-04
Semiconductor package having interconnect with conductive members Grant 6,952,054 - Akram , et al. October 4, 2	2005-10-04
Encapsulated semiconductor component having thinned die with conductive vias App 20050200028 - Farnworth, Warren M. ; et al.	2005-09-15
Compliant contact pin assembly, card system and methods thereof App 20050194180 - Kirby, Kyle K. ; et al.	2005-09-08
Semiconductor component and system having thinned, encapsulated dice App 20050181540 - Farnworth, Warren M. ; et al.	2005-08-18
Semiconductor package including flex circuit, interconnects and dense array external contacts App 20050156297 - Farnworth, Warren M. ; et al.	2005-07-21
Encapsulated semiconductor components and methods of fabrication App 20050148160 - Farnworth, Warren M. ; et al.	2005-07-07
Electrical device allowing for increased device densities Grant 6,914,198 - Akram , et al. July 5, 2	2005-07-05
Semiconductor device package and method Grant 6,911,737 - Wood , et al. June 28, 2	2005-06-28
Semiconductor package having flex circuit with external contacts Grant 6,911,355 - Farnworth , et al. June 28, 2	2005-06-28
Electronic assembly having semiconductor component with polymer support member and method of fabrication Grant 6,909,194 - Farnworth , et al. June 21, 2	2005-06-21
Method for fabricating encapsulated semiconductor components Grant 6,908,784 - Farnworth , et al. June 21, 2	2005-06-21
Electrical device allowing for increased device densities Grant 6,909,055 - Akram , et al. June 21, 2	2005-06-21
Chip-scale package and carrier for use therewith App 20050127486 - Akram, Salman ; et al.	2005-06-16
Semiconductor component having backside pin contacts Grant 6,903,442 - Wood , et al. June 7, 2	2005-06-07
Semiconductor component and interconnect having conductive members and contacts on opposing sides Grant 6,903,443 - Farnworth , et al. June 7, 2	2005-06-07
Apparatus for automatically positioning electronic dice within component packages Grant 6,900,459 - Farnworth , et al. May 31, 2	2005-05-31
Test system with interconnect having conductive members and contacts on opposing sides App 20050101037 - Farnworth, Warren M. ; et al.	2005-05-12
Semiconductor test board having laser patterned conductors App 20050084986 - Hembree, David R. ; et al.	2005-04-21
Probe card for testing microelectronic components Grant 6,881,974 - Wood , et al. April 19, 2	2005-04-19
Stereolithographic methods for forming a protective layer on a semiconductor device substrate and substrates including protective layers so formed Grant 6,875,640 - Farnworth , et al. April 5, 2	2005-04-05
Apparatus and methods of testing and assembling bumped devices using an anisotropically conductive layer Grant 6,876,089 - Akram , et al. April 5, 2	2005-04-05
Chip-scale package and carrier for use therewith Grant 6,873,046 - Akram , et al. March 29, 2	2005-03-29
Support structure for thinning semiconductor substrates and thinning methods employing the support structure App 20050064681 - Wood, Alan G. ; et al.	2005-03-24
Consolidatable composite materials, articles of manufacture formed therefrom, and fabrication methods App 20050064679 - Farnworth, Warren M. ; et al.	2005-03-24
Multi-dice chip scale semiconductor components App 20050046038 - Farnworth, Warren M. ; et al.	2005-03-03
Method and apparatus for conducting heat in a flip-chip assembly Grant 6,861,745 - Akram , et al. March 1, 2	2005-03-01
Methods of bonding solder balls to bond pads on a substrate, and bonding frames Grant 6,857,183 - Farnworth , et al. February 22, 2	2005-02-22
Method for fabricating semiconductor components with thinned substrate, back side contacts and circuit side contacts App 20050029650 - Wood, Alan G. ; et al.	2005-02-10
Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems Grant 6,851,597 - Hembree , et al. February 8, 2	2005-02-08
Methods of bonding solder balls to bond pads on a substrate, and bonding frames App 20050023259 - Farnworh, Warren M. ; et al.	2005-02-03
Method and apparatus for conducting heat in a flip-chip assembly Grant 6,847,110 - Akram , et al. January 25, 2	2005-01-25
Methods of bonding solder balls to bond pads on a substrate, and bonding frames Grant 6,839,961 - Farnworth , et al. January 11, 2	2005-01-11
Multi-dice chip scale semiconductor components and wafer level methods of fabrication Grant 6,841,883 - Farnworth , et al. January 11, 2	2005-01-11
