U.S. patent application number 11/430538 was filed with the patent office on 2006-10-19 for modular sockets using flexible interconnects.
Invention is credited to Salman Akram, David J. Corisis, Warren M. Farnworth.
Application Number | 20060234560 11/430538 |
Document ID | / |
Family ID | 22106523 |
Filed Date | 2006-10-19 |
United States Patent
Application |
20060234560 |
Kind Code |
A1 |
Farnworth; Warren M. ; et
al. |
October 19, 2006 |
Modular sockets using flexible interconnects
Abstract
A modular bare die socket assembly is provided for attaching a
plurality of miniature semiconductor die to a substrate. The socket
assembly is comprised of a plurality of two-sided plates joined
vertically in a horizontal stack, wherein each plate has a die
socket for the removable insertion of a bare semiconductor die. A
multi-layer interconnect lead tape has a plurality of
lithographically formed leads bent on one end to form nodes for
attachment to bond pads on the removably inserted semiconductor
die, and having opposing ends connectable to the substrate.
Inventors: |
Farnworth; Warren M.;
(Nampa, ID) ; Corisis; David J.; (Meridian,
ID) ; Akram; Salman; (Boise, ID) |
Correspondence
Address: |
TRASK BRITT
P.O. BOX 2550
SALT LAKE CITY
UT
84110
US
|
Family ID: |
22106523 |
Appl. No.: |
11/430538 |
Filed: |
May 8, 2006 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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11050100 |
Feb 3, 2005 |
7040930 |
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11430538 |
May 8, 2006 |
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10401199 |
Mar 27, 2003 |
7094108 |
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11050100 |
Feb 3, 2005 |
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10158979 |
May 30, 2002 |
6612872 |
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10401199 |
Mar 27, 2003 |
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09876805 |
Jun 7, 2001 |
6478627 |
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10158979 |
May 30, 2002 |
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09487935 |
Jan 20, 2000 |
6319065 |
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09876805 |
Jun 7, 2001 |
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09072260 |
May 4, 1998 |
6089920 |
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09487935 |
Jan 20, 2000 |
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Current U.S.
Class: |
439/632 |
Current CPC
Class: |
Y10T 29/49222 20150115;
H01R 12/721 20130101; H01R 13/24 20130101; H01L 2924/0002 20130101;
Y10T 29/49126 20150115; Y10T 29/49147 20150115; H01L 2225/06572
20130101; H01R 13/514 20130101; H01L 2225/06555 20130101; Y10T
29/4913 20150115; H01L 2924/3011 20130101; Y10T 29/49204 20150115;
Y10T 29/49169 20150115; H01R 12/856 20130101; H01L 2225/06527
20130101; H01L 2225/06593 20130101; H01L 25/0657 20130101; H01R
12/7082 20130101; Y10T 29/49153 20150115; H01L 2924/00 20130101;
H01R 12/57 20130101; H05K 7/023 20130101; H01L 2924/0002 20130101;
H01L 2225/06551 20130101 |
Class at
Publication: |
439/632 |
International
Class: |
H01R 24/00 20060101
H01R024/00 |
Claims
1. A connector for a semiconductor die having a plurality of bond
pads on at least one surface thereof and a substrate comprising:
two plates each having a first side, a second side, a first end,
and a second end, the first side of a first plate located adjacent
the second side of a second plate for forming a die socket having a
die slot at a first end thereof and having a lead slot at a second
end thereof; a tape including conductive leads formed on a portion
of a film of insulation, at least one of conductive leads having an
inner end for resiliently contacting the at least one bond pad of
the bare semiconductor die and having an outer end for contacting a
substrate; biasing apparatus for engaging the inner end of the at
least one conductive lead into resilient contact with the at least
one bond pad of the bare semiconductor die; and a third plate
located adjacent one of the first plate and the second plate for
forming a second die socket.
2. The connector of claim 1, wherein the die slot and the lead slot
are located in the first plate and the second plate of the two
plates when the first plate and the second plate are abutted at the
first end and the second end, respectively, of each plate, the lead
slot offset from the die slot.
