U.S. patent number D837,763 [Application Number D/597,218] was granted by the patent office on 2019-01-08 for headphones.
This patent grant is currently assigned to Onkyo Corporation. The grantee listed for this patent is Onkyo Corporation. Invention is credited to Tomohisa Suzuki.
![](/patent/grant/D0837763/USD0837763-20190108-D00000.png)
![](/patent/grant/D0837763/USD0837763-20190108-D00001.png)
![](/patent/grant/D0837763/USD0837763-20190108-D00002.png)
![](/patent/grant/D0837763/USD0837763-20190108-D00003.png)
![](/patent/grant/D0837763/USD0837763-20190108-D00004.png)
![](/patent/grant/D0837763/USD0837763-20190108-D00005.png)
![](/patent/grant/D0837763/USD0837763-20190108-D00006.png)
![](/patent/grant/D0837763/USD0837763-20190108-D00007.png)
![](/patent/grant/D0837763/USD0837763-20190108-D00008.png)
![](/patent/grant/D0837763/USD0837763-20190108-D00009.png)
![](/patent/grant/D0837763/USD0837763-20190108-D00010.png)
View All Diagrams
United States Patent |
D837,763 |
Suzuki |
January 8, 2019 |
Headphones
Claims
CLAIM The ornamental design for headphones, as shown and described.
Inventors: |
Suzuki; Tomohisa (Tottori,
JP) |
Applicant: |
Name |
City |
State |
Country |
Type |
Onkyo Corporation |
Osaka |
N/A |
JP |
|
|
Assignee: |
Onkyo Corporation (Osaka,
JP)
|
Appl.
No.: |
D/597,218 |
Filed: |
March 15, 2017 |
Current U.S.
Class: |
D14/205 |
Current International
Class: |
1401 |
Field of
Search: |
;D14/205,223
;181/129,130,135 ;379/430,431 ;381/380,381,374
;455/90.3,575.1,569.1 ;D29/112 ;2/209 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Greene; Paula Allen
Attorney, Agent or Firm: Renner, Otto, Boisselle and Sklar,
LLP
Description
FIG. 1 is a top, front, right perspective view of a first
embodiment of headphones showing my new design;
FIG. 2 is a front elevation view thereof;
FIG. 3 is a rear elevation view thereof;
FIG. 4 is a top plan view thereof;
FIG. 5 is a bottom plan view thereof;
FIG. 6 is a left side elevation view thereof;
FIG. 7 is a right side elevation view thereof;
FIG. 8 is a top, front, right perspective view of a second
embodiment of headphones showing my new design;
FIG. 9 is a front elevation view thereof;
FIG. 10 is a rear elevation view thereof;
FIG. 11 is a top plan view thereof;
FIG. 12 is a bottom plan view thereof;
FIG. 13 is a left side elevation view thereof; and,
FIG. 14 is a right side elevation view thereof.
The broken lines depict portions of the headphones that form no
part of the claimed design.
* * * * *