Multi-dice Chip Scale Semiconductor Components And Wafer Level Methods Of Fabrication App 20040256734 - Farnworth, Warren M. ; et al.	2004-12-23
Stacked semiconductor package having laser machined contacts Grant 6,833,613 - Akram , et al. December 21, 2	2004-12-21
Test apparatus for testing semiconductor dice including substrate with penetration limiting contacts for making electrical connections Grant 6,828,812 - Farnworth , et al. December 7, 2	2004-12-07
Semiconductor component with backside contacts and method of fabrication Grant 6,828,175 - Wood , et al. December 7, 2	2004-12-07
Semiconductor package having flex circuit with external contacts App 20040227218 - Farnworth, Warren M. ; et al.	2004-11-18
Hermetic chip and method of manufacture Grant 6,815,314 - Farnworth , et al. November 9, 2	2004-11-09
Apparatus for conducting heat in a flip-chip assembly App 20040212102 - Akram, Salman ; et al.	2004-10-28
Method for universal wafer carrier for wafer level die burn-in App 20040212391 - Wood, Alan G. ; et al.	2004-10-28
Semiconductor components having stacked dice and methods of fabrication App 20040212099 - Klein, Dean A. ; et al.	2004-10-28
Semiconductor component having thinned substrate, backside pin contacts and circuit side contacts App 20040207081 - Wood, Alan G. ; et al.	2004-10-21
Wafer level methods for fabricating multi-dice chip scale semiconductor components App 20040188819 - Farnworth, Warren M. ; et al.	2004-09-30
Semiconductor interconnect having laser machined contacts App 20040188824 - Akram, Salman ; et al.	2004-09-30
Method for testing semiconductor wafers Grant 6,798,224 - Hembree , et al. September 28, 2	2004-09-28
Method and apparatus for fabricating electronic device Grant 6,797,545 - Farnworth , et al. September 28, 2	2004-09-28
Method for fabricating semiconductor components by forming conductive members using solder App 20040178491 - Akram, Salman ; et al.	2004-09-16
Apparatus and methods of testing and assembling bumped devices using an anisotropically conductive layer Grant 6,791,185 - Akram , et al. September 14, 2	2004-09-14
Computer including installable and removable cards, optical interconnection between cards, and method of assembling a computer App 20040172492 - Farnworth, Warren M. ; et al.	2004-09-02
Probe card, e.g., for testing microelectronic components, and methods for making same Grant 6,773,938 - Wood , et al. August 10, 2	2004-08-10
Stereolithographic method and apparatus for fabricating spacers for semiconductor devices and resulting structures Grant 6,773,957 - Farnworth , et al. August 10, 2	2004-08-10
Semiconductor components having stacked dice and methods of fabrication App 20040145051 - Klein, Dean A. ; et al.	2004-07-29
Method for fabricating semiconductor package having flex circuit, interconnects, and dense array external contacts App 20040140545 - Farnworth, Warren M. ; et al.	2004-07-22
Probe card for semiconductor wafers and method and system for testing wafers App 20040132222 - Hembree, David R. ; et al.	2004-07-08
Method for fabricating a semiconductor component with external contact polymer support layer Grant 6,756,253 - Farnworth , et al. June 29, 2	2004-06-29
Method for fabricating encapsulated semiconductor components having conductive vias App 20040121563 - Farnworth, Warren M. ; et al.	2004-06-24
Method for fabricating encapsulated semiconductor components by etching App 20040113283 - Farnworth, Warren M. ; et al.	2004-06-17
Probe card, e.g., for testing microelectronic components, and methods for making same App 20040113644 - Wood, Alan G. ; et al.	2004-06-17
Semiconductor package including flex circuit, interconnects and dense array external contacts Grant 6,740,960 - Farnworth , et al. May 25, 2	2004-05-25
Method for universal wafer carrier for wafer level die burn-in Grant 6,737,882 - Wood , et al. May 18, 2	2004-05-18
Electronic assembly having semiconductor component with polymer support member and method of fabrication App 20040087077 - Farnworth, Warren M. ; et al.	2004-05-06
Computer including optical interconnect, memory unit, and method of assembling a computer App 20040088447 - Farnworth, Warren M. ; et al.	2004-05-06
Computer including installable and removable cards, optical interconnection between cards, and method of assembling a computer Grant 6,715,018 - Farnworth , et al. March 30, 2	2004-03-30
