Corisis; David J.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Corisis; David J..The latest application filed is for "novel build-up package for integrated circuit devices, and methods of making same".

Company Profile

10.200.200

Corisis; David J. - Nampa ID
Corisis; David J. - Meridian ID
Corisis, David J. - Maridian ID

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Build-up package for integrated circuit devices, and methods of making same Grant 11,367,667 - Ng , et al. June 21, 2	2022-06-21
Novel Build-up Package For Integrated Circuit Devices, And Methods Of Making Same App 20200286801 - Ng; Hong Wan ; et al.	2020-09-10
Packaged semiconductor components having substantially rigid support members Grant 10,763,185 - Schwab , et al. Sep	2020-09-01
Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices Grant 10,692,827 - Schwab , et al.	2020-06-23
Build-up package for integrated circuit devices, and methods of making same Grant 10,593,607 - Ng , et al.	2020-03-17
Computer modules with small thicknesses and associated methods of manufacturing Grant 10,522,515 - Gibbons , et al. Dec	2019-12-31
Electronic device assemblies including conductive vias having two or more conductive elements Grant 10,448,509 - Corisis , et al. Oc	2019-10-15
Computer Modules With Small Thicknesses And Associated Methods Of Manufacturing App 20190279964 - Gibbons; Kevin ; et al.	2019-09-12
Packaged Semiconductor Components Having Substantially Rigid Support Members And Methods Of Packaging Semiconductor Components App 20190252281 - Schwab; Matt E. ; et al.	2019-08-15
System In Package (sip) With Dual Laminate Interposers App 20190237436 - Corisis; David J. ; et al.	2019-08-01
Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components Grant 10,312,173 - Schwab , et al.	2019-06-04
System in package (SIP) with dual laminate interposers Grant 10,297,574 - Corisis , et al.	2019-05-21
Computer modules with small thicknesses and associated methods of manufacturing Grant 10,256,214 - Gibbons , et al.	2019-04-09
Packaged Microelectronic Devices And Methods For Manufacturing Packaged Microelectronic Devices App 20190081015 - Schwab; Matt E. ; et al.	2019-03-14
Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices Grant 10,211,114 - Corisis , et al. Feb	2019-02-19
Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices Grant 10,163,826 - Schwab , et al. Dec	2018-12-25
Packaged Semiconductor Components Having Substantially Rigid Support Members And Methods Of Packaging Semiconductor Components App 20180211896 - Schwab; Matt E. ; et al.	2018-07-26
Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices Grant 10,008,468 - Lee , et al. June 26, 2	2018-06-26
Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components Grant 9,960,094 - Schwab , et al. May 1, 2	2018-05-01
Packaged Microelectronic Devices And Methods For Manufacturing Packaged Microelectronic Devices App 20180040582 - Schwab; Matt E. ; et al.	2018-02-08
Microelectronic Devices, Stacked Microelectronic Devices, And Methods For Manufacturing Such Devices App 20180005909 - Corisis; David J. ; et al.	2018-01-04
Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices Grant 9,812,415 - Schwab , et al. November 7, 2	2017-11-07
Computer Modules With Small Thicknesses And Associated Methods Of Manufacturing App 20170294414 - Gibbons; Kevin ; et al.	2017-10-12
Carrierless Chip Package For Integrated Circuit Devices, And Methods Of Making Same App 20170271228 - Corisis; David J. ; et al.	2017-09-21
Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices Grant 9,768,121 - Corisis , et al. September 19, 2	2017-09-19
Computer modules with small thicknesses and associated methods of manufacturing Grant 9,717,157 - Gibbons , et al. July 25, 2	2017-07-25
Carrierless chip package for integrated circuit devices, and methods of making same Grant 9,673,121 - Corisis , et al. June 6, 2	2017-06-06
Packaged Microelectronic Devices And Methods For Manufacturing Packaged Microelectronic Devices App 20170103961 - Lee; Choon Kuan ; et al.	2017-04-13
Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices Grant 9,530,748 - Lee , et al. December 27, 2	2016-12-27
Microelectronic Devices, Stacked Microelectronic Devices, And Methods For Manufacturing Such Devices App 20160358831 - Corisis; David J. ; et al.	2016-12-08
Packaged Semiconductor Components Having Substantially Rigid Support Members And Methods Of Packaging Semiconductor Components App 20160254204 - Schwab; Matt E. ; et al.	2016-09-01
Novel Build-up Package For Integrated Circuit Devices, And Methods Of Making Same App 20160247737 - Ng; Hong Wan ; et al.	2016-08-25
Stacked packaged integrated circuit devices, and methods of making same Grant 9,362,260 - Corisis , et al. June 7, 2	2016-06-07
Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components Grant 9,362,208 - Schwab , et al. June 7, 2	2016-06-07
Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices Grant 9,362,141 - Corisis , et al. June 7, 2	2016-06-07
Land grid array semiconductor device packages Grant 9,355,992 - Kuan , et al. May 31, 2	2016-05-31
Build-up package for integrated circuit devices, and methods of making same Grant 9,355,994 - Ng , et al. May 31, 2	2016-05-31
Packaged Semiconductor Components Having Substantially Rigid Support Members And Methods Of Packaging Semiconductor Components App 20150364403 - Schwab; Matt E. ; et al.	2015-12-17
Electronic Device Assemblies Including Conductive Vias Having Two Or More Conductive Elements App 20150319860 - Corisis; David J. ; et al.	2015-11-05
Methods of making an interposer structure with embedded capacitor structure Grant 9,142,427 - Chong , et al. September 22, 2	2015-09-22
Electronic device assemblies including conductive vias having two or more conductive elements Grant 9,084,360 - Corisis , et al. July 14, 2	2015-07-14
Stacked Packaged Integrated Circuit Devices, And Methods Of Making Same App 20150171061 - Corisis; David J. ; et al.	2015-06-18
Computer Modules With Small Thicknesses And Associated Methods Of Manufacturing App 20150156908 - Gibbons; Kevin ; et al.	2015-06-04
Packaged Microelectronic Devices And Methods For Manufacturing Packaged Microelectronic Devices App 20150130081 - Lee; Choon Kuan ; et al.	2015-05-14
