Headphone

Lindenberger

Patent Grant D877114

U.S. patent number D877,114 [Application Number D/631,227] was granted by the patent office on 2020-03-03 for headphone. This patent grant is currently assigned to Harman International Industries, Incorporated. The grantee listed for this patent is Harman International Industries, Incorporated. Invention is credited to Laurent Lindenberger.


United States Patent D877,114
Lindenberger March 3, 2020

Headphone

Claims

CLAIM The ornamental design for a headphone, as shown and described.
Inventors: Lindenberger; Laurent (Shenzhen, CN)
Applicant:
Name City State Country Type

Harman International Industries, Incorporated

Northridge

CA

US
Assignee: Harman International Industries, Incorporated (Northridge, CA)
Appl. No.: D/631,227
Filed: December 28, 2017

Current U.S. Class: D14/205
Current International Class: 1401
Field of Search: ;D14/203.1,204-206,208-210,212,213,214-217,219,221,222,223-225,249,372,433,138R,182,188,191-194,172,496 ;D29/112 ;D12/195,192,204 ;D2/875 ;D24/173-175,106 ;D3/294,273 ;D13/108

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Other References

ATH-MSR7SE, no. date available [online], [retrieved Apr. 8, 2019], Available from Internet, URL: <http://eu.audio-technica.com/ATH-MSR7SE cited by examiner .
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Primary Examiner: Fox; Barbara
Assistant Examiner: Ramirez; Mary Claire
Attorney, Agent or Firm: Plumsea Law Group, LLC

Description



FIG. 1 is a perspective view of a headphone showing the new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is an exterior side elevational view thereof;

FIG. 5 is a bottom view thereof;

FIG. 6 is a top view thereof; and,

FIG. 7 is an interior side elevational view thereof, viewed from line 7-7 in FIG. 6.

The claim encompasses the mirror image embodiment thereof.

The broken lines shown in the drawings depict portions of the headphone that form no part of the claimed design.

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References

Patent Diagrams and Documents

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