Semiconductor device

Description

FIG. 1 is a front, bottom and right side perspective view of a semiconductor device showing our new design;

FIG. 2 is a rear, top and left side perspective view thereof;

FIG. 3 is a front view thereof;

FIG. 4 is a rear view thereof;

FIG. 5 is a top view thereof;

FIG. 6 is a bottom view thereof;

FIG. 7 is a left side view thereof; and,

FIG. 8 is a right side view thereof.

The broken lines illustrate portions of the semiconductor device that form no part of the claimed designs.

Claims

CLAIM The ornamental design for a semiconductor device, as shown and described.

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Inventors:	Yokoyama; Shuhei (Tokyo, JP), Hasegawa; Maki (Tokyo, JP), Mori; Shigeru (Tokyo, JP)
Applicant:	Name City State Country Type Mitsubishi Electric Corporation Tokyo N/A JP
Assignee:	Mitsubishi Electric Corporation (Tokyo, JP)
Appl. No.:	D/685,061
Filed:	March 26, 2019

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Related U.S. Patent Documents

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	Application Number	Filing Date	Patent Number	Issue Date
	29643229	Apr 5, 2018

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Foreign Application Priority Data

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Oct 26, 2017 [JP]			2017-023790
Oct 26, 2017 [JP]			2017-023791

Current U.S. Class:	D13/182
Current International Class:	1303
Field of Search:	;D13/182

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References Cited [Referenced By]

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U.S. Patent Documents

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Primary Examiner: Oswecki; Elizabeth J
Attorney, Agent or Firm: Studebaker & Brackett PC

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