Packaged microelectronic devices recessed in support member cavities, and associated methods Grant 8,975,745 - Corisis , et al. March 10, 2	2015-03-10
Method for assembling computer modules small in thickness Grant 8,959,759 - Gibbons , et al. February 24, 2	2015-02-24
Stacked packaged integrated circuit devices, and methods of making same Grant 8,963,302 - Corisis , et al. February 24, 2	2015-02-24
Microelectronic Packages With Leadframes, Including Leadframes Configured For Stacked Die Packages, And Associated Systems And Methods App 20150041204 - Chong; Chin Hui ; et al.	2015-02-12
Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices Grant 8,940,581 - Lee , et al. January 27, 2	2015-01-27
Packaged Microelectronic Devices And Methods For Manufacturing Packaged Microelectronic Devices App 20150021769 - Schwab; Matt E. ; et al.	2015-01-22
Land Grid Array Semiconductor Device Packages App 20140342476 - Kuan; Lee Choon ; et al.	2014-11-20
Methods for making microelectronic die systems Grant 8,869,387 - Chong , et al. October 28, 2	2014-10-28
Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices Grant 8,866,272 - Schwab , et al. October 21, 2	2014-10-21
Novel Build-up Package For Integrated Circuit Devices, And Methods Of Making Same App 20140295622 - Ng; Hong Wan ; et al.	2014-10-02
System In Package (sip) With Dual Laminate Interposers App 20140225282 - Corisis; David J. ; et al.	2014-08-14
Land grid array semiconductor device packages Grant 8,796,836 - Lee , et al. August 5, 2	2014-08-05
Methods for packaging microelectronic devices and microelectronic devices formed using such methods Grant 8,772,947 - Lee , et al. July 8, 2	2014-07-08
Build-up package for integrated circuit devices, and methods of making same Grant 8,754,537 - Ng , et al. June 17, 2	2014-06-17
Methods Of Making An Interposer Structure With Embedded Capacitor Structure App 20140162412 - Chong; Chin Hui ; et al.	2014-06-12
Redistribution elements and semiconductor device packages including semiconductor devices and redistribution elements Grant 8,749,050 - Lee , et al. June 10, 2	2014-06-10
Computer Modules With Small Thicknesses And Associated Methods Of Manufacturing App 20140154844 - Gibbons; Kevin ; et al.	2014-06-05
System in package (SIP) with dual laminate interposers Grant 8,735,183 - Corisis , et al. May 27, 2	2014-05-27
Interposer structure with embedded capacitor structure, and methods of making same Grant 8,653,625 - Hui , et al. February 18, 2	2014-02-18
Computer modules with small thicknesses and associated methods of manufacturing Grant 8,644,030 - Gibbons , et al. February 4, 2	2014-02-04
Stacked microelectronic dies and methods for stacking microelectronic dies Grant 8,587,109 - Corisis November 19, 2	2013-11-19
Redistribution Elements And Semiconductor Device Packages Including Semiconductor Devices And Redistribution Elements App 20130292810 - Lee; Choon Kuan ; et al.	2013-11-07
Stacked Packaged Integrated Circuit Devices, And Methods Of Making Same App 20130256853 - Corisis; David J. ; et al.	2013-10-03
Packaged Microelectronic Devices Recessed In Support Member Cavities, And Associated Methods App 20130249092 - Corisis; David J. ; et al.	2013-09-26
Microelectronic Devices, Stacked Microelectronic Devices, And Methods For Manufacturing Such Devices App 20130252354 - Corisis; David J. ; et al.	2013-09-26
Electronic Device Assemblies Including Conductive Vias Having Two Or More Conductive Elements App 20130235517 - Corisis; David J. ; et al.	2013-09-12
Methods of forming semiconductor device packages including a semiconductor device and a redistribution element, methods of forming redistribution elements and methods for packaging semiconductor devices Grant 8,486,825 - Lee , et al. July 16, 2	2013-07-16
Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices Grant 8,450,839 - Corisis , et al. May 28, 2	2013-05-28
Stacked packaged integrated circuit devices Grant 8,445,997 - Corisis , et al. May 21, 2	2013-05-21
Packaged microelectronic devices recessed in support member cavities, and associated methods Grant 8,441,132 - Corisis , et al. May 14, 2	2013-05-14
Electronic device assemblies including conductive vias having two or more conductive elements Grant 8,426,743 - Corisis , et al. April 23, 2	2013-04-23
Methods Of Forming Semiconductor Device Packages Including A Semiconductor Device And A Redistribution Element, Methods Of Forming Redistribution Elements And Methods For Packaging Semiconductor Devices App 20130059419 - Kuan; Lee Choon ; et al.	2013-03-07
Semiconductor device packages including a semiconductor device and a redistribution element Grant 8,288,859 - Lee , et al. October 16, 2	2012-10-16
Methods For Packaging Microelectronic Devices And Microelectronic Devices Formed Using Such Methods App 20120248626 - Lee; Choon Kuan ; et al.	2012-10-04
Packaged Microelectronic Devices And Methods For Manufacturing Packaged Microelectronic Devices App 20120187567 - Lee; Choon Kuan ; et al.	2012-07-26
Packaged IC device comprising an embedded flex circuit on leadframe, and methods of making same Grant 8,217,505 - Lee , et al. July 10, 2	2012-07-10
Packaged microelectronic devices recessed in support member cavities, and associated methods Grant 8,202,754 - Corisis , et al. June 19, 2	2012-06-19
Methods for packaging microelectronic devices and microelectronic devices formed using such methods Grant 8,203,213 - Lee , et al. June 19, 2	2012-06-19
Packaged Microelectronic Devices Recessed In Support Member Cavities, And Associated Methods App 20120146239 - Corisis; David J. ; et al.	2012-06-14
Stacked Microelectronic Dies And Methods For Stacking Microelectronic Dies App 20120135569 - Corisis; David J.	2012-05-31
Stacked Packaged Integrated Circuit Devices, And Methods Of Making Same App 20120127685 - Corisis; David J. ; et al.	2012-05-24
Flip chip with interposer Grant 8,178,984 - Corisis , et al. May 15, 2	2012-05-15
Packaged microelectronic devices and associated systems Grant 8,148,807 - Lee , et al. April 3, 2	2012-04-03
Apparatus for packaging semiconductor devices, packaged semiconductor components, methods of manufacturing apparatus for packaging semiconductor devices, and methods of manufacturing semiconductor components Grant 8,138,021 - Corisis , et al. March 20, 2	2012-03-20
Semiconductor device packages and assemblies Grant 8,125,092 - Corisis , et al. February 28, 2	2012-02-28