3. Apparatus for connecting a semiconductor die having a plurality
of bond pads on at least one surface thereof and a substrate
comprising: two plates each having a first side, a second side, a
first end, and a second end, the first side of a first plate
located adjacent the second side of a second plate for forming a
die socket having a die slot at a first end thereof and a lead slot
at a second end thereof; a tape including conductive leads formed
on a portion of an insulation film having at least one conductive
lead having an inner end for resiliently contacting at least one
bond pad of the bare semiconductor die and having an outer end for
contacting a portion of the substrate; biasing apparatus for
engaging the inner end of the at least one conductive lead into
resilient contact with the at least one bond pad of the bare
semiconductor die; and a third plate located adjacent one of the
first plate and the second plate for forming a second die
socket.
4. The apparatus of claim 3, wherein the die slot and the lead slot
are located in the first plate and the second plate of the two
plates when the first plate and the second plate are abutted at the
first end and the second end, respectively, of each plate, the lead
slot offset from the die slot.
5. A vertical connector for connecting a semiconductor die having a
plurality of bond pads on at least one surface thereof and a
substrate comprising: two plates each having a first side, a second
side, a first end, and a second end, the first side of a first
plate located adjacent the second side of a second plate for
forming a die socket having a die slot at a first end thereof and
having a lead slot at a second end thereof; a tape including at
least one lead formed on a portion of a film having an inner end
for resilient electrical contact with the plurality of bond pads of
one of the bare semiconductor die and an outer end for contacting a
substrate; apparatus for engaging the inner end of the at least one
conductive lead into resilient contact with the at least one bond
pad of the semiconductor die; and a third plate located adjacent
one of the first plate and the second plate for forming a second
die socket.
6. The vertical connector of claim 5, wherein the die slot and the
lead slot are located in the first plate and the second plate of
the two plates when the first plate and the second plate are
abutted at the first end and the second end, respectively, of each
plate, the lead slot offset from the die slot.
7. A method of forming a module for the insertion of semiconductor
die thereinto and connecting said semiconductor die to a substrate
having conductor thereon, said semiconductor die having a plurality
of conductive bond pads on a surface thereof, said method
comprising: providing a first plate having first and second major
sides with corresponding first and second ends; providing a second
plate having first and second major sides with corresponding first
and second ends; providing a multi-layer interconnect lead tape
including a pattern of electrically conductive leads formed on an
insulative film, said conductive leads having inner ends for
resilient electrical contact with bond pads of said semiconductor
die and outer ends for electrical contact with said conductors on
said substrate; providing resilient apparatus; abutting the second
major side of said first plate and the first major side of said
second plate thereby forming a bare die socket having a die slot at
the first ends of said first plate and said second plate and a lead
slot at the second ends of said first plate and said second plate,
the first ends of said multi-layer interconnect lead tape extending
between the second major side of said first plate and the first
major side of said second plate and the second ends of said
multi-layer interconnect lead tape extending beyond the second ends
of said first plate and said second plated.
8. The method of claim 7, further comprising: resiliently biasing
the firs ends of said multi-layer interconnect lead tape.
9. The method of claim 7, further comprising: contacting the second
ends of said multi-layer interconnect lead tape with the conductors
on said substrate.
10. The method of claim 7, further comprising: providing a third
plate having a first and second major sides and corresponding first
and second ends; and abutting the first major side of said third
plate with the second major side of said second plate thereby
forming another bare die socket.
11. A method of forming a module for the insertion of semiconductor
die thereinto and connecting said semiconductor die to a substrate
having conductor thereon, said semiconductor die having a plurality
of conductive bond pads on a surface thereof, said method
comprising: providing a first plate having first and second major
sides with corresponding first and second ends; providing a second
plate having first and second major sides with corresponding first
and second ends; providing a multi-layer interconnect lead tape
including a pattern of electrically conductive leads formed on an
insulative film, said conductive leads having inner ends for
resilient electrical contact with bond pads of said semiconductor
die and outer ends for electrical contact with said conductors on
said substrate; providing resilient apparatus; abutting the second
major side of said first plate and the first major side of said
second plate thereby forming a bare die socket having a die slot at
the first ends of said first plate and said second plate and a lead
slot at the second ends of said first plate and said second plate,
the first ends of said multi-layer interconnect lead tape extending
between the second major side of said first plate and the first
major side of said second plate and the second ends of said
multi-layer interconnect lead tape extending beyond the second ends
of said first plate and said second plated.
12. The method of claim 11, further comprising: resiliently biasing
the firs ends of said multi-layer interconnect lead tape.