Method of making a center bond flip chip semiconductor carrier App 20040057222 - Jiang, Tongbi ; et al.	2004-03-25
Laser marking techniques for bare semiconductor die Grant 6,710,284 - Farnworth , et al. March 23, 2	2004-03-23
Hermetic chip and method of manufacture App 20040051184 - Farnworth, Warren M. ; et al.	2004-03-18
Methods of bonding solder balls to bond pads on a substrate, and bonding frames Grant 6,705,513 - Farnworth , et al. March 16, 2	2004-03-16
Probe Card , E.g., For Testing Microelectronic Components, And Methods For Making Same App 20040040149 - Wood, Alan G. ; et al.	2004-03-04
Semiconductor component with backside contacts and method of fabrication App 20040043603 - Wood, Alan G. ; et al.	2004-03-04
Semiconductor component with backside contacts and method of fabrication App 20040041260 - Wood, Alan G. ; et al.	2004-03-04
Method for fabricating an interposer App 20040034996 - Akram, Salman ; et al.	2004-02-26
Method and system for fabricating contacts on semiconductor components Grant 6,680,213 - Farnworth , et al. January 20, 2	2004-01-20
Semiconductor devices with permanent polymer stencil and method for manufacturing the same App 20040005770 - Farnworth, Warren M. ; et al.	2004-01-08
Silicon carbide interconnect for semiconductor components Grant 6,670,634 - Akram , et al. December 30, 2	2003-12-30
Memory unit, a method of assembling a memory unit, a method of reconfiguring a system, and a memory device Grant 6,662,243 - Farnworth , et al. December 9, 2	2003-12-09
Microelectronic assembly with pre-disposed fill material and associated method of manufacture Grant 6,661,104 - Jiang , et al. December 9, 2	2003-12-09
Method of making center bond flip chip semiconductor carrier Grant 6,647,620 - Jiang , et al. November 18, 2	2003-11-18
Stereolithographic method and apparatus for fabricating spacers for semiconductor devices and resulting structures Grant 6,649,444 - Earnworth , et al. November 18, 2	2003-11-18
Apparatus for forming coaxial silicon interconnects Grant 6,646,458 - Akram , et al. November 11, 2	2003-11-11
Universal wafer carrier for wafer level die burn-in App 20030206030 - Wood, Alan G. ; et al.	2003-11-06
Test carrier with molded interconnect for testing semiconductor components Grant 6,642,730 - Hembree , et al. November 4, 2	2003-11-04
Semiconductor devices including protective layers on active surfaces thereof App 20030201531 - Farnworth, Warren M. ; et al.	2003-10-30
Method and apparatus for testing semiconductor dice Grant 6,639,416 - Akram , et al. October 28, 2	2003-10-28
Interposer and methods for fabricating same Grant 6,634,100 - Akram , et al. October 21, 2	2003-10-21
Method for using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's undergo, such as additional repairs App 20030191550 - Akram, Salman ; et al.	2003-10-09
Stereolithographic method and apparatus for fabricating spacers for semiconductor devices and resulting structures Grant 6,630,365 - Farnworth , et al. October 7, 2	2003-10-07
Methods to utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems Grant 6,619,532 - Hembree , et al. September 16, 2	2003-09-16
Method for conducting heat in a flip-chip assembly App 20030162323 - Akram, Salman ; et al.	2003-08-28
Double-packaged multi-chip semiconductor module App 20030155649 - Wood, Alan G. ; et al.	2003-08-21
Method and apparatus for conducting heat in a flip-chip assembly App 20030151129 - Akram, Salman ; et al.	2003-08-14
Interposer and methods for fabricating same App 20030141885 - Akram, Salman ; et al.	2003-07-31
Silicon carbide interconnect for semiconductor components and method of fabrication App 20030143764 - Akram, Salman ; et al.	2003-07-31
Memory unit, a method of assembling a memory unit, a method of reconfiguring a system, and a memory device App 20030140184 - Farnworth, Warren M. ; et al.	2003-07-24
Apparatus and methods of testing and assembling bumped devices using an anisotropically conductive layer App 20030102559 - Akram, Salman ; et al.	2003-06-05
Method and apparatus for automatically positioning electronic dice within component packages App 20030088973 - Farnworth, Warren M. ; et al.	2003-05-15
Semiconductor test interconnect with variable flexure contacts App 20030090282 - Akram, Salman ; et al.	2003-05-15