Interposer substrates and semiconductor device assemblies and electronic systems including such interposer substrates Grant 8,115,112 - Corisis , et al. February 14, 2	2012-02-14
Methods of forming stacked semiconductor devices with a leadframe and associated assemblies Grant 8,106,491 - Corisis , et al. January 31, 2	2012-01-31
Stackable ball grid array package Grant RE43,112 - Corisis , et al. January 17, 2	2012-01-17
High density stacked die assemblies, structures incorporated therein and methods of fabricating the assemblies Grant 8,072,055 - Corisis , et al. December 6, 2	2011-12-06
Stacked microelectronic device assemblies Grant 8,067,827 - Corisis November 29, 2	2011-11-29
Novel Build-up Package For Integrated Circuit Devices, And Methods Of Making Same App 20110266701 - Wan; Ng Hong ; et al.	2011-11-03
Semiconductor Device Packages Including A Semiconductor Device And A Redistribution Element App 20110266696 - Lee; Choon Kuan ; et al.	2011-11-03
Semiconductor device and method of fabrication thereof Grant 8,049,342 - Mess , et al. November 1, 2	2011-11-01
Multi-chip module and methods Grant 8,048,715 - Corisis , et al. November 1, 2	2011-11-01
Integrated circuit package support system Grant 8,035,974 - Corisis , et al. October 11, 2	2011-10-11
Board-on-chip type substrates with conductive traces in multiple planes and semiconductor device packages including such substrates Grant 8,030,751 - Lee , et al. October 4, 2	2011-10-04
Packaged Microelectronic Devices And Methods For Manufacturing Packaged Microelectronic Devices App 20110233740 - Schwab; Matt E. ; et al.	2011-09-29
Semiconductor devices including semiconductor dice in laterally offset stacked arrangement Grant 7,999,378 - Mess , et al. August 16, 2	2011-08-16
Semiconductor device assemblies, electronic devices including the same and assembly methods Grant 7,998,792 - Mess , et al. August 16, 2	2011-08-16
Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices Grant 7,955,898 - Schwab , et al. June 7, 2	2011-06-07
Bond pad rerouting element, rerouted semiconductor devices including the rerouting element, and assemblies including the rerouted semiconductor devices Grant 7,944,057 - Corisis , et al. May 17, 2	2011-05-17
Interconnecting substrates for microelectronic dies, methods for forming vias in such substrates, and methods for packaging microelectronic devices Grant 7,915,726 - Chong , et al. March 29, 2	2011-03-29
Methods of making metal core foldover package structures Grant 7,915,077 - Corisis , et al. March 29, 2	2011-03-29
Integrated circuit package support system Grant 7,894,192 - Corisis , et al. February 22, 2	2011-02-22
Semiconductor device assemblies and systems including at least one conductive pathway extending around a side of at least one semiconductor device Grant 7,888,185 - Corisis , et al. February 15, 2	2011-02-15
Packaged Ic Device Comprising An Embedded Flex Circuit, And Methods Of Making The Same App 20100320578 - Lee; Choon Kuan ; et al.	2010-12-23
Bond pad rerouting element, rerouted semiconductor devices including the rerouting element, and assemblies including the rerouted semiconductor devices Grant 7,851,922 - Corisis , et al. December 14, 2	2010-12-14
Electronic Device Assemblies Including Conductive Vias Having Two Or More Conductive Elements App 20100284140 - Corisis; David J. ; et al.	2010-11-11
Stackable ceramic FBGA for high thermal applications Grant 7,829,991 - Moden , et al. November 9, 2	2010-11-09
Methods For Packaging Microelectronic Devices And Microelectronic Devices Formed Using Such Methods App 20100276814 - Lee; Choon Kuan ; et al.	2010-11-04
Apparatus For Packaging Semiconductor Devices, Packaged Semiconductor Components, Methods Of Manufacturing Apparatus For Packaging Semiconductor Devices, And Methods Of Manufacturing Semiconductor Components App 20100279466 - Corisis; David J. ; et al.	2010-11-04
Packaged IC device comprising an embedded flex circuit on leadframe, and methods of making same Grant 7,816,778 - Lee , et al. October 19, 2	2010-10-19
Packaged Semiconductor Components Having Substantially Rigid Support Members And Methods Of Packaging Semiconductor Components App 20100255636 - Schwab; Matt E. ; et al.	2010-10-07
Packaged Microelectronic Devices And Methods For Manufacturing Packaged Microelectronic Devices App 20100244272 - Lee; Choon Kuan ; et al.	2010-09-30
Electronic devices including conductive vias having two or more conductive elements for providing electrical communication between traces in different planes in a substrate, and accompanying methods Grant 7,767,913 - Corisis , et al. August 3, 2	2010-08-03
Novel Build-up Package For Integrated Circuit Devices, And Methods Of Making Same App 20100187668 - Ng; Hong Wan ; et al.	2010-07-29
Methods for packaging microelectronic devices and microelectronic devices formed using such methods Grant 7,759,221 - Lee , et al. July 20, 2	2010-07-20
Apparatus for packaging semiconductor devices, packaged semiconductor components, methods of manufacturing apparatus for packaging semiconductor devices, and methods of manufacturing semiconductor components Grant 7,759,785 - Corisis , et al. July 20, 2	2010-07-20
Computer Modules With Small Thicknesses And Associated Methods Of Manufacturing App 20100177490 - Gibbons; Kevin ; et al.	2010-07-15
Microelectronic Packages With Leadframes, Including Leadframes Configured For Stacked Die Packages, And Associated Systems And Methods App 20100173454 - Chong; Chin Hui ; et al.	2010-07-08
Stacked microelectronic devices and methods for manufacturing microelectronic devices Grant 7,749,808 - Corisis , et al. July 6, 2	2010-07-06
Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components Grant 7,750,449 - Schwab , et al. July 6, 2	2010-07-06
Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices Grant 7,745,920 - Lee , et al. June 29, 2	2010-06-29
Intergrated Circuit Package Support System App 20100148334 - Corisis; David J. ; et al.	2010-06-17
Semiconductor Devices Including Semiconductor Dice In Laterally Offset Stacked Arrangement App 20100148331 - Mess; Leonard E. ; et al.	2010-06-17
Microelectronic Devices, Stacked Microelectronic Devices, And Methods For Manufacturing Such Devices App 20100117212 - Corisis; David J. ; et al.	2010-05-13
