Headphone
Lee June 12, 2
U.S. patent number D544,464 [Application Number D/247,440] was granted by the patent office on 2007-06-12 for headphone. This patent grant is currently assigned to Koninklijke Philips Electronics N.V.. Invention is credited to Wai Chung David Lee.
| United States Patent | D544,464 |
| Lee | June 12, 2007 |
Headphone
Claims
CLAIM The ornamental design for a headphone, as shown.
| Inventors: | Lee; Wai Chung David (Hong Kong, HK) |
|---|---|
| Assignee: | Koninklijke Philips Electronics
N.V. (Eindhoven, NL) |
| Appl. No.: | D/247,440 |
| Filed: | June 19, 2006 |
Foreign Application Priority Data
| Dec 21, 2005 [EM] | 000455887-0004 | |||
| Current U.S. Class: | D14/205 |
| Current International Class: | 1401 |
| Field of Search: | ;D14/188,192,205-206,223 ;D29/112,122 ;2/209 ;181/129-130 ;381/379-382 ;379/430-431 |
References Cited [Referenced By]
U.S. Patent Documents
| 4689822 | August 1987 | Houng |
| D300133 | March 1989 | Daidoh et al. |
| D305541 | January 1990 | Hirose |
| D313092 | December 1990 | Nilsson |
| D328074 | July 1992 | Yamazaki et al. |
| 5809573 | September 1998 | Bary |
| D502938 | March 2005 | Tokioka et al. |
| D512983 | December 2005 | Tachikawa |
| D525235 | July 2006 | Koizumi |
| D534155 | December 2006 | Obata |
| D534156 | December 2006 | Obata |
Description
FIG. 1 is a perspective view showing my design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a right side elevational view thereof;
FIG. 5 is a left side elevational view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
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