U.S. patent number D758,337 [Application Number D/505,048] was granted by the patent office on 2016-06-07 for headphones.
This patent grant is currently assigned to Idea Village Products Corp.. The grantee listed for this patent is Aaron Szymanski. Invention is credited to Aaron Szymanski.
United States Patent |
D758,337 |
Szymanski |
June 7, 2016 |
Headphones
Claims
CLAIM The ornamental design for headphones, as shown and described.
Inventors: |
Szymanski; Aaron (Thomaston,
CT) |
Applicant: |
Name |
City |
State |
Country |
Type |
Szymanski; Aaron |
Thomaston |
CT |
US |
|
|
Assignee: |
Idea Village Products Corp.
(Wayne, NJ)
|
Appl.
No.: |
D/505,048 |
Filed: |
May 11, 2015 |
Current U.S.
Class: |
D14/205 |
Current International
Class: |
1401 |
Field of
Search: |
;D14/205,249
;D29/112,122 ;2/209 ;181/129,130,135,131-134
;381/380,381,370,377,378,385,183,187 ;455/90.3,575.1 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Greene; Paula
Attorney, Agent or Firm: De La Rosa; Dan
Description
FIG. 1 is a front perspective view of the headphones of the present
invention showing my new design;
FIG. 2 is a front side elevational view thereof;
FIG. 3 is a back side elevational view thereof;
FIG. 4 is a side elevational view thereof;
FIG. 5 is another side elevational view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof;
FIG. 8 is perspective view of FIG. 1 in a folded position;
FIG. 9 is a front side view of FIG. 2 in a folded position;
FIG. 10 is a top plan view of FIG. 6 in a folded position; and,
FIG. 11 is a bottom plan view of FIG. 7 in a folded position.
The broken lines form no part of the claimed design.
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