Flip Chip With Interposer, And Methods Of Making Same App 20100109149 - Corisis; David J. ; et al.	2010-05-06
Method of forming a semiconductor device Grant 7,704,794 - Mess , et al. April 27, 2	2010-04-27
Microelectronic packages with leadframes, including leadframes configured for stacked die packages, and associated systems and methods Grant 7,692,931 - Chong , et al. April 6, 2	2010-04-06
Build-up-package for integrated circuit devices, and methods of making same Grant 7,691,682 - Wan , et al. April 6, 2	2010-04-06
Bond Pad Rerouting Element, Rerouted Semiconductor Devices Including The Rerouting Element, And Assemblies Including The Rerouted Semiconductor Devices App 20100078792 - Corisis; David J. ; et al.	2010-04-01
Semiconductor Device Assemblies, Electronic Devices Including The Same And Assembly Methods App 20100078793 - Mess; Leonard E. ; et al.	2010-04-01
Multi-chip Module And Methods App 20100055837 - Corisis; David J. ; et al.	2010-03-04
Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices Grant 7,671,459 - Corisis , et al. March 2, 2	2010-03-02
Flip chip with interposer, and methods of making same Grant 7,659,151 - Corisis , et al. February 9, 2	2010-02-09
High Density Stacked Die Assemblies, Structures Incorporated Therein And Methods Of Fabricating The Assemblies App 20100013074 - Corisis; David J. ; et al.	2010-01-21
Packaged Microelectronic Devices And Methods For Manufacturing Packaged Microelectronic Devices App 20090302484 - Lee; Choon Kuan ; et al.	2009-12-10
Stacked Mass Storage Flash Memory Package App 20090286356 - Mess; Leonard E. ; et al.	2009-11-19
Multi-chip module and methods Grant 7,619,313 - Corisis , et al. November 17, 2	2009-11-17
Upgradeable And Repairable Semiconductor Packages And Methods App 20090236735 - Corisis; David J. ; et al.	2009-09-24
High density stacked die assemblies, structures incorporated therein and methods of fabricating the assemblies Grant 7,592,691 - Corisis , et al. September 22, 2	2009-09-22
Board-on-chip Type Substrates With Conductive Traces In Multiple Planes, Semiconductor Device Packages Including Such Substrates, And Associated Methods App 20090218677 - Kuan; Lee Choon ; et al.	2009-09-03
Methods of making and using a floating lead finger on a lead frame Grant 7,572,678 - Corisis August 11, 2	2009-08-11
Stackable Integrated Circuit Package App 20090091009 - Corisis; David J. ; et al.	2009-04-09
Floating lead finger on a lead frame, lead frame strip, and lead frame assembly including same Grant 7,511,364 - Corisis March 31, 2	2009-03-31
Carrierless chip package for integrated circuit devices, and methods of making same Grant 7,504,285 - Corisis , et al. March 17, 2	2009-03-17
Stacked microelectronic devices and methods for manufacturing microelectronic devices Grant 7,485,969 - Corisis , et al. February 3, 2	2009-02-03
Stacked Microelectronic Devices And Methods For Manufacturing Microelectronic Devices App 20090011541 - Corisis; David J. ; et al.	2009-01-08
Bond Pad Rerouting Element, Rerouted Semiconductor Devices Including The Rerouting Element, And Assemblies Including The Rerouted Semiconductor Devices App 20090008797 - Corisis; David J. ; et al.	2009-01-08
Novel Build-up-package For Integrated Circuit Devices, And Methods Of Making Same App 20090001551 - Wan; Ng Hong ; et al.	2009-01-01
Metal Core Foldover Package Structures App 20080316728 - Corisis; David J. ; et al.	2008-12-25
Methods of fabrication of lead frame-based semiconductor device packages incorporating at least one land grid array package Grant 7,465,607 - Corisis , et al. December 16, 2	2008-12-16
Metal Core Foldover Package Structures App 20080299709 - Corisis; David J. ; et al.	2008-12-04
Stackable ball grid array Grant 7,459,773 - Bolken , et al. December 2, 2	2008-12-02
Stacked Packaged Integrated Circuit Devices, And Methods Of Making Same App 20080283977 - Corisis; David J. ; et al.	2008-11-20
Flip Chip With Interposer, And Methods Of Making Same App 20080251943 - Corisis; David J. ; et al.	2008-10-16
System in package (SIP) with dual laminate interposers App 20080254571 - Corisis; David J. ; et al.	2008-10-16
Packaged Microelectronic Devices And Methods For Manufacturing Packaged Microelectronic Devices App 20080224329 - Schwab; Matt E. ; et al.	2008-09-18
Packaged Semiconductor Components Having Substantially Rigid Support Members And Methods Of Packaging Semiconductor Components App 20080224291 - Schwab; Matt E. ; et al.	2008-09-18
Interposer Structure With Embedded Capacitor Structure, And Methods Of Making Same App 20080224292 - Hui; Chong Chin ; et al.	2008-09-18
Apparatus For Packaging Semiconductor Devices, Packaged Semiconductor Components, Methods Of Manufacturing Apparatus For Packaging Semiconductor Devices, And Methods Of Manufacturing Semiconductor Components App 20080224298 - Corisis; David J. ; et al.	2008-09-18
Metal core foldover package structures Grant 7,425,758 - Corisis , et al. September 16, 2	2008-09-16
Bond pad rerouting element, rerouted semiconductor devices including the rerouting element, and assemblies including the rerouted semiconductor devices Grant 7,423,336 - Corisis , et al. September 9, 2	2008-09-09
Assembly for stacked BGA packages Grant 7,408,255 - Corisis , et al. August 5, 2	2008-08-05
Module assembly for stacked BGA packages Grant 7,400,032 - Corisis , et al. July 15, 2	2008-07-15
Module assembly and method for stacked BGA packages Grant 7,396,702 - Corisis , et al. July 8, 2	2008-07-08
Carrierless Chip Package For Integrated Circuit Devices, And Methods Of Making Same App 20080136001 - Corisis; David J. ; et al.	2008-06-12
Semiconductor device assemblies and systems including at least one conductive pathway extending around a side of at least one semiconductor device and methods for forming the same App 20080122113 - Corisis; David J. ; et al.	2008-05-29
Method and apparatus for decoupling conductive portions of a microelectronic device package Grant 7,378,723 - Corisis , et al. May 27, 2	2008-05-27
Stacked mass storage flash memory package Grant 7,375,419 - Mess , et al. May 20, 2	2008-05-20
Routing element for use in multi-chip modules, multi-chip modules including the routing element and methods Grant 7,372,138 - Corisis , et al. May 13, 2	2008-05-13