Chip-scale package and carrier for use therewith App 20030085466 - Akram, Salman ; et al.	2003-05-08
Method for fabricating semiconductor components and interconnects with contacts on opposing sides App 20030080408 - Farnworth, Warren M. ; et al.	2003-05-01
Method for universal wafer carrier for wafer level die burn-in App 20030080770 - Wood, Alan G. ; et al.	2003-05-01
Electrical device allowing for increased device densities App 20030076665 - Akram, Salman ; et al.	2003-04-24
Methods of bonding solder balls to bond pads on a substrate, and bonding frames App 20030070290 - Farnworth, Warren M. ; et al.	2003-04-17
Under bump metallization pad and solder bump connections App 20030067073 - Akram, Salman ; et al.	2003-04-10
Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems App 20030057260 - Hembree, David R. ; et al.	2003-03-27
Method and apparatus for fabricating electronic device App 20030054592 - Farnworth, Warren M. ; et al.	2003-03-20
Stereolithographic method and apparatus for fabricating spacers for semiconductor devices and resulting structures App 20030032217 - Farnworth, Warren M. ; et al.	2003-02-13
Electrical device allowing for increased device densities App 20030031000 - Akram, Salman ; et al.	2003-02-13
Stackable semiconductor package having conductive layer and insulating layers and method of fabrication App 20030025188 - Farnworth, Warren M. ; et al.	2003-02-06
Under bump metallization pad and solder bump connections App 20030025203 - Akram, Salman ; et al.	2003-02-06
Stereolithographic method and apparatus for fabricating spacers for semiconductor devices and resulting structures App 20030022462 - Farnworth, Warren M. ; et al.	2003-01-30
Electrical device allowing for increased device densities App 20030007340 - Akram, Salman ; et al.	2003-01-09
Method for forming coaxial silicon interconnects App 20030001603 - Akram, Salman ; et al.	2003-01-02
Method and apparatus for conducting heat in a flip-chip assembly App 20020195702 - Akram, Salman ; et al.	2002-12-26
Method And Apparatus For Conducting Heat In A Flip-chip Assembly App 20020197766 - Akram, Salman ; et al.	2002-12-26
Computer including installable and removable cards, optical interconnection between cards, and method of assembling a computer App 20020188787 - Farnworth, Warren M. ; et al.	2002-12-12
Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems App 20020179681 - Hembree, David R. ; et al.	2002-12-05
Method For Fabricating Semiconductor Components App 20020139976 - Hembree, David R. ; et al.	2002-10-03
Method and system for fabricating contacts on semiconductor components App 20020142494 - Farnworth, Warren M. ; et al.	2002-10-03
Semiconductor die test carrier having conductive elastomeric interposer App 20020130677 - Hembree, David Ries ; et al.	2002-09-19
Method for forming coaxial silicon interconnects App 20020084796 - Akram, Salman ; et al.	2002-07-04
Method for using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs App 20020082740 - Akram, Salman ; et al.	2002-06-27
Universal wafer carrier for wafer level die burn-in App 20020070742 - Wood, Alan G. ; et al.	2002-06-13
Stereolithographic method and apparatus for fabricating spacers for semiconductor devices and resulting structures App 20020068417 - Farnworth, Warren M. ; et al.	2002-06-06
Memory unit and method of assembling a computer App 20020065971 - Farnworth, Warren M. ; et al.	2002-05-30
High Density Flip Chip Memory Arrays App 20020058395 - AKRAM, SALMAN ; et al.	2002-05-16
Electrical Device Allowing For Increased Device Densities App 20020054484 - AKRAM, SALMAN ; et al.	2002-05-09
Apparatus and methods of testing and assembling bumped devices using an anisotropically conductive layer App 20020050652 - Akram, Salman ; et al.	2002-05-02
Condensed memory matrix App 20020050638 - Fogal, Rich ; et al.	2002-05-02
Methods of bonding solder balls to bond pads on a substrate, and bonding frames App 20020040521 - Farnworth, Warren M. ; et al.	2002-04-11
Semiconductor test interconnect with variable flexure contacts App 20020027441 - Akram, Salman ; et al.	2002-03-07
Hermetic chip and method of manufacture App 20020028537 - Farnworth, Warren M. ; et al.	2002-03-07
Microelectronic assembly with pre-disposed fill material and associated method of manufacture App 20020025602 - Jiang, Tongbi ; et al.	2002-02-28