Headphone combined with microphone

Description

FIG. 1 is a perspective view of a first embodiment of the headphone combined with a microphone showing my new design;

FIG. 2 is a top plan view thereof;

FIG. 3 is a front elevational view thereof;

FIG. 4 is a rear elevational view thereof;

FIG. 5 is a bottom plan view thereof;

FIG. 6 is a left side elevational view thereof;

FIG. 7 is a right side elevational view thereof;

FIG. 8 is a perspective view of a second embodiment of FIG. 1;

FIG. 9 is a top plan view thereof shown in FIG. 8;

FIG. 10 is a front elevational view thereof shown in FIG. 8;

FIG. 11 is a rear elevational view thereof shown in FIG. 8;

FIG. 12 is a bottom plan view thereof shown in FIG. 8;

FIG. 13 is a left side elevational view thereof shown in FIG. 8; and,

FIG. 14 is a right side elevational view thereof shown in FIG. 8.

Claims

The ornamental design for a headphone combined with a microphone, as shown and described.

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Inventors:	Hayashi; Haruo (Tokyo, JP)
Assignee:	Sony Corporation (Tokyo, JP)
Appl. No.:	D/043,819
Filed:	September 13, 1995

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Current U.S. Class:	D14/206; D14/205
Field of Search:	;D14/137-138,147-148,192,205-206,223,249 ;181/129,130,137 ;379/430,431,444 ;381/25,68,74,151,158,183,187

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References Cited [Referenced By]

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U.S. Patent Documents

D254183	February 1980	Doodson
D353818	December 1994	Nakamura
3087028	April 1963	Bonnin

Foreign Patent Documents

	4019529		Jan 1991		DE

Other References

Hong Kong Enterprise Jun. 1991, p. 130, Headphone model No. SW 1100..

Primary Examiner: Morris; Sandra L.
Assistant Examiner: Bondade; Nanda
Attorney, Agent or Firm: Foley & Lardner