13. The method of claim 11, further comprising: contacting the
second ends of said multi-layer interconnect lead tape with the
conductors on said substrate.
14. The method of claim 11, further comprising: providing a third
plate having a first and second major sides and corresponding first
and second ends; and abutting the first major side of said third
plate with the second major side of said second plate thereby
forming another bare die socket.
15. A multi-layer interconnect tape for interconnecting the bond
pads of a semiconductor die to a substrate, said tape comprising: a
first layer of insulative film having first and second surfaces; a
second layer of conductive material formed on a first surface of
said insulative film;
16. The interconnect tape of claim 15, wherein said conductive
material is metal.
17. The interconnect tape of claim 15, wherein said second layer is
formed as a plurality of conductive leads having first ends
configured to abut said bond pads of said semiconductor die and
second ends for connection to conductive traces of a substrate.
18. The interconnect tape of claim 15, wherein said tape is bent to
form nodes in said conductive leads for contact with said bond pads
of said semiconductor die.
19. The interconnect tape of claim 15, wherein said tape is abutted
against said bond pads of said semiconductor die by a resilient
member.
20. The interconnect tape of claim 19, wherein said resilient
member comprises an elastomeric member fixed to said first
layer.
21. The interconnect tape of claim 19, wherein said resilient
member comprises a bendable extension of an apparatus holding said
tape.
22. The interconnect tape of claim 21, wherein said resilient
member comprises said first layer of said tape.
23. The interconnect tape of claim 15, further comprising a third
layer of conductive material formed on said second surface of said
first layer and extending past said second layer for contact with
additional bond pads of said semiconductor die, said additional
bond pads being located in another row of bond pads on said
semiconductor die from a first portion of said bond pads of said
semiconductor die.
24. A plate for adapted for abutting an another adjacent plate to
form an interconnect socket for a semiconductor die for connection
of a substrate, said plate comprising: a generally planar member
formed of an insulative material, said plate having a first side
and a second side, a first end and a second end; said second side
including a recessed die slot for insertion of a bare die from said
first end; said first side including a recess for holding an
interconnect lead tape for resilient contact with said die and a
substrate; and whereby a second side of one said plate abutted to
the first side of said another adjacent plate to forms a module for
removable insertion of a semiconductor die for electrical
interconnection to said substrate.
25. The plate according to claim 24, wherein one side of said
recessed die slot comprises of a wall of said second side of said
another adjacent plate.
26. The plate according to claim 24, wherein an interconnect lead
tape is positioned and retained between a first side of said plate
and a second side of a second adjacent plate.
27. The plate according to claim 24, further comprising: alignment
posts fixed to said second side for aligning/retaining passage
through said interconnect lead tape.
28. The plate according to claim 24, wherein said plate and another
adjacent plate are aligned substantially perpendicular to said
substrate.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application is a continuation of application Ser. No.
11/050,100, filed Feb. 3, 2005, pending, which is a divisional of
application Ser. No. 10/401,199, filed Mar. 27, 2003, pending,
which is a continuation of application Ser. No. 10/158,979, filed
May 30, 2002, now U.S. Pat. No. 6,612,872, issued Sep. 2, 2003,
which is a continuation of application Ser. No. 09/876,805, filed
Jun. 7, 2001, now U.S. Pat. No. 6,478,627, issued Nov. 12, 2002,
which is a continuation of application Ser. No. 09/487,935, filed
Jan. 20, 2000, now U.S. Pat. No. 6,319,065, issued Nov. 20, 2001,
which is a continuation of application Ser. No. 09/072,260, filed
May 4, 1998, now U.S. Pat. No. 6,089,920, issued Jul. 18, 2000.
BACKGROUND OF THE INVENTION
[0002] 1. Field of the Invention
[0003] This invention relates generally to methods and apparatus
for electrically connecting semiconductor devices to circuit
boards. More particularly, the invention relates to a socket into
which one or more bare semiconductor dice may be inserted for
connection to a circuit board without wire bonding of the contact
pads of the semiconductor die.
[0004] 2. State of the Art
[0005] The assembly of a semiconductor device from a leadframe and
semiconductor die ordinarily includes bonding of the die to a
paddle of the leadframe, and wire bonding bond pads on the die to
inner leads, i.e., lead fingers of the leadframe. The inner leads,
semiconductor die, and bond wires are then encapsulated, and
extraneous parts of the leadframe are excised, forming outer leads
for connection to a substrate such as a printed wiring board
(PWB).
