U.S. patent number D858,469 [Application Number D/641,930] was granted by the patent office on 2019-09-03 for chemical vapor deposition wafer carrier with thermal cover. This patent grant is currently assigned to Veeco Instruments Inc.. The grantee listed for this patent is Veeco Instruments Inc.. Invention is credited to Leo Chin, Mandar Deshpande, Alexander Gurary, Sandeep Krishnan, Yuliy Rashkovsky.
United States Patent | D858,469 |
Krishnan , et al. | September 3, 2019 |
Inventors: | Krishnan; Sandeep (Jersey City, NJ), Rashkovsky; Yuliy (Millburn, NJ), Gurary; Alexander (Bridgewater, NJ), Chin; Leo (Poughquag, NY), Deshpande; Mandar (Bridgewater, NJ) | ||||||||||
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Applicant: |
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Assignee: | Veeco Instruments Inc.
(Plainview, NY) |
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Appl. No.: | D/641,930 | ||||||||||
Filed: | March 26, 2018 |
Current U.S. Class: | D13/182 |
Current International Class: | 1303 |
Field of Search: | ;D13/182 ;D15/144,144.1,144.2 ;D23/323,328,335,336,337,341,352,357,385,386,397,399,400,406,411,413,499 |
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