Routing element for use in semiconductor device assemblies Grant 7,372,131 - Corisis , et al. May 13, 2	2008-05-13
Modular sockets using flexible interconnects Grant 7,367,845 - Farnworth , et al. May 6, 2	2008-05-06
Interconnecting Substrates For Microelectronic Dies, Methods For Forming Vias In Such Substrates, And Methods For Packaging Microelectronic Devices App 20080099931 - Chong; Chin Hui ; et al.	2008-05-01
Semiconductor packages and methods for making and using same Grant 7,365,420 - Corisis April 29, 2	2008-04-29
High density stacked die assemblies, structures incorporated therein and methods of fabricating the assemblies App 20080054432 - Corisis; David J. ; et al.	2008-03-06
Metal core foldover package structures, systems including same and methods of fabrication App 20080048309 - Corisis; David J. ; et al.	2008-02-28
Stackable Ceramic Fbga For High Thermal Applications App 20080042252 - Moden; Walter L. ; et al.	2008-02-21
Interconnecting substrates for microelectronic dies, methods for forming vias in such substrates, and methods for packaging microelectronic devices Grant 7,326,591 - Chong , et al. February 5, 2	2008-02-05
Multi-part lead frame Grant 7,321,160 - Hinkle , et al. January 22, 2	2008-01-22
Microelectronic packages with leadframes, including leadframes configured for stacked die packages, and associated systems and methods App 20080012110 - Chong; Chin Hui ; et al.	2008-01-17
Chip scale package with heat spreader Grant 7,312,516 - Corisis December 25, 2	2007-12-25
Lead frame-based semiconductor device packages incorporating at least one land grid array package Grant 7,291,900 - Corisis , et al. November 6, 2	2007-11-06
Carrierless Chip Package For Integrated Circuit Devices, And Methods Of Making Same App 20070249100 - Corisis; David J. ; et al.	2007-10-25
Stackable ceramic FBGA for high thermal applications Grant 7,285,442 - Moden , et al. October 23, 2	2007-10-23
Bond pad rerouting element and stacked semiconductor device assemblies including the rerouting element Grant 7,282,805 - Corisis , et al. October 16, 2	2007-10-16
Methods for designing bond pad rerouting elements for use in stacked semiconductor device assemblies and for assembling semiconductor devices Grant 7,282,397 - Corisis , et al. October 16, 2	2007-10-16
Module assembly and method for stacked BGA packages Grant 7,279,797 - Corisis , et al. October 9, 2	2007-10-09
Packaged microelectronic devices recessed in support member cavities, and associated methods App 20070228577 - Corisis; David J. ; et al.	2007-10-04
Carrierless chip package for integrated circuit devices, and methods of making same App 20070216033 - Corisis; David J. ; et al.	2007-09-20
Stacked Microelectronic Dies And Methods For Stacking Microelectronic Dies App 20070210435 - Corisis; David J.	2007-09-13
Microelectronic device assemblies including assemblies with recurved leadframes, and associated methods App 20070210441 - Corisis; David J. ; et al.	2007-09-13
Stacked mass storage flash memory package Grant 7,262,506 - Mess , et al. August 28, 2	2007-08-28
Conductive vias having two or more conductive elements for providing electrical communication between traces in different planes in a substrate, semiconductor device assemblies including such vias, and accompanying methods App 20070194431 - Corisis; David J. ; et al.	2007-08-23
Method for fabricating semiconductor component with adjustment circuitry for electrical characteristics or input/output configuration Grant 7,257,884 - Schoenfeld , et al. August 21, 2	2007-08-21
Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices App 20070181989 - Corisis; David J. ; et al.	2007-08-09
Methods of fabrication of lead frame-based semiconductor device packages incorporating at least one land grid array package App 20070166880 - Corisis; David J. ; et al.	2007-07-19
Methods for packaging microelectronic devices and microelectronic devices formed using such methods App 20070155048 - Lee; Choon Kuan ; et al.	2007-07-05
Packages for semiconductor die Grant 7,239,029 - Bolken , et al. July 3, 2	2007-07-03
Stacked microelectronic dies Grant 7,235,871 - Corisis June 26, 2	2007-06-26
Method for fabricating semiconductor component with adjustment circuit for adjusting physical or electrical characteristics of substrate conductors App 20070137029 - Schoenfeld; Aaron M. ; et al.	2007-06-21
Chip scale package with heat spreader Grant 7,233,056 - Corisis June 19, 2	2007-06-19
Semiconductor package Grant 7,226,813 - Corisis June 5, 2	2007-06-05
Stacked mass storage flash memory package App 20070065987 - Mess; Leonard E. ; et al.	2007-03-22
Apparatus for forming modular sockets using flexible interconnects and resulting structures Grant 7,192,311 - Farnworth , et al. March 20, 2	2007-03-20
Multi-part lead frame with dissimilar materials App 20070057353 - Hinkle; S. Derek ; et al.	2007-03-15
Multi-part lead frame with dissimilar materials App 20070057354 - Hinkle; S. Derek ; et al.	2007-03-15
Modular sockets using flexible interconnects App 20070059984 - Farnworth; Warren M. ; et al.	2007-03-15
Method and apparatus for decoupling conductive portions of a microelectronic device package App 20070052087 - Corisis; David J. ; et al.	2007-03-08
Lead frame-based semiconductor device packages incorporating at least one land grid array package and methods of fabrication App 20070045784 - Corisis; David J. ; et al.	2007-03-01
Stacked microelectronic devices and methods for manufacturing microelectronic devices App 20070045862 - Corisis; David J. ; et al.	2007-03-01
Land grid array semiconductor device packages, assemblies including same, and methods of fabrication App 20070045818 - Kuan; Lee Choon ; et al.	2007-03-01
Interconnecting substrates for microelectronic dies, methods for forming vias in such substrates, and methods for packaging microelectronic devices App 20070045834 - Chong; Chin Hui ; et al.	2007-03-01
Method and apparatus for decoupling conductive portions of a microelectronic device package Grant 7,183,138 - Corisis , et al. February 27, 2	2007-02-27
Multi-part lead frame with dissimilar materials App 20070001274 - Hinkle; S. Derek ; et al.	2007-01-04
Method and apparatus for forming modular sockets using flexible interconnects and resulting structures Grant 7,153,164 - Farnworth , et al. December 26, 2	2006-12-26