[0006] The interconnection of such packaged integrated circuits
(IC) with circuit board traces has advanced from simple soldering
of package leads to the use of mechanical sockets, also variably
known as connectors, couplers, receptacles and carriers. The use of
sockets was spurred by the desire for a way to easily connect and
disconnect a packaged semiconductor die from a test circuit,
leading to zero-insertion-force (ZIF), and low-insertion-force
(LIF) apparatus. Examples of such are found in U.S. Pat. No.
5,208,529 of Tsurishima et al., U.S. Pat. No. 4,381,130 of
Sprenkle, U.S. Pat. No. 4,397,512 of Barraire et al., U.S. Pat. No.
4,889,499 of Sochor, U.S. Pat. No. 5,244,403 of Smith et al., U.S.
Pat. No. 4,266,840 of Seidler, U.S. Pat. No. 3,573,617 of Randolph,
U.S. Pat. No. 4,527,850 of Carter, U.S. Pat. No. 5,358,421 of
Petersen, U.S. Pat. No. 5,466,169 of Lai, U.S. Pat. No. 5,489,854
of Buck et al., U.S. Pat. No. 5,609,489 of Bickford et al., U.S.
Pat. No. 5,266,833 of Capps, U.S. Pat. No. 4,995,825 of Korsunsky
et al., U.S. Pat. Nos. 4,710,134 and 5,209,675 of Korsunsky, U.S.
Pat. No. 5,020,998 of Ikeya et al., U.S. Pat. No. 5,628,635 of
Ikeya, U.S. Pat. No. 4,314,736 of Demnianiuk, U.S. Pat. No.
4,391,408 of Hanlon et al., and U.S. Pat. No. 4,461,525 of
Griffin.
[0007] New technology has enabled the manufacture of very small
high-speed semiconductor dice having large numbers of closely
spaced bond pads. However, wire bonding of such semiconductor dice
is difficult on a production scale. In addition, the very fine
wires are relatively lengthy and have a very fine pitch, leading to
electronic noise.
[0008] In order to meet space demands, much effort has been
expended in developing apparatus for stack-mounting of packaged
dice on a substrate in either a horizontal or vertical
configuration. For example, vertically oriented semiconductor
packages having leads directly connected to circuit board traces
are shown in U.S. Pat. No. 5,444,304 of Hara et al., U.S. Pat. No.
5,450,289 of Kweon et al., U.S. Pat. No. 5,451,815 of Taniguchi et
al., U.S. Pat. No. 5,592,019 of Ueda et al., U.S. Pat. No.
5,619,067 of Sua et al., U.S. Pat. No. 5,635,760 of Ishikawa, U.S.
Pat. No. 5,644,161 of Burns, U.S. Pat. No. 5,668,409 of Gaul, and
U.S. Reissue Pat. Re. 34,794 of Farnworth.
[0009] However, none of the above patents relate to the socket
interconnection of a bare (i.e., unpackaged) semiconductor die to a
substrate such as a circuit board.
[0010] Sockets also exist for connecting daughter circuit boards to
a mother board, as shown in U.S. Pat. No. 5,256,078 of Lwee et al.
and U.S. Pat. No. 4,781,612 of Thrush. U.S. Pat. No. 4,501,461 and
Re. 28,171 of Anhalt show connectors for connecting a socket to a
circuit board, and wiring to an electronic apparatus,
respectively.
[0011] U.S. Pat. No. 5,593,927 of Farnworth et al. discloses a
semiconductor die having an added protective layer and traces, and
which is insertable into a multi-die socket. The conductive edges
of the semiconductor die are connected through an edge "connector"
to circuit board traces. The number of insertable semiconductor
dice is limited by the number of semiconductor die compartments in
the socket, and using fewer dice is a waste of space.
BRIEF SUMMARY OF THE INVENTION
[0012] A modular bare die socket is provided by which any number of
bare (unpackaged) semiconductor die having bond pads along the edge
of one major side may be interconnected with a substrate in a
densely packed arrangement. The socket is particularly applicable
to high speed, e.g., 300 MHZ die of small size or those die of even
faster speeds.
