Headphone

Description

FIG. 1 is a perspective view of a headphone showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

Claims

CLAIM The ornamental design for a headphone, as shown.

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Inventors:	Densho; Keiko (Tokyo, JP), Hosoda; Yasuhide (Tokyo, JP)
Assignee:	Sony Corporation (Tokyo, JP)
Appl. No.:	D/300,395
Filed:	March 21, 2008

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Foreign Application Priority Data

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Sep 25, 2007 [JP]			D2007-025828

Current U.S. Class:	D14/205
Current International Class:	1401
Field of Search:	;D14/205,206,223,192,188 ;181/129,130 ;379/430,431,433 ;381/380,381,370,375,376,377,378,379 ;D29/112 ;2/209 ;128/867

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References Cited [Referenced By]

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U.S. Patent Documents

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Primary Examiner: Greene; Paula
Attorney, Agent or Firm: Rader, Fishman & Grauer, PLLC