U.S. patent number D864,897 [Application Number D/643,428] was granted by the patent office on 2019-10-29 for wireless headset.
This patent grant is currently assigned to SHENZHEN 3NOD ACOUSTICLINK CO., LTD. The grantee listed for this patent is Shenzhen 3nod Acousticlink Co., Ltd. Invention is credited to Shoutian Qin, Manzu Wang, Wanquan Zhou.
![](/patent/grant/D0864897/USD0864897-20191029-D00000.png)
![](/patent/grant/D0864897/USD0864897-20191029-D00001.png)
![](/patent/grant/D0864897/USD0864897-20191029-D00002.png)
![](/patent/grant/D0864897/USD0864897-20191029-D00003.png)
![](/patent/grant/D0864897/USD0864897-20191029-D00004.png)
![](/patent/grant/D0864897/USD0864897-20191029-D00005.png)
![](/patent/grant/D0864897/USD0864897-20191029-D00006.png)
![](/patent/grant/D0864897/USD0864897-20191029-D00007.png)
![](/patent/grant/D0864897/USD0864897-20191029-D00008.png)
![](/patent/grant/D0864897/USD0864897-20191029-D00009.png)
United States Patent |
D864,897 |
Qin , et al. |
October 29, 2019 |
Wireless headset
Claims
CLAIM The ornamental design for a wireless headset, as shown and
described.
Inventors: |
Qin; Shoutian (Shenzhen,
CN), Wang; Manzu (Shenzhen, CN), Zhou;
Wanquan (Shenzhen, CN) |
Applicant: |
Name |
City |
State |
Country |
Type |
Shenzhen 3nod Acousticlink Co., Ltd |
Shenzhen |
N/A |
CN |
|
|
Assignee: |
SHENZHEN 3NOD ACOUSTICLINK CO.,
LTD (Shenzhen, CN)
|
Appl.
No.: |
D/643,428 |
Filed: |
April 9, 2018 |
Foreign Application Priority Data
|
|
|
|
|
Oct 16, 2017 [CN] |
|
|
2017 3 0491069 |
|
Current U.S.
Class: |
D14/205 |
Current International
Class: |
1401 |
Field of
Search: |
;D14/205,188,192
;D29/112 ;2/209 ;181/129,130,135 ;379/430,431 ;381/380,381,374
;455/90.3,575.1,569.1 |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
|
|
|
|
|
|
|
304992470 |
|
Jan 2019 |
|
CN |
|
305053606 |
|
Mar 2019 |
|
CN |
|
Primary Examiner: Greene; Paula Allen
Attorney, Agent or Firm: Xia, Esq.; Tim Tingkang Locke Lord
LLP
Description
FIG. 1 is a front perspective view of a wireless headset according
to our new design;
FIG. 2 is a front perspective view thereof from another angle;
FIG. 3 is a front elevation view thereof;
FIG. 4 is a rear elevation view thereof;
FIG. 5 is a left side elevation view thereof;
FIG. 6 is a right side elevation view thereof;
FIG. 7 is a top plain view thereof;
FIG. 8 is a bottom plain view thereof; and,
FIG. 9 is a perspective operational view thereof.
The broken lines illustrating portions of the wireless headset
and/or environmental structures of the wireless headset form no
part of the claimed design.
* * * * *