[0013] The socket comprises a plurality of plates which have a
semiconductor die slot structure for aligning and holding a bare
die or dice in a vertical orientation, and interconnect structure
for aligning and retaining a multi-layer lead tape in contact with
conductive bond pads of an inserted die. The interconnect lead
tapes have outer ends which are joined to conductive traces on a
substrate such as a printed wiring board (PWB).
[0014] Each lead tape includes a node portion which is forced
against a bond pad to make resilient contact therewith. Various
means for providing the contact force include a resilient lead
tape, an elastomeric layer or member biasing the lead tape, or a
noded arm of the plate, to which the lead tape is fixed.
[0015] A multi-layer interconnect lead tape may be formed from a
single layer of polymeric film upon which a pattern of fine pitch
electrically conductive leads is formed. Methods known in the art
for forming lead frames, including negative or positive photoresist
optical lithography, may be used to form the lead tape. The lead
tape may be shaped under pressure to the desired configuration.
[0016] The plates with intervening interconnect lead tapes are
bonded together with adhesive or other means to form a permanent
structure.
[0017] The plates are formed of an electrically insulative material
and may be identical. Each plate has "left side structure" and
"right side structure" which work together with the opposing
structure of adjacent plates to achieve the desired alignment and
retaining of the semiconductor die and the lead tape for effective
interconnection.
[0018] Any number of plates may be joined to accommodate the
desired number of bare semiconductor dice. Assembly is easily and
quickly accomplished. If desired, end plates having structure on
only one side may be used to cap the ends of the socket.
[0019] Thus, a socket is formed as a dense stack of semiconductor
die-retaining plates by which the footprint per semiconductor die
is much reduced.
[0020] The modular socket is low in cost and effectively provides
the desired interconnection. A short interconnect lead distance is
achieved, leading to reduced noise. The impedance may be matched up
to the contact or semiconductor die.
[0021] The primary use of the modular bare semiconductor die socket
is intended to be for permanent attachment to circuit boards of
electronic equipment where die replacement will rarely be required.
Although the socket may be used in a test stand for temporarily
connecting dice during testing, new testing techniques performed at
the wafer scale generally obviate the necessity for such later
tests.
BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS
[0022] The invention is illustrated in the following figures,
wherein the elements are not necessarily shown to scale:
[0023] FIG. 1 is a perspective view of a modular socket of the
invention;
[0024] FIG. 2 is a perspective view of partially assembled modules
of a modular socket of the invention;
[0025] FIG. 3 is a cross-sectional edge view of a portion of a
modular socket of the invention, as generally taken along line 3-3
of FIG. 1 and having an exploded portion;
[0026] FIG. 4 is a perspective view of a multi-layer lead tape
useful in a modular bare die socket of the invention;
[0027] FIG. 5 is a plan view of a multi-layer lead tape useful in a
modular bare die socket of the invention;
[0028] FIG. 5A is a plan view of another embodiment of a
multi-layer lead tape of a modular bare die socket of the
invention;
[0029] FIG. 6 is a perspective view of a further embodiment of a
multi-layer lead tape of a modular bare semiconductor die socket of
the invention;
[0030] FIG. 7 is a perspective view of partially assembled modules
of a further embodiment of a modular bare semiconductor die socket
of the invention;
[0031] FIG. 8 is a perspective view of partially assembled modules
of an additional embodiment of a modular bare semiconductor die
socket of the invention;
[0032] FIG. 9 is a cross-sectional edge view of a portion of a
further embodiment of a modular bare semiconductor die socket of
the invention, as taken along line 3-3 of FIG. 1, and having an
exploded portion;
[0033] FIG. 10 is a cross-sectional edge view of a portion of
another embodiment of a modular bare semiconductor die socket of
the invention, as taken along line 3-3 of FIG. 1;
[0034] FIG. 11 is a view of a semiconductor die for use in the
modular bare semiconductor die socket of FIG. 10;
[0035] FIG. 12 is a view of the semiconductor die of FIG. 11 used
in the modular bare semiconductor die socket of FIG. 10; and
[0036] FIG. 13 is a view of an alternative embodiment of the
semiconductor die and modular bare semiconductor die socket of FIG.
12 illustrating a modified lead tape.