CSP semiconductor chip and BGA assembly with enhanced physical protection, protective members and assemblies used with same, and methods of enhancing physical protection of chips and assemblies App 20060284301 - Corisis; David J.	2006-12-21
Semiconductor package having exposed heat dissipating surface and method of fabrication Grant 7,151,013 - Corisis , et al. December 19, 2	2006-12-19
Packages for semiconductor die Grant 7,144,245 - Bolken , et al. December 5, 2	2006-12-05
Multi-chip module and methods App 20060261492 - Corisis; David J. ; et al.	2006-11-23
Modular sockets using flexible interconnects App 20060234560 - Farnworth; Warren M. ; et al.	2006-10-19
Method of manufacturing a stackable ball grid array Grant 7,101,730 - Bolken , et al. September 5, 2	2006-09-05
Integrated circuit package electrical enhancement with improved lead frame design Grant 7,098,527 - Corisis , et al. August 29, 2	2006-08-29
Semiconductor packages and methods for making and using same App 20060186521 - Corisis; David J.	2006-08-24
Chip scale package with heat spreader App 20060186533 - Corisis; David J.	2006-08-24
Apparatus for forming modular sockets using flexible interconnects and resulting structures Grant 7,094,108 - Farnworth , et al. August 22, 2	2006-08-22
Methods for designing bond pad rerouting elements for use in stacked semiconductor device assemblies and for assembling semiconductor devices Grant 7,094,631 - Corisis , et al. August 22, 2	2006-08-22
Circuit and substrate encapsulation methods Grant 7,091,060 - Bolken , et al. August 15, 2	2006-08-15
Leads under chip IC package Grant 7,084,490 - Corisis August 1, 2	2006-08-01
Method of fabricating an integrated circuit package Grant 7,082,678 - Harrison , et al. August 1, 2	2006-08-01
Multi-chip module and methods Grant 7,084,514 - Corisis , et al. August 1, 2	2006-08-01
Methods for designing bond pad rerouting elements for use in stacked semiconductor device assemblies and for assembling semiconductor devices App 20060166404 - Corisis; David J. ; et al.	2006-07-27
Die paddle clamping method for wire bond enhancement App 20060154404 - Corisis; David J.	2006-07-13
Lead frame decoupling capacitor, semiconductor device packages including the same and methods Grant 7,071,542 - Corisis , et al. July 4, 2	2006-07-04
Methods of making and using a floating lead finger on a lead frame App 20060131706 - Corisis; David J.	2006-06-22
Multi-part lead frame with dissimilar materials App 20060125065 - Hinkle; S. Derek ; et al.	2006-06-15
Lead frame assemblies and decoupling capacitors App 20060118924 - Corisis; David J. ; et al.	2006-06-08
Method of forming an array of semiconductor packages Grant 7,056,771 - Corisis June 6, 2	2006-06-06
Method of fabricating an integrated circuit package Grant 7,055,241 - Harrison , et al. June 6, 2	2006-06-06
Bond pad rerouting element and stacked semiconductor device assemblies including the rerouting element App 20060113650 - Corisis; David J. ; et al.	2006-06-01
Modular sockets using flexible interconnects Grant 7,040,930 - Farnworth , et al. May 9, 2	2006-05-09
Stackable ball grid array Grant 7,019,408 - Bolken , et al. March 28, 2	2006-03-28
Module assembly and method for stacked BGA packages App 20060060957 - Corisis; David J. ; et al.	2006-03-23
Stackable ball grid array App 20060055020 - Bolken; Todd O. ; et al.	2006-03-16
Module assembly and method for stacked BGA packages App 20060051953 - Corisis; David J. ; et al.	2006-03-09
Module assembly and method for stacked BGA packages App 20060049504 - Corisis; David J. ; et al.	2006-03-09
Method for fabricating a semiconductor component Grant 7,007,375 - Schoenfeld , et al. March 7, 2	2006-03-07
Floating lead finger on a lead frame, method of making, and lead frame strip and lead frame assembly including same App 20060043542 - Corisis; David J.	2006-03-02
Methods for fabricating routing elements for multichip modules Grant 6,995,043 - Corisis , et al. February 7, 2	2006-02-07
Bond pad rerouting element and stacked semiconductor device assemblies including the rerouting element Grant 6,987,325 - Corisis , et al. January 17, 2	2006-01-17
Method for fabricating semiconductor component with adjustment circuitry for electrical characteristics or input/output configuration App 20060006551 - Schoenfeld; Aaron M. ; et al.	2006-01-12
Method of fabricating a tape having apertures under a lead frame for conventional IC packages Grant 6,979,596 - Corisis , et al. December 27, 2	2005-12-27
Die paddle clamping method for wire bond enhancement Grant 6,977,214 - Corisis December 20, 2	2005-12-20
Method and apparatus for forming modular sockets using flexible interconnects and resulting structures App 20050269686 - Farnworth, Warren M. ; et al.	2005-12-08
Method of forming an array of semiconductor packages App 20050253237 - Corisis, David J.	2005-11-17
Leads under chip IC package App 20050248006 - Corisis, David J.	2005-11-10
Method and apparatus for decoupling conductive portions of a microelectronic device package App 20050250251 - Corisis, David J. ; et al.	2005-11-10
Chip scale package with heat spreader App 20050248038 - Corisis, David J.	2005-11-10
Leads under chip IC package Grant 6,958,528 - Corisis October 25, 2	2005-10-25
Multi-part lead frame with dissimilar materials App 20050224928 - Hinkle, S. Derek ; et al.	2005-10-13
Semiconductor package Grant 6,949,821 - Corisis September 27, 2	2005-09-27
Multi-part lead frame with dissimilar materials Grant 6,946,722 - Hinkle , et al. September 20, 2	2005-09-20
Integrated circuit packages, ball-grid array integrated circuit packages and methods of packaging an integrated circuit Grant 6,939,739 - Corisis September 6, 2	2005-09-06
Packaged microelectronic devices and methods for assembling microelectronic devices Grant 6,924,550 - Corisis , et al. August 2, 2	2005-08-02
Method for a semiconductor assembly having a semiconductor die with dual heat spreaders Grant 6,920,688 - Corisis July 26, 2	2005-07-26
Tape under frame for lead frame IC package assembly Grant 6,921,966 - Corisis , et al. July 26, 2	2005-07-26
Routing element for use in semiconductor device assemblies App 20050156295 - Corisis, David J. ; et al.	2005-07-21
Routing element for use in multi-chip modules, multi-chip modules including the routing element and methods App 20050156293 - Corisis, David J. ; et al.	2005-07-21
Stackable ceramic FBGA for high thermal applications App 20050146010 - Moden, Walter L. ; et al.	2005-07-07
Multi-part lead frame with dissimilar materials App 20050146002 - Hinkle, S. Derek ; et al.	2005-07-07
Multi-chip module and methods App 20050146009 - Corisis, David J. ; et al.	2005-07-07
Semiconductor component with electrical characteristic adjustment circuitry Grant 6,914,275 - Schoenfeld , et al. July 5, 2	2005-07-05
Modular sockets using flexible interconnects App 20050142954 - Farnworth, Warren M. ; et al.	2005-06-30
Multi-part lead frame with dissimilar materials and method of manufacturing Grant 6,902,952 - Hinkle , et al. June 7, 2	2005-06-07
Semiconductor die package Grant 6,903,464 - Corisis June 7, 2	2005-06-07
Stacked mass storage flash memory package Grant 6,900,528 - Mess , et al. May 31, 2	2005-05-31
Module assembly and method for stacked BGA packages App 20050110135 - Corisis, David J. ; et al.	2005-05-26
Tape under frame for lead frame IC package assembly Grant 6,894,372 - Corisis , et al. May 17, 2	2005-05-17
Routing element for use in multi-chip modules, multi-chip modules including the routing element, and methods Grant 6,882,034 - Corisis , et al. April 19, 2	2005-04-19
Multi-chip module and methods Grant 6,867,500 - Corisis , et al. March 15, 2	2005-03-15
Integrated circuit package alignment feature Grant 6,858,453 - Corisis , et al. February 22, 2	2005-02-22
Stackable ceramic FBGA for high thermal applications Grant 6,858,926 - Moden , et al. February 22, 2	2005-02-22
Integrated circuit packages, ball-grid array integrated circuit packages and methods of packaging an integrated circuit Grant 6,856,013 - Corisis February 15, 2	2005-02-15
Stacked mass storage flash memory package App 20050029645 - Mess, Leonard E. ; et al.	2005-02-10
Method of manufacturing a stackable ball grid array App 20050019983 - Bolken, Todd O. ; et al.	2005-01-27
High speed IC package configuration Grant 6,847,100 - Corisis , et al. January 25, 2	2005-01-25
Module assembly for stacked BGA packages Grant 6,838,768 - Corisis , et al. January 4, 2	2005-01-04
Locking assembly for securing a semiconductor device to a carrier substrate Grant 6,837,731 - Corisis , et al. January 4, 2	2005-01-04
Methods for transverse hybrid LOC package Grant 6,835,604 - Corisis December 28, 2	2004-12-28
Integrated circuit package alignment feature Grant 6,836,003 - Corisis , et al. December 28, 2	2004-12-28
Method of fabricating an integrated circuit package App 20040255454 - Harrison, Ronnie M. ; et al.	2004-12-23
Methods for leads under chip in conventional IC package Grant 6,830,961 - Corisis December 14, 2	2004-12-14
Method of fabricating a redundant pinout configuration for signal enhancement in an IC package Grant 6,815,807 - Corisis November 9, 2	2004-11-09
Integrated circuit packages, ball-grid array integrated circuit packages and methods of packaging an integrated circuit App 20040207060 - Corisis, David J.	2004-10-21
Packaged microelectronic devices and methods for assembling microelectronic devices App 20040188820 - Corisis, David J. ; et al.	2004-09-30
Stackable ball grid array App 20040164412 - Bolken, Todd O. ; et al.	2004-08-26
Stackable ball grid array Grant 6,778,404 - Bolken , et al. August 17, 2	2004-08-17
Redundant pinout configuration for signal enhancement in IC packages Grant 6,777,790 - Corisis August 17, 2	2004-08-17
Mapable tape apply for LOC and BOC packages Grant 6,772,510 - Corisis August 10, 2	2004-08-10
Semiconductor die package App 20040150088 - Corisis, David J.	2004-08-05
Methods for designing bond pad rerouting elements for use in stacked semiconductor device assemblies and for assembling semiconductor devices App 20040142506 - Corisis, David J. ; et al.	2004-07-22
IC package with dual heat spreaders Grant 6,765,291 - Corisis July 20, 2	2004-07-20
Semiconductor component with electrical characteristic adjustment circuitry App 20040135253 - Schoenfeld, Aaron M. ; et al.	2004-07-15
Method for forming modular sockets using flexible interconnects and resulting structures Grant 6,760,970 - Farnworth , et al. July 13, 2	2004-07-13
Mapable tape apply for LOC and BOC packages App 20040128830 - Corisis, David J.	2004-07-08
Heat sink with alignment and retaining features Grant 6,760,224 - Moden , et al. July 6, 2	2004-07-06
Method and apparatus for forming modular sockets using flexible interconnects and resulting structures Grant 6,758,696 - Farnworth , et al. July 6, 2	2004-07-06
Die paddle clamping method for wire bond enhancement Grant 6,756,659 - Corisis June 29, 2	2004-06-29
Packages for semiconductor die App 20040119173 - Bolken, Todd O. ; et al.	2004-06-24
Semiconductor component with adjustment circuitry Grant 6,753,482 - Schoenfeld , et al. June 22, 2	2004-06-22
Transverse hybrid LOC package Grant 6,753,598 - Corisis June 22, 2	2004-06-22
Method for forming modular sockets using flexible interconnects and resulting structures Grant 6,751,859 - Farnworth , et al. June 22, 2	2004-06-22
Lead frame assemblies with voltage reference plane and IC packages including same Grant 6,747,344 - Corisis , et al. June 8, 2	2004-06-08
Stackable ceramic FBGA for high thermal applications App 20040104408 - Moden, Walter L. ; et al.	2004-06-03
Methods of packaging an integrated circuit Grant 6,743,658 - Corisis June 1, 2	2004-06-01
Packaged microelectronic devices and methods for assembling microelectronic devices Grant 6,740,546 - Corisis , et al. May 25, 2	2004-05-25
Stackable ball grid array package Grant 6,738,263 - Corisis , et al. May 18, 2	2004-05-18
Lead frame decoupling capacitor, semiconductor device packages including the same and methods Grant 6,717,257 - Corisis , et al. April 6, 2	2004-04-06
Packaged Microelectronic Devices And Methods For Assembling Microelectronic Devices App 20040038447 - Corisis, David J. ; et al.	2004-02-26
Bond pad rerouting element and stacked semiconductor device assemblies including the rerouting element App 20040036182 - Corisis, David J. ; et al.	2004-02-26
Stacked microelectronic dies and methods for stacking microelectronic dies App 20040038449 - Corisis, David J.	2004-02-26
Integrated circuit package electrical enhancement with improved lead frame design App 20040026774 - Corisis, David J. ; et al.	2004-02-12
