Headphone

Description

FIG. 1 is a front elevational view of a headphone showing my new design;

FIG. 2 is a rear elevational view thereof;

FIG. 3 is a left side view thereof;

FIG. 4 is a right side view thereof;

FIG. 5 is a top plan view thereof;

FIG. 6 is a bottom plan view thereof;

FIG. 7 is a perspective view thereof in a folded position; and,

FIG. 8 is another perspective thereof, the opposite interior surface of the ear cup is a mirror image.

Claims

CLAIM The ornamental design for a headphone, as shown and described.

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Inventors:	Leung; Chun Fai (Kowloon, HK)
Assignee:	P.S.L. Limited (Kowloon, HK)
Appl. No.:	D/394,138
Filed:	June 14, 2011

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Foreign Application Priority Data

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Dec 16, 2010 [HK]			1002390

Current U.S. Class:	D14/205
Current International Class:	1401
Field of Search:	;D14/205,206,223 ;181/129,130 ;379/430,431 ;381/370,380,381,371,374,376,377,378,383,384 ;D29/112 ;2/209 ;455/90.3,575.1 ;128/866,867 ;242/379,378.1,400.1

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References Cited [Referenced By]

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U.S. Patent Documents

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D652406	January 2012	Lee et al.

Primary Examiner: Greene; Paula