DETAILED DESCRIPTION OF THE INVENTION
[0037] As depicted in drawing FIG. 1, a modular bare die socket 10
of the invention comprises a plurality of modules 12A, 12B and 12C
formed of plates 14A, 14B, 14C, and 14D which are stacked
perpendicular to a substrate 16. A bare (unpackaged) semiconductor
die 18 with conductive bond pads (not visible) near one edge on a
major surface 20 thereof, e.g., the "active surface" may be
inserted as shown into a die slot 22 and have its bond pads
interconnected to conductive traces (not visible) on the surface 24
of the substrate 16.
[0038] The internal structures of plates 14C and 14D are depicted
in drawing FIG. 2. Each of the plates 14A, 14B, 14C and 14D has a
first side 26 and an opposing second side 28. The plates have first
ends 30 having die slots 22, and second ends 32 having lead slots
44 through which lead tapes pass.
[0039] In these figures, the first side 26 is taken as the left
side of each plate and the second side 28 is taken as the right
side. The regular plates 14A, 14B and 14C have structures on both
sides 26, 28 and may be the exclusive plates of the socket 10. The
structure provides for accommodating bare semiconductor die 18 of a
particular size, number and spacing of bond pads, etc., and for
electrically interconnecting the semiconductor die 18 to a
substrate 16. Typically, all regular plates 14A, 14B, 14C of a bare
die socket 10 are identical but in some cases may differ to
accommodate semiconductor dice of different size, bond pad
configuration, etc., within different modules 12A, 12B, 12C, etc.,
of a socket.
[0040] Alternatively, one or two end plates 14D may be used to cap
any number of intervening regular plates 14A, 14B and 14C. In
contrast to the regular plates 14A, 14B and 14C, such end plates
14D have cooperating structure on one side only, i.e., the internal
side, and may simply have a flat exterior side which in drawing
FIGS. 1, 2 and 3 is the second side 28. Specifically designed end
plates 14D may be used on either, neither or both ends of the
socket 10, and have structure on one side to complement the facing
side of the adjacent regular plate 14A, 14B, 14C.
[0041] The structure of the second side 28 of the regular plates
14A, 14B and 14C is shown as including an upwardly opening die slot
22 with a side wall 34, edge walls 38, and stop end wall 36 of
lower beam 40. Lower beam 40 has an exposed surface 42 which is one
side of an interconnect lead slot 44. The lower beam 40 is shown as
having a width 41 exceeding width 46 for accommodating means for
accurate alignment and retention of a multi-layer interconnect lead
tape 50, not shown in drawing FIG. 2 but to be described later in
relation to drawing FIGS. 3 through 6.
[0042] The first sides 26 of plates 14A, 14B, 14C and 14D are as
shown with respect to end plate 14D. In this embodiment, first side
26 is largely flat with a recess 48 for accommodating portions of
the interconnect lead tape. Recess 48 has a width 60 which is shown
to approximate the width 46 of the die slot 22, and has a depth 62
which is sufficient to take up the lead tape 50 when it is
compliantly moved into the recess upon insertion of a semiconductor
die 18 into die slot 22.
[0043] The module 12C including the first side of plate 14D and the
second side of plate 14C has alignment posts 52 and matching holes
54 for aligning the plates 14C, 14D to each other. Also shown are
alignment/retention posts 56 and matching holes 58 for (a) aligning
and retaining an interconnect lead tape 50 in the module, and for
(b) aligning the plates 14C, 14D with each other. The posts 52, 56
and matching holes 54, 58 together comprise a module alignment
system.
[0044] Mating portions of adjacent plates are joined by adhesive
following installation of the lead tape 50 on alignment/retention
posts 56. Each of the posts 52, 56 is inserted into holes 54, 58 so
that all of the plates 14A, 14B, 14C and 14D are precisely aligned
with each other to form a monolithic socket 10. In drawing FIG. 3,
all of the regular plates 14A, 14B, and 14C are identical.
[0045] In the views of drawing FIGS. 3 through 5A, a multi-layer
interconnect lead tape 50 is shown as comprised of a first
insulative layer 64, with a second layer 66 of conductive leads
70A-70C fixed to it. The first insulative layer 64 may be formed of
a film of polymeric material such as polyimide, polyimide siloxane,
or polyester. A second conductive layer 66, typically of metal, is
formed on the first insulative layer 64 in the form of individual
leads 70A, 70B, 70C, etc. Methods well-known in the industry for
producing multi-layer lead frames may be used for forming the fine
pitch leads 70 on the first insulative layer 64. Thus, for example,
the leads 70 may be formed by combining metal deposition with
optical lithography using either a positive or negative photoresist
process. Any method capable of providing fine pitch leads 70 on the
first insulative layer 64 of the lead tape 50 may be used.