Stackable ball grid array package Grant 6,670,702 - Corisis , et al. December 30, 2	2003-12-30
Stackable ceramic fbga for high thermal applications Grant 6,650,007 - Moden , et al. November 18, 2	2003-11-18
Locking assembly for securing semiconductor device to carrier substrate Grant 6,648,663 - Corisis , et al. November 18, 2	2003-11-18
High speed IC package configuration App 20030209786 - Corisis, David J. ; et al.	2003-11-13
Locking assembly for securing semiconductor device to carrier substrate App 20030211769 - Corisis, David J. ; et al.	2003-11-13
Semiconductor component with adjustment circuitry and method of fabrication App 20030207501 - Schoenfeld, Aaron M. ; et al.	2003-11-06
Multi-part lead frame with dissimilar materials App 20030205790 - Hinkle, S. Derek ; et al.	2003-11-06
Method and apparatus for forming modular sockets using flexible interconnects and resulting structures App 20030203678 - Farnworth, Warren M. ; et al.	2003-10-30
Packages for semiconductor die App 20030201526 - Bolken, Todd O. ; et al.	2003-10-30
Module assembly for stacked BGA packages App 20030197271 - Corisis, David J. ; et al.	2003-10-23
Multi-chip module and methods App 20030189257 - Corisis, David J. ; et al.	2003-10-09
Bond pad rerouting element, rerouted semiconductor devices including the rerouting element, stacked chip assemblies including the rerouted semiconductor devices, and methods App 20030189256 - Corisis, David J. ; et al.	2003-10-09
Apparatus for forming modular sockets using flexible interconnects and resulting structures App 20030190843 - Farnworth, Warren M. ; et al.	2003-10-09
Integrated circuit package electrical enhancement Grant 6,630,733 - Corisis , et al. October 7, 2	2003-10-07
Method and apparatus for forming modular sockets using flexible interconnects and resulting structures App 20030166356 - Farnworth, Warren M. ; et al.	2003-09-04
Methods for transverse hybrid LOC package App 20030162327 - Corisis, David j.	2003-08-28
Redundant pinout configuration for signal enhancement in IC packages App 20030141578 - Corisis, David J.	2003-07-31
Stacked mass storage flash memory package App 20030137042 - Mess, Leonard E. ; et al.	2003-07-24
Heat sink with alignment and retaining features App 20030128523 - Moden, Walter L. ; et al.	2003-07-10
Semiconductor package App 20030119224 - Corisis, David J.	2003-06-26
Tape under frame for lead frame IC package assembly App 20030107115 - Corisis, David J. ; et al.	2003-06-12
Tape under frame for lead frame IC package assembly App 20030102539 - Corisis, David J. ; et al.	2003-06-05
Packages for semiconductor die App 20030098514 - Bolken, Todd O. ; et al.	2003-05-29
Chip scale package with heat spreader and method of manufacture App 20030084566 - Corisis, David J.	2003-05-08
Chip scale package with heat spreader and method of manufacture App 20030080402 - Corisis, David J.	2003-05-01
Die paddle clamping method for wire bond enhancement App 20030071345 - Corisis, David J.	2003-04-17
Routing element for use in multichip modules, multichip modules including the routing element, and methods App 20030067060 - Corisis, David J. ; et al.	2003-04-10
Leads under chip in conventional IC package App 20030067059 - Corisis, David J.	2003-04-10
Methods of packaging an integrated circuit App 20030064542 - Corisis, David J.	2003-04-03
Lead frame decoupling capacitor, semiconductor device packages including the same and methods App 20030052402 - Corisis, David J. ; et al.	2003-03-20
Routing element for use in multi-chip modules, multi-chip modules including the routing element, and methods App 20030042585 - Corisis, David J. ; et al.	2003-03-06
Thermally enhanced high density semiconductor package App 20030030152 - Corisis, David J. ; et al.	2003-02-13
Lead frame decoupling capacitor, semiconductor device packages including the same and methods App 20030008433 - Corisis, David J. ; et al.	2003-01-09
IC package with dual heat spreaders App 20030000082 - Corisis, David J.	2003-01-02
Transverse hybrid LOC package App 20020195694 - Corisis, David J.	2002-12-26
Stacked mass storage flash memory package App 20020195697 - Mess, Leonard E. ; et al.	2002-12-26
Locking assembly for securing semiconductor device to carrier substrate App 20020197900 - Corisis, David J. ; et al.	2002-12-26
Method and apparatus for forming modular sockets using flexible interconnects and resulting structures App 20020189092 - Farnworth, Warren M. ; et al.	2002-12-19
Integrated circuit package electrical enhancement App 20020190372 - Corisis, David J. ; et al.	2002-12-19
Method and apparatus for forming modular sockets using flexible interconnects and resulting structures App 20020189093 - Farnworth, Warren M. ; et al.	2002-12-19
Stackable ball grid array package App 20020191383 - Corisis, David J. ; et al.	2002-12-19
Method of fabricating a redundant pinout configuration for signal enhancement in an IC package App 20020192873 - Corisis, David J.	2002-12-19
IC package with dual heat spreaders App 20020185727 - Corisis, David J.	2002-12-12
Thermally enhanced high density semiconductor package App 20020185729 - Corisis, David J. ; et al.	2002-12-12
Leads under chip in conventional IC package App 20020180008 - Corisis, David J.	2002-12-05
Method and apparatus for forming modular sockets using flexible interconnects and resulting structures App 20020142661 - Farnworth, Warren M. ; et al.	2002-10-03
Stackable ball grid array package App 20020135066 - Corisis, David J. ; et al.	2002-09-26
Semiconductor Card And Method Of Fabrication App 20020131251 - Corisis, David J. ; et al.	2002-09-19
Radiused leadframe App 20020132390 - Harrison, Ronnie M. ; et al.	2002-09-19
Module assembly for stacked BGA packages App 20020125571 - Corisis, David J. ; et al.	2002-09-12
Transverse hybrid LOC package App 20020115277 - Corisis, David J.	2002-08-22
Locking assembly for securing semiconductor device to carrier substrate App 20020111058 - Corisis, David J. ; et al.	2002-08-15
Lead frames including inner-digitized bond fingers on bus bars and semiconductor device package including same App 20020109212 - Corisis, David J.	2002-08-15
Tape under frame for conventional-type IC package assembly App 20020098624 - Corisis, David J. ; et al.	2002-07-25
Locking assembly for securing semiconductor device to carrier substrate App 20020081886 - Corisis, David J. ; et al.	2002-06-27