U.S. patent number D877,114 [Application Number D/631,227] was granted by the patent office on 2020-03-03 for headphone. This patent grant is currently assigned to Harman International Industries, Incorporated. The grantee listed for this patent is Harman International Industries, Incorporated. Invention is credited to Laurent Lindenberger.
United States Patent | D877,114 |
Lindenberger | March 3, 2020 |
Inventors: | Lindenberger; Laurent (Shenzhen, CN) | ||||||||||
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Applicant: |
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Assignee: | Harman International Industries,
Incorporated (Northridge, CA) |
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Appl. No.: | D/631,227 | ||||||||||
Filed: | December 28, 2017 |
Current U.S. Class: | D14/205 |
Current International Class: | 1401 |
Field of Search: | ;D14/203.1,204-206,208-210,212,213,214-217,219,221,222,223-225,249,372,433,138R,182,188,191-194,172,496 ;D29/112 ;D12/195,192,204 ;D2/875 ;D24/173-175,106 ;D3/294,273 ;D13/108 |
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