[0046] The lead tape 50 has an upper portion 72 which is configured
with a total width 76 of leads 70 which generally spans the
semiconductor die 18, but will be less than width 46 of die slot 22
(see FIG. 2). A lower portion 74 has a greater width 78 which may
correspond generally to width 41 of the lower beam 40 (see FIG. 2).
Alignment apertures 80, 82 are formed in the lower portion 74 to be
coaxial along axes 84, 86, respectively, with alignment/retention
posts 56.
[0047] The upper portion 72 includes lead portions which contact
the bond pads 90 of the dice. The lower portion 74 includes lead
portions which are joined to substrate 16.
[0048] In the embodiments of drawing FIGS. 3, 4, 5 and 5A, the lead
tape 50 is shown as being formed in the general shape of the letter
"S." A contact node 88 is formed in each lead 70 in the upper
portion 72 by forming the upper portion as a bend. The node 88 is
configured to be pushed away by contact with a bond pad 90 of a
semiconductor die. The resistance to bending of the lead produces
compression therebetween and enables consistent electrical contact
with the bond pad 90 of a semiconductor die. Where the surfaces of
the bond pads 90 of the semiconductor die 18 are essentially
coplanar, contact between the bond pads 90 and the leads 70 is
maintained. The compressive force between the semiconductor die 18
and the leads 70 is dependent upon the particular material of first
insulative layer 64 and its thickness, the thickness and material
of second conductive layer 66, and lead displacement from the
unbiased position which results from die insertion. Typically, the
first insulative layer 64 may vary in thickness from about 12 to
about 300 .mu.m. The preferred thickness of the second conductive
layer 66 is about 25 to about 75 .mu.m. The total thickness of the
combined first and second layers of the lead tape 50 is preferred
to be from about 75 .mu.m to about 100 .mu.m.
[0049] The lower ends 92 of leads 70 are shown as bent to a nearly
horizontal position for surface attachment to a substrate 16.
[0050] The lower ends 92 are shown as having the first insulative
layer 64 removed to provide a metal surface for attachment by
soldering or other method to a substrate 16.
[0051] In a variation of the lead tape 50 shown in drawing FIG. 5A,
the upper ends of the leads 70, i.e., the leads in the upper
portion 72, may have both the first insulative layer 64 and second
conductive layer 66 removed between the leads, thereby singulating
them. Each lead 70 retains both layers 64, 66 for retaining a
required resistance to bending in each lead. Thus, each lead is
independently compliant with respect to an inserted semiconductor
die 18 to retain conductive contact with a bond pad 90 on the
semiconductor die 18.
[0052] An alternative embodiment of the interconnect lead tape 50
is depicted in drawing FIG. 6. The lower ends 92 of leads 70 are
bent in the opposite direction from drawing FIGS. 5 and 5A and in
addition, the first insulative layer 64 is not removed from the
lower ends 92.
[0053] The lead tape 50 may be bent to the desired shape by a
suitable stamping tool or the like, wherein the "at-rest" shape is
uniform from tape to tape.
[0054] The placement of the module components, i.e., the die slot
22, lower beam 40, interconnect lead slot 44, and recess 48 may be
varied in the longitudinal direction 94 (see FIG. 3) of the plates,
and may be apportioned in any convenient way between the first side
26 of one plate and the facing second side 28 of an adjacent
plate.
[0055] Turning now to drawing FIGS. 7, 8 and 9, several other
embodiments of the modular socket 10 are illustrated. As depicted
in drawing FIG. 7, a plurality of regular plates 14A, 14B and 14C
and an end plate 14D, the plates providing for an interconnect lead
tape 50 using a compressible elastomeric member 96 (not shown) to
bias the tape to the bond pads 90 of the semiconductor die 18. The
elastomeric member 96 may be formed of silicone foam, solid
silicone that has been perforated, or low durometer hardness
silicone which is attached to the tape by adhesive. The elastomeric
member 96 may be variably shaped as a narrow strip 96A with limited
biasing strength to a more general coverage 96B with greater
biasing strength. Both are illustrated in drawing FIG. 9. The
narrow strip 96A is intended to be used in the module design of
drawing FIG. 7, and the general coverage 96B may be used in the
module embodiment of drawing FIG. 8, wherein sufficient space is
provided in the interconnect lead slot 44 for the elastomeric
member 96. Preferably, the elastomeric member 96 comprises a single
continuous unit extending across all of the leads 70.
