U.S. patent number D826,895 [Application Number D/599,439] was granted by the patent office on 2018-08-28 for headphones.
This patent grant is currently assigned to Logitech Europe S.A.. The grantee listed for this patent is Logitech Europe S.A.. Invention is credited to Michael Nolan, Cormac O'Conaire, Jimmy Rennick, Doug Sharp.
United States Patent |
D826,895 |
Sharp , et al. |
August 28, 2018 |
Headphones
Claims
CLAIM The ornamental design for headphones, as shown and described.
Inventors: |
Sharp; Doug (Newark, CA),
Nolan; Michael (Thomastown, IE), Rennick; Jimmy
(Dublin, IE), O'Conaire; Cormac (Dublin,
IE) |
Applicant: |
Name |
City |
State |
Country |
Type |
Logitech Europe S.A. |
Lausanne |
N/A |
CH |
|
|
Assignee: |
Logitech Europe S.A. (Lausanne,
CH)
|
Appl.
No.: |
D/599,439 |
Filed: |
April 3, 2017 |
Current U.S.
Class: |
D14/205 |
Current International
Class: |
1401 |
Field of
Search: |
;D14/205,223 ;D29/112
;2/209,423,411 ;181/129,130,135 ;379/430,431,452
;381/380,381,186,371 ;455/90.3,575.1,569.1 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Greene; Paula Allen
Attorney, Agent or Firm: Kilpatrick Townsend & Stockton
LLP
Description
FIG. 1 is a perspective view of headphones showing our new
design;
FIG. 2 is a top plan view thereof;
FIG. 3 is a bottom plan view thereof,
FIG. 4 is a front elevational view thereof;
FIG. 5 is a rear elevational view thereof;
FIG. 6 is a left side elevational view thereof; and
FIG. 7 is a right side elevational view.
FIG. 8 is a perspective view of both of the ear cups in an
uncovered configuration for headphones showing our new design;
FIG. 9 is second perspective view thereof;
FIG. 10 is a third perspective view thereof;
FIG. 11 is a top plan view thereof;
FIG. 12 is a bottom plan view thereof,
FIG. 13 is a front elevational view thereof;
FIG. 14 is a rear elevational view thereof;
FIG. 15 is a left side elevational view thereof; and
FIG. 16 is a right side elevational view.
FIG. 17 is a perspective view of both of the ear cups in a covered
configuration for headphones showing our new design;
FIG. 18 is second perspective view thereof;
FIG. 19 is a third perspective view thereof;
FIG. 20 is a top plan view thereof;
FIG. 21 is a bottom plan view thereof,
FIG. 22 is a front elevational view thereof;
FIG. 23 is a rear elevational view thereof;
FIG. 24 is a left side elevational view thereof; and,
FIG. 25 is a right side elevational view.
The broken lines shown in the figures form no part of the claimed
design.
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