Alternatively, a series of elastomeric members 96 may be arrayed on
the tape 50.
[0056] Referring to drawing FIG. 10, illustrated is another form of
the invention, in which the compliant member of a module 12
comprises a projecting portion 100 of the plate 14. The projecting
portion 100 may be in the form of a ledge, as shown in the figure,
and includes a longitudinal ridge 102 within a recess 48 in the
first side 26. A multi-layer interconnect lead tape is attached,
e.g., by adhesive, to the projecting portion 100 and ridge 102. The
resulting node 104 in the lead tape 50 is forced away by an
inserted die 18 and forcibly abuts the bond pads on the die surface
20. The force holding the leads 70 against inserted bond pads 90 of
a semiconductor die 18 will depend upon the distance 106 from the
node 104 to the attachment point 108 of the ridge 102. In order to
provide the desired effect, the polymeric material of the plate 14
and projecting portion 100 is selected in combination with distance
106 and ledge thickness 110. In this embodiment, it is unnecessary
for the lead tape 50 to be aligned and retained on alignment
posts.
[0057] Where a bare semiconductor die 18 has two rows of bond pads
90, illustrated in drawing FIG. 11 as first row 112 and second row
114, the lead tape 50 of the modular socket 10 may be adapted for
lead contact with both rows. A lead tape 50 for providing contact
with two rows 112, 114 of bond pads 90 is shown in drawing FIG. 12.
The tape 50 comprises three layers including a first insulative
layer 64, a second conductive layer 66 for contacting the first row
112 of bond pads 90, and a third conductive layer 68 for contacting
the second row 114 of bond pads on the die 18. The first and second
layers 64, 66 are terminated at locations 116, 118, respectively,
between the first and second rows 112, 114 of bond pads. An
elastomeric member 96C such as a foam is attached to the third
layer 68 and abuts the recess wall 120. The member 96C is
compressed by insertion of the semiconductor die 18 into the socket
and retains forced contact between the leads and bond pads.
[0058] As shown in drawing FIG. 13, the first (insulative polymer)
layer 64 may alternatively be provided with holes 122 through which
individual leads 70 of the third (conductive) layer 68 are
pre-inserted for contact with the second row 114 of bond pads
90.
[0059] The foregoing delineates several examples of the use of a
multi-layer lead tape with means for contacting the bond pads of a
bare die. Other types of biasing apparatus may be used for
maintaining contact between interconnect leads 70 and the bond pads
90 of a semiconductor die 18, including mechanical springs suitable
for the miniature devices.
[0060] The plates 14A, 14B, 14C, 14D, etc., may be molded of a
suitable insulative polymeric material, examples of which include
polyether sulfone, polyether ether ketone (PEEK), or polyphenylene
sulfide.
[0061] Following assembly of the modular socket 10 and attachment
to a substrate 16, the modular socket, or portions thereof, may be
"glob-topped" with insulative sealant material, typically a
polymer.
[0062] The socket 10 of the invention permits connection of bare
semiconductor dice with very fine pitch bond pads to substrates,
whereby short leads are used for improved performance. The
semiconductor dice may be readily replaced without debonding of
wires or other leads. Multiple semiconductor dice may be
simultaneously connected to a substrate, and the apparatus permits
high density "stacking" of a large number of dice. The socket uses
leads which may be produced by well-developed technology, and is
easily made in large quantity and at low cost.
[0063] It is apparent to those skilled in the art that various
changes and modifications may be made to the bare die socket module
of the invention, sockets formed therefrom and methods of making
and practicing the invention as disclosed herein without departing
from the spirit and scope of the invention as defined in the
following claims. It is particularly noted that with respect to
numbers and dimensions of elements, the illustrated constructions
of the various embodiments of the modular bare semiconductor die
socket are not presented as a limiting list of features but as
examples of the many embodiments of the